NL7114274A - - Google Patents
Info
- Publication number
- NL7114274A NL7114274A NL7114274A NL7114274A NL7114274A NL 7114274 A NL7114274 A NL 7114274A NL 7114274 A NL7114274 A NL 7114274A NL 7114274 A NL7114274 A NL 7114274A NL 7114274 A NL7114274 A NL 7114274A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8267370A | 1970-10-21 | 1970-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7114274A true NL7114274A (enExample) | 1972-04-25 |
Family
ID=22172673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7114274A NL7114274A (enExample) | 1970-10-21 | 1971-10-18 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS545160B1 (enExample) |
| BE (1) | BE774209A (enExample) |
| DE (1) | DE2152318A1 (enExample) |
| GB (1) | GB1319882A (enExample) |
| NL (1) | NL7114274A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5531582A (en) * | 1978-08-15 | 1980-03-05 | Ibm | Free polishing device |
| JPS57149373U (enExample) * | 1981-03-16 | 1982-09-20 | ||
| JPS5871593U (ja) * | 1981-11-04 | 1983-05-14 | 三菱重工業株式会社 | 水冷型熱交換器 |
| US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
| US5104828A (en) * | 1990-03-01 | 1992-04-14 | Intel Corporation | Method of planarizing a dielectric formed over a semiconductor substrate |
| GB2299895B (en) * | 1992-05-26 | 1997-01-08 | Toshiba Kk | polishing apparatus for planarizing layer on a semiconductor wafer |
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| GB9512262D0 (en) | 1995-06-16 | 1995-08-16 | Bingham Richard G | Tool for computer-controlled machine for optical polishing and figuring |
-
1971
- 1971-10-18 NL NL7114274A patent/NL7114274A/xx not_active Application Discontinuation
- 1971-10-20 BE BE774209A patent/BE774209A/xx unknown
- 1971-10-20 GB GB4880571A patent/GB1319882A/en not_active Expired
- 1971-10-20 DE DE19712152318 patent/DE2152318A1/de not_active Withdrawn
- 1971-10-20 JP JP8252171A patent/JPS545160B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| BE774209A (fr) | 1972-04-20 |
| JPS545160B1 (enExample) | 1979-03-14 |
| GB1319882A (en) | 1973-06-13 |
| DE2152318A1 (de) | 1972-04-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BC | A request for examination has been filed | ||
| BV | The patent application has lapsed |