DE2143737A1 - Photoaetzverfahren - Google Patents
PhotoaetzverfahrenInfo
- Publication number
- DE2143737A1 DE2143737A1 DE19712143737 DE2143737A DE2143737A1 DE 2143737 A1 DE2143737 A1 DE 2143737A1 DE 19712143737 DE19712143737 DE 19712143737 DE 2143737 A DE2143737 A DE 2143737A DE 2143737 A1 DE2143737 A1 DE 2143737A1
- Authority
- DE
- Germany
- Prior art keywords
- partial
- exposure
- pattern
- photoresist
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001259 photo etching Methods 0.000 title claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 44
- 230000008569 process Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims 1
- 239000000344 soap Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 description 36
- 230000018109 developmental process Effects 0.000 description 13
- 238000005530 etching Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 230000000717 retained effect Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 3
- 230000012447 hatching Effects 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000014277 Clidemia hirta Nutrition 0.000 description 1
- 241000069219 Henriettea Species 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712143737 DE2143737A1 (de) | 1971-09-01 | 1971-09-01 | Photoaetzverfahren |
| IT2747972A IT963413B (it) | 1971-09-01 | 1972-07-27 | Procedimento di fotoincisione particolarmente per la fabbrica zione di circuiti integrati |
| JP8007972A JPS5133445B2 (enExample) | 1971-09-01 | 1972-08-11 | |
| FR7231319A FR2151130A1 (en) | 1971-09-01 | 1972-08-29 | Photo mask mfr - eliminating defects by successive partial exposures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712143737 DE2143737A1 (de) | 1971-09-01 | 1971-09-01 | Photoaetzverfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2143737A1 true DE2143737A1 (de) | 1973-03-08 |
Family
ID=5818349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712143737 Pending DE2143737A1 (de) | 1971-09-01 | 1971-09-01 | Photoaetzverfahren |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5133445B2 (enExample) |
| DE (1) | DE2143737A1 (enExample) |
| FR (1) | FR2151130A1 (enExample) |
| IT (1) | IT963413B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0030117B1 (en) * | 1979-11-28 | 1983-09-07 | Fujitsu Limited | Method of forming an opening in a negative resist film |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501805A (enExample) * | 1973-05-14 | 1975-01-09 | ||
| JPS5168772A (en) * | 1974-12-11 | 1976-06-14 | Matsushita Electronics Corp | Handotaisochino seizohoho |
| JPS5348676A (en) * | 1976-10-15 | 1978-05-02 | Handotai Kenkyu Shinkokai | Method of forming pattern |
| US4099062A (en) * | 1976-12-27 | 1978-07-04 | International Business Machines Corporation | Electron beam lithography process |
| DE2734580C2 (de) * | 1977-08-01 | 1979-02-15 | Hoechst Ag, 6000 Frankfurt | Verfahren zum Herstellen eines Originals eines Informationsträgers |
| JPS5429976A (en) * | 1977-08-10 | 1979-03-06 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| DE3013819A1 (de) * | 1980-04-10 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung gedruckter leiterplatten |
| JPS594017A (ja) * | 1982-06-30 | 1984-01-10 | Toshiba Corp | 電子ビ−ム露光方法 |
| US4456371A (en) * | 1982-06-30 | 1984-06-26 | International Business Machines Corporation | Optical projection printing threshold leveling arrangement |
| JPS59232418A (ja) * | 1983-06-15 | 1984-12-27 | Sumitomo Electric Ind Ltd | 微細パタ−ン形成法 |
| DE69031212T2 (de) * | 1990-03-23 | 1998-01-29 | Ushio Electric Inc | Randbelichtungsverfahren für Halbleiterscheiben |
-
1971
- 1971-09-01 DE DE19712143737 patent/DE2143737A1/de active Pending
-
1972
- 1972-07-27 IT IT2747972A patent/IT963413B/it active
- 1972-08-11 JP JP8007972A patent/JPS5133445B2/ja not_active Expired
- 1972-08-29 FR FR7231319A patent/FR2151130A1/fr active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0030117B1 (en) * | 1979-11-28 | 1983-09-07 | Fujitsu Limited | Method of forming an opening in a negative resist film |
| US4581316A (en) * | 1979-11-28 | 1986-04-08 | Fujitsu Limited | Method of forming resist patterns in negative photoresist layer using false pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| IT963413B (it) | 1974-01-10 |
| JPS5133445B2 (enExample) | 1976-09-20 |
| FR2151130A1 (en) | 1973-04-13 |
| JPS4833908A (enExample) | 1973-05-15 |
| FR2151130B1 (enExample) | 1974-08-19 |
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