DE2125748A1 - Verfahren und Vorrichtung zum Verschweißen eines Drahtes mittels einer Thermokompressionsverbindung - Google Patents

Verfahren und Vorrichtung zum Verschweißen eines Drahtes mittels einer Thermokompressionsverbindung

Info

Publication number
DE2125748A1
DE2125748A1 DE19712125748 DE2125748A DE2125748A1 DE 2125748 A1 DE2125748 A1 DE 2125748A1 DE 19712125748 DE19712125748 DE 19712125748 DE 2125748 A DE2125748 A DE 2125748A DE 2125748 A1 DE2125748 A1 DE 2125748A1
Authority
DE
Germany
Prior art keywords
wire
thermocompression
carrier
connection
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712125748
Other languages
German (de)
English (en)
Inventor
Jean Douvres la Delivrande; Brehon Pierre Epron; Schmidt (Frankreich)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2125748A1 publication Critical patent/DE2125748A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Wire Bonding (AREA)
DE19712125748 1970-06-19 1971-05-25 Verfahren und Vorrichtung zum Verschweißen eines Drahtes mittels einer Thermokompressionsverbindung Pending DE2125748A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7022666A FR2094394A5 (https=) 1970-06-19 1970-06-19

Publications (1)

Publication Number Publication Date
DE2125748A1 true DE2125748A1 (de) 1971-12-23

Family

ID=9057450

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712125748 Pending DE2125748A1 (de) 1970-06-19 1971-05-25 Verfahren und Vorrichtung zum Verschweißen eines Drahtes mittels einer Thermokompressionsverbindung

Country Status (6)

Country Link
CH (1) CH550632A (https=)
DE (1) DE2125748A1 (https=)
FR (1) FR2094394A5 (https=)
GB (1) GB1341259A (https=)
HK (1) HK57976A (https=)
NL (1) NL7108093A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4306282A1 (de) * 1993-03-01 1994-09-15 Emhart Inc Verfahren und Vorrichtung zum Verschweißen eines Einschweißteils in einer eine Metallplatte und eine darüberliegende Metallauflage umfassenden Schweißstelle

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2260096B (en) * 1991-08-31 1995-05-17 Hydro Marine Systems Limited A method of and apparatus for testing the integrity of a friction weld

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4306282A1 (de) * 1993-03-01 1994-09-15 Emhart Inc Verfahren und Vorrichtung zum Verschweißen eines Einschweißteils in einer eine Metallplatte und eine darüberliegende Metallauflage umfassenden Schweißstelle
EP0613747A3 (en) * 1993-03-01 1995-01-11 Emhart Inc Method and device for welding a workpiece.
US5486678A (en) * 1993-03-01 1996-01-23 Emhart Inc. Process of and machinery for joining two metal sheets by welding

Also Published As

Publication number Publication date
HK57976A (en) 1976-10-01
NL7108093A (https=) 1971-12-21
FR2094394A5 (https=) 1972-02-04
CH550632A (de) 1974-06-28
GB1341259A (en) 1973-12-19

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