DE2152318A1 - Verfahren und Vorrichtung zum Polieren von Duennschichtelementen - Google Patents

Verfahren und Vorrichtung zum Polieren von Duennschichtelementen

Info

Publication number
DE2152318A1
DE2152318A1 DE19712152318 DE2152318A DE2152318A1 DE 2152318 A1 DE2152318 A1 DE 2152318A1 DE 19712152318 DE19712152318 DE 19712152318 DE 2152318 A DE2152318 A DE 2152318A DE 2152318 A1 DE2152318 A1 DE 2152318A1
Authority
DE
Germany
Prior art keywords
polishing
disk
plate
friction
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19712152318
Other languages
German (de)
English (en)
Inventor
Walsh Robert Jerome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of DE2152318A1 publication Critical patent/DE2152318A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE19712152318 1970-10-21 1971-10-20 Verfahren und Vorrichtung zum Polieren von Duennschichtelementen Withdrawn DE2152318A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8267370A 1970-10-21 1970-10-21

Publications (1)

Publication Number Publication Date
DE2152318A1 true DE2152318A1 (de) 1972-04-27

Family

ID=22172673

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712152318 Withdrawn DE2152318A1 (de) 1970-10-21 1971-10-20 Verfahren und Vorrichtung zum Polieren von Duennschichtelementen

Country Status (5)

Country Link
JP (1) JPS545160B1 (enExample)
BE (1) BE774209A (enExample)
DE (1) DE2152318A1 (enExample)
GB (1) GB1319882A (enExample)
NL (1) NL7114274A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren
EP0284343A3 (en) * 1987-03-23 1989-01-18 Westech Systems, Inc. Counterbalanced polishing apparatus counterbalanced polishing apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149373U (enExample) * 1981-03-16 1982-09-20
JPS5871593U (ja) * 1981-11-04 1983-05-14 三菱重工業株式会社 水冷型熱交換器
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
GB2298960B (en) * 1992-05-26 1997-01-08 Toshiba Kk Polishing apparatus and method for planarizing layer on a semiconductor wafer
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
GB9512262D0 (en) 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren
EP0284343A3 (en) * 1987-03-23 1989-01-18 Westech Systems, Inc. Counterbalanced polishing apparatus counterbalanced polishing apparatus

Also Published As

Publication number Publication date
BE774209A (fr) 1972-04-20
NL7114274A (enExample) 1972-04-25
GB1319882A (en) 1973-06-13
JPS545160B1 (enExample) 1979-03-14

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Legal Events

Date Code Title Description
OD Request for examination
8139 Disposal/non-payment of the annual fee