DE2164865A1 - Schaltungsaufbau und Verfahren zu seiner Herstellung - Google Patents

Schaltungsaufbau und Verfahren zu seiner Herstellung

Info

Publication number
DE2164865A1
DE2164865A1 DE19712164865 DE2164865A DE2164865A1 DE 2164865 A1 DE2164865 A1 DE 2164865A1 DE 19712164865 DE19712164865 DE 19712164865 DE 2164865 A DE2164865 A DE 2164865A DE 2164865 A1 DE2164865 A1 DE 2164865A1
Authority
DE
Germany
Prior art keywords
connection points
electrodes
components
circuit structure
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712164865
Other languages
German (de)
English (en)
Inventor
Inosuke Nirasaki Yamanashi Mochihara (Japan)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Sangyo Co Ltd
Original Assignee
Fuji Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Sangyo Co Ltd filed Critical Fuji Sangyo Co Ltd
Publication of DE2164865A1 publication Critical patent/DE2164865A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
DE19712164865 1970-12-31 1971-12-27 Schaltungsaufbau und Verfahren zu seiner Herstellung Pending DE2164865A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13460470 1970-12-31

Publications (1)

Publication Number Publication Date
DE2164865A1 true DE2164865A1 (de) 1972-07-20

Family

ID=15132272

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712164865 Pending DE2164865A1 (de) 1970-12-31 1971-12-27 Schaltungsaufbau und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
DE (1) DE2164865A1 (enExample)
FR (1) FR2121183A5 (enExample)
GB (1) GB1375997A (enExample)
NL (1) NL7117922A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2474270A1 (fr) * 1980-01-21 1981-07-24 Radiotechnique Compelec Procede et dispositif d'assemblage simultane de composants sur un support
WO1986005428A1 (fr) * 1985-03-20 1986-09-25 Ka We Electronic Gmbh & Co. Kg Agent thermoplastique, procede et dispositif de brasage
EP0250045A1 (en) * 1986-06-17 1987-12-23 E.I. Du Pont De Nemours And Company Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2474270A1 (fr) * 1980-01-21 1981-07-24 Radiotechnique Compelec Procede et dispositif d'assemblage simultane de composants sur un support
EP0032764B1 (fr) * 1980-01-21 1983-11-02 R.T.C. LA RADIOTECHNIQUE-COMPELEC Société anonyme dite: Procédé et dispositif d'assemblage simultané de composants sur un support
WO1986005428A1 (fr) * 1985-03-20 1986-09-25 Ka We Electronic Gmbh & Co. Kg Agent thermoplastique, procede et dispositif de brasage
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
EP0250045A1 (en) * 1986-06-17 1987-12-23 E.I. Du Pont De Nemours And Company Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces
US4843190A (en) * 1986-06-17 1989-06-27 E. I. Dupont De Nemours And Company Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate

Also Published As

Publication number Publication date
GB1375997A (enExample) 1974-12-04
NL7117922A (enExample) 1972-07-04
FR2121183A5 (enExample) 1972-08-18

Similar Documents

Publication Publication Date Title
DE69615038T2 (de) Verfahren zur oberflächenmontage eines kühlkörpers auf einer leiterplatte
DE69207520T2 (de) Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe
DE1952569A1 (de) Traeger fuer elektrische Bauteile und integrierte Schaltungen
EP0297236A2 (de) Leiterplatte
DE2937886C2 (enExample)
DE2451343C3 (de) Gedruckte Schaltung
DE60128537T2 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
DE2919058A1 (de) Elektronisches geraet mit mindestens einer leiterplatte
DE4416403A1 (de) Kühlvorrichtung für eine Leiterplatte und Verfahren zum Herstellen einer solchen Kühlvorrichtung
WO2006013145A1 (de) Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile
DE2411303A1 (de) Verfahren zur anordnung von komponenten an gedruckten dickfilm-schaltkreiselementen
DE2736056A1 (de) Elektrisches bauelement und verfahren zu seiner herstellung
DE1766688B1 (de) Anordnung mehrerer Plaettchen,welche integrierte Halbleiterschaltungen enthalten,auf einer gemeinsamen Isolatorplatte sowie Verfahren zur Herstellung der Anordnung
DE946302C (de) Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen aeusserst duennen Metallbelegungen elektrischer Kondensatoren und ihren drahtfoermigen Stromzufuehrungen
DE3115303A1 (de) "verfahren zum bestuecken von gedruckten leiterplatten mit drahtlosen miniaturbauelementen und mit solchen miniaturbauelementen bestueckte leiterplatte"
DE112017007766B4 (de) Halbleitereinrichtung
DE102019122611A1 (de) SMD-lötbares Bauelement und Verfahren zum Herstellen eines SMD-lötbaren Bauelements
DE69508134T2 (de) Verfahren zur Herstellung einer elektronischen Leistungsschaltung und nach diesem Verfahren erhaltene elektronische Schaltung
DE3428812A1 (de) Gedruckte schaltungsplatten und verfahren zu ihrer herstellung
DE2242393C2 (de) Verfahren zur Herstellung einer mehrschichtigen Schaltungsanordnung aus elektrisch isolierenden Schichten
DE202022106958U1 (de) Elektronische Baugruppe mit Abstandshalter für ein elektronisches Bauteil auf einem Substrat
DE102018112619A1 (de) Hochspannungsschaltung
DE8813093U1 (de) Leiterplatte
DE2616256A1 (de) Anordnung von elektronikbauteilen auf einer gedruckten schaltungsplatte, sowie das zugehoerige herstellungsverfahren
DE1261916B (de) Verfahren zur Herstellung einer Schaltung aus in Halbleiterkoerpern befindlichen integrierten Schaltungen