JPS5327816B2 - - Google Patents

Info

Publication number
JPS5327816B2
JPS5327816B2 JP2474673A JP2474673A JPS5327816B2 JP S5327816 B2 JPS5327816 B2 JP S5327816B2 JP 2474673 A JP2474673 A JP 2474673A JP 2474673 A JP2474673 A JP 2474673A JP S5327816 B2 JPS5327816 B2 JP S5327816B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2474673A
Other languages
Japanese (ja)
Other versions
JPS48100618A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS48100618A publication Critical patent/JPS48100618A/ja
Publication of JPS5327816B2 publication Critical patent/JPS5327816B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP2474673A 1972-03-02 1973-03-01 Expired JPS5327816B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2209993A DE2209993C3 (de) 1972-03-02 1972-03-02 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
JPS48100618A JPS48100618A (enrdf_load_stackoverflow) 1973-12-19
JPS5327816B2 true JPS5327816B2 (enrdf_load_stackoverflow) 1978-08-10

Family

ID=5837659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2474673A Expired JPS5327816B2 (enrdf_load_stackoverflow) 1972-03-02 1973-03-01

Country Status (6)

Country Link
JP (1) JPS5327816B2 (enrdf_load_stackoverflow)
BE (1) BE795939A (enrdf_load_stackoverflow)
CH (1) CH548111A (enrdf_load_stackoverflow)
DE (1) DE2209993C3 (enrdf_load_stackoverflow)
FR (1) FR2174237B1 (enrdf_load_stackoverflow)
GB (1) GB1364832A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208655A (ja) * 1985-03-13 1986-09-17 Pioneer Electronic Corp 磁気記録再生装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2402606C2 (de) * 1974-01-21 1982-08-19 Brown, Boveri & Cie Ag, 6800 Mannheim Flüssigkeitskühleinrichtung für scheibenförmige Halbleiterelemente
JPS5623891Y2 (enrdf_load_stackoverflow) * 1975-09-08 1981-06-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208655A (ja) * 1985-03-13 1986-09-17 Pioneer Electronic Corp 磁気記録再生装置

Also Published As

Publication number Publication date
JPS48100618A (enrdf_load_stackoverflow) 1973-12-19
CH548111A (de) 1974-04-11
BE795939A (fr) 1973-06-18
FR2174237A1 (enrdf_load_stackoverflow) 1973-10-12
DE2209993A1 (de) 1973-09-13
DE2209993B2 (de) 1974-06-12
DE2209993C3 (de) 1975-01-30
FR2174237B1 (enrdf_load_stackoverflow) 1977-08-12
GB1364832A (en) 1974-08-29

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