DE2107225B1 - Abstandshalterung für Halbleiter-Bauelemente - Google Patents

Abstandshalterung für Halbleiter-Bauelemente

Info

Publication number
DE2107225B1
DE2107225B1 DE2107225A DE2107225DA DE2107225B1 DE 2107225 B1 DE2107225 B1 DE 2107225B1 DE 2107225 A DE2107225 A DE 2107225A DE 2107225D A DE2107225D A DE 2107225DA DE 2107225 B1 DE2107225 B1 DE 2107225B1
Authority
DE
Germany
Prior art keywords
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Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2107225A
Other languages
German (de)
English (en)
Inventor
Werner Dipl.-Ing. 5894 Halver Turck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KARL LUMBERG KG
Original Assignee
KARL LUMBERG KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KARL LUMBERG KG filed Critical KARL LUMBERG KG
Publication of DE2107225B1 publication Critical patent/DE2107225B1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10424Frame holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE2107225A 1971-02-16 1971-02-16 Abstandshalterung für Halbleiter-Bauelemente Pending DE2107225B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2107225 1971-02-16

Publications (1)

Publication Number Publication Date
DE2107225B1 true DE2107225B1 (de) 1972-05-25

Family

ID=5798859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2107225A Pending DE2107225B1 (de) 1971-02-16 1971-02-16 Abstandshalterung für Halbleiter-Bauelemente

Country Status (3)

Country Link
DE (1) DE2107225B1 (OSRAM)
FR (1) FR2125329B1 (OSRAM)
GB (1) GB1361304A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500252A1 (fr) * 1981-02-14 1982-08-20 Thomson Brandt Gmbh Support isolant pour elements semi-conducteurs a haute tension
FR2550684A1 (fr) * 1983-08-09 1985-02-15 Cepe Plot pour embase de composant et dispositif de maintien d'une dite embase le comprenant

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500252A1 (fr) * 1981-02-14 1982-08-20 Thomson Brandt Gmbh Support isolant pour elements semi-conducteurs a haute tension
FR2550684A1 (fr) * 1983-08-09 1985-02-15 Cepe Plot pour embase de composant et dispositif de maintien d'une dite embase le comprenant

Also Published As

Publication number Publication date
GB1361304A (en) 1974-07-24
FR2125329B1 (OSRAM) 1974-12-13
FR2125329A1 (OSRAM) 1972-09-29

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