DE2209993C3 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE2209993C3 DE2209993C3 DE2209993A DE2209993A DE2209993C3 DE 2209993 C3 DE2209993 C3 DE 2209993C3 DE 2209993 A DE2209993 A DE 2209993A DE 2209993 A DE2209993 A DE 2209993A DE 2209993 C3 DE2209993 C3 DE 2209993C3
- Authority
- DE
- Germany
- Prior art keywords
- cooling channel
- semiconductor
- cooling
- contact
- bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000001816 cooling Methods 0.000 claims description 26
- 230000004308 accommodation Effects 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE795939D BE795939A (fr) | 1972-03-02 | Montage de semi-conducteurs | |
| DE2209993A DE2209993C3 (de) | 1972-03-02 | 1972-03-02 | Halbleiteranordnung |
| CH231873A CH548111A (de) | 1972-03-02 | 1973-02-16 | Halbleiteranordnung. |
| JP2474673A JPS5327816B2 (enrdf_load_stackoverflow) | 1972-03-02 | 1973-03-01 | |
| FR7307329A FR2174237B1 (enrdf_load_stackoverflow) | 1972-03-02 | 1973-03-01 | |
| GB1009273A GB1364832A (en) | 1972-03-02 | 1973-03-01 | Semiconductor arrangement |
| US47480174 US3893162A (en) | 1972-03-02 | 1974-05-30 | Resilient tubular member for holding a semiconductor device together under pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2209993A DE2209993C3 (de) | 1972-03-02 | 1972-03-02 | Halbleiteranordnung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2209993A1 DE2209993A1 (de) | 1973-09-13 |
| DE2209993B2 DE2209993B2 (de) | 1974-06-12 |
| DE2209993C3 true DE2209993C3 (de) | 1975-01-30 |
Family
ID=5837659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2209993A Expired DE2209993C3 (de) | 1972-03-02 | 1972-03-02 | Halbleiteranordnung |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5327816B2 (enrdf_load_stackoverflow) |
| BE (1) | BE795939A (enrdf_load_stackoverflow) |
| CH (1) | CH548111A (enrdf_load_stackoverflow) |
| DE (1) | DE2209993C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2174237B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1364832A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2402606C2 (de) * | 1974-01-21 | 1982-08-19 | Brown, Boveri & Cie Ag, 6800 Mannheim | Flüssigkeitskühleinrichtung für scheibenförmige Halbleiterelemente |
| JPS5623891Y2 (enrdf_load_stackoverflow) * | 1975-09-08 | 1981-06-04 | ||
| JPS61208655A (ja) * | 1985-03-13 | 1986-09-17 | Pioneer Electronic Corp | 磁気記録再生装置 |
-
0
- BE BE795939D patent/BE795939A/xx unknown
-
1972
- 1972-03-02 DE DE2209993A patent/DE2209993C3/de not_active Expired
-
1973
- 1973-02-16 CH CH231873A patent/CH548111A/xx not_active IP Right Cessation
- 1973-03-01 JP JP2474673A patent/JPS5327816B2/ja not_active Expired
- 1973-03-01 FR FR7307329A patent/FR2174237B1/fr not_active Expired
- 1973-03-01 GB GB1009273A patent/GB1364832A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5327816B2 (enrdf_load_stackoverflow) | 1978-08-10 |
| JPS48100618A (enrdf_load_stackoverflow) | 1973-12-19 |
| CH548111A (de) | 1974-04-11 |
| BE795939A (fr) | 1973-06-18 |
| FR2174237A1 (enrdf_load_stackoverflow) | 1973-10-12 |
| DE2209993A1 (de) | 1973-09-13 |
| DE2209993B2 (de) | 1974-06-12 |
| FR2174237B1 (enrdf_load_stackoverflow) | 1977-08-12 |
| GB1364832A (en) | 1974-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EHJ | Ceased/non-payment of the annual fee |