DE2146985A1 - Anordnung zur Herstellung von elektronischen Bauelementen - Google Patents

Anordnung zur Herstellung von elektronischen Bauelementen

Info

Publication number
DE2146985A1
DE2146985A1 DE19712146985 DE2146985A DE2146985A1 DE 2146985 A1 DE2146985 A1 DE 2146985A1 DE 19712146985 DE19712146985 DE 19712146985 DE 2146985 A DE2146985 A DE 2146985A DE 2146985 A1 DE2146985 A1 DE 2146985A1
Authority
DE
Germany
Prior art keywords
substrate
mask
arrangement according
housing
masks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712146985
Other languages
German (de)
English (en)
Inventor
Derrick J Export Raygor Paul O Irwin Pa Page (V St A ) C23f 1 00
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of DE2146985A1 publication Critical patent/DE2146985A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19712146985 1970-09-24 1971-09-21 Anordnung zur Herstellung von elektronischen Bauelementen Pending DE2146985A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7521770A 1970-09-24 1970-09-24

Publications (1)

Publication Number Publication Date
DE2146985A1 true DE2146985A1 (de) 1972-03-30

Family

ID=22124313

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712146985 Pending DE2146985A1 (de) 1970-09-24 1971-09-21 Anordnung zur Herstellung von elektronischen Bauelementen

Country Status (5)

Country Link
US (1) US3669060A (enExample)
JP (1) JPS5014996B1 (enExample)
DE (1) DE2146985A1 (enExample)
FR (1) FR2107928B1 (enExample)
GB (1) GB1358416A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096821A (en) * 1976-12-13 1978-06-27 Westinghouse Electric Corp. System for fabricating thin-film electronic components
US4777909A (en) * 1981-02-09 1988-10-18 Applied Magnetics Corporation Carriage apparatus for indexing and accurately registering a selected stabilized mask of a plurality of stabilizing masks between a substrate and a source
US4492180A (en) * 1981-03-16 1985-01-08 Applied Magnetics Corporation Apparatus for indexing and registering a selected deposition mask to a substrate and method therefor
US4633810A (en) * 1981-09-21 1987-01-06 Applied Magnetics Corp. Apparatus for accurately registering a first member and a second member in an interdependent relationship
US5736751A (en) * 1982-04-13 1998-04-07 Seiko Epson Corporation Field effect transistor having thick source and drain regions
FR2527385B1 (fr) * 1982-04-13 1987-05-22 Suwa Seikosha Kk Transistor a couche mince et panneau d'affichage a cristaux liquides utilisant ce type de transistor
US5698864A (en) * 1982-04-13 1997-12-16 Seiko Epson Corporation Method of manufacturing a liquid crystal device having field effect transistors
US6294796B1 (en) 1982-04-13 2001-09-25 Seiko Epson Corporation Thin film transistors and active matrices including same
GB2140460B (en) * 1983-05-27 1986-06-25 Dowty Electronics Ltd Insulated metal substrates
JPH068503B2 (ja) * 1987-03-31 1994-02-02 セントラル硝子株式会社 含フツ素樹脂被膜の形成方法
GB8726639D0 (en) * 1987-11-13 1987-12-16 Vg Instr Groups Ltd Vacuum evaporation & deposition
GB2272225B (en) * 1992-10-06 1996-07-17 Balzers Hochvakuum A method for masking a workpiece and a vacuum treatment facility
DE4235678C1 (de) * 1992-10-22 1994-05-26 Balzers Hochvakuum Verfahren zur Oberflächenbehandlung eines Werkstückes, und Vakuumbehandlungsanlage zur Durchführung des Verfahrens
US7019208B2 (en) * 2001-11-20 2006-03-28 Energy Photovoltaics Method of junction formation for CIGS photovoltaic devices
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
US7410919B2 (en) * 2003-06-27 2008-08-12 International Business Machines Corporation Mask and substrate alignment for solder bump process
NL1024215C2 (nl) * 2003-09-03 2005-03-07 Otb Group Bv Systeem en werkwijze voor het behandelen van substraten, alsmede een gebruik van een dergelijke systeem en een transportinrichting.
US20070137568A1 (en) * 2005-12-16 2007-06-21 Schreiber Brian E Reciprocating aperture mask system and method
US7763114B2 (en) * 2005-12-28 2010-07-27 3M Innovative Properties Company Rotatable aperture mask assembly and deposition system
US8628620B2 (en) * 2011-01-07 2014-01-14 Sharp Kabushiki Kaisha Vapor deposition device and vapor deposition method
GB2488568B (en) * 2011-03-02 2014-01-01 Rolls Royce Plc A method and apparatus for masking a portion of a component
CN104213074B (zh) * 2014-08-21 2016-06-29 宁波英飞迈材料科技有限公司 一种原位掩模转换装置及其使用方法

Also Published As

Publication number Publication date
FR2107928B1 (enExample) 1977-04-22
JPS5014996B1 (enExample) 1975-05-31
GB1358416A (en) 1974-07-03
FR2107928A1 (enExample) 1972-05-12
US3669060A (en) 1972-06-13

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OHA Expiration of time for request for examination