DE2152318A1 - Verfahren und Vorrichtung zum Polieren von Duennschichtelementen - Google Patents
Verfahren und Vorrichtung zum Polieren von DuennschichtelementenInfo
- Publication number
- DE2152318A1 DE2152318A1 DE19712152318 DE2152318A DE2152318A1 DE 2152318 A1 DE2152318 A1 DE 2152318A1 DE 19712152318 DE19712152318 DE 19712152318 DE 2152318 A DE2152318 A DE 2152318A DE 2152318 A1 DE2152318 A1 DE 2152318A1
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- disk
- plate
- friction
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title claims description 127
- 238000000034 method Methods 0.000 title claims description 15
- 239000010409 thin film Substances 0.000 title description 3
- 239000000463 material Substances 0.000 claims description 34
- 230000003068 static effect Effects 0.000 claims description 17
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000006378 damage Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 229920005830 Polyurethane Foam Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000011496 polyurethane foam Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8267370A | 1970-10-21 | 1970-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2152318A1 true DE2152318A1 (de) | 1972-04-27 |
Family
ID=22172673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712152318 Withdrawn DE2152318A1 (de) | 1970-10-21 | 1971-10-20 | Verfahren und Vorrichtung zum Polieren von Duennschichtelementen |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS545160B1 (enrdf_load_stackoverflow) |
| BE (1) | BE774209A (enrdf_load_stackoverflow) |
| DE (1) | DE2152318A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1319882A (enrdf_load_stackoverflow) |
| NL (1) | NL7114274A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0008360A1 (de) * | 1978-08-15 | 1980-03-05 | International Business Machines Corporation | Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren |
| EP0284343A3 (en) * | 1987-03-23 | 1989-01-18 | Westech Systems, Inc. | Counterbalanced polishing apparatus counterbalanced polishing apparatus |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149373U (enrdf_load_stackoverflow) * | 1981-03-16 | 1982-09-20 | ||
| JPS5871593U (ja) * | 1981-11-04 | 1983-05-14 | 三菱重工業株式会社 | 水冷型熱交換器 |
| US5104828A (en) * | 1990-03-01 | 1992-04-14 | Intel Corporation | Method of planarizing a dielectric formed over a semiconductor substrate |
| GB2298960B (en) * | 1992-05-26 | 1997-01-08 | Toshiba Kk | Polishing apparatus and method for planarizing layer on a semiconductor wafer |
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| GB9512262D0 (en) | 1995-06-16 | 1995-08-16 | Bingham Richard G | Tool for computer-controlled machine for optical polishing and figuring |
-
1971
- 1971-10-18 NL NL7114274A patent/NL7114274A/xx not_active Application Discontinuation
- 1971-10-20 BE BE774209A patent/BE774209A/xx unknown
- 1971-10-20 DE DE19712152318 patent/DE2152318A1/de not_active Withdrawn
- 1971-10-20 JP JP8252171A patent/JPS545160B1/ja active Pending
- 1971-10-20 GB GB4880571A patent/GB1319882A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0008360A1 (de) * | 1978-08-15 | 1980-03-05 | International Business Machines Corporation | Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren |
| EP0284343A3 (en) * | 1987-03-23 | 1989-01-18 | Westech Systems, Inc. | Counterbalanced polishing apparatus counterbalanced polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1319882A (en) | 1973-06-13 |
| JPS545160B1 (enrdf_load_stackoverflow) | 1979-03-14 |
| NL7114274A (enrdf_load_stackoverflow) | 1972-04-25 |
| BE774209A (fr) | 1972-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| 8139 | Disposal/non-payment of the annual fee |