FR1239346A - Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé - Google Patents

Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé

Info

Publication number
FR1239346A
FR1239346A FR797187A FR797187A FR1239346A FR 1239346 A FR1239346 A FR 1239346A FR 797187 A FR797187 A FR 797187A FR 797187 A FR797187 A FR 797187A FR 1239346 A FR1239346 A FR 1239346A
Authority
FR
France
Prior art keywords
casings
produced according
junction transistor
closing junction
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR797187A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Priority to FR797187A priority Critical patent/FR1239346A/fr
Priority to GB2050860A priority patent/GB943092A/en
Application granted granted Critical
Publication of FR1239346A publication Critical patent/FR1239346A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FR797187A 1959-06-11 1959-06-11 Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé Expired FR1239346A (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR797187A FR1239346A (fr) 1959-06-11 1959-06-11 Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé
GB2050860A GB943092A (en) 1959-06-11 1960-06-10 Process for closing a transistor casing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR797187A FR1239346A (fr) 1959-06-11 1959-06-11 Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé

Publications (1)

Publication Number Publication Date
FR1239346A true FR1239346A (fr) 1960-08-26

Family

ID=8715877

Family Applications (1)

Application Number Title Priority Date Filing Date
FR797187A Expired FR1239346A (fr) 1959-06-11 1959-06-11 Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé

Country Status (2)

Country Link
FR (1) FR1239346A (fr)
GB (1) GB943092A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784726A (en) * 1971-05-20 1974-01-08 Hewlett Packard Co Microcircuit package assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784726A (en) * 1971-05-20 1974-01-08 Hewlett Packard Co Microcircuit package assembly

Also Published As

Publication number Publication date
GB943092A (en) 1963-11-27

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