DE2042023A1 - Vorrichtung zum Aufspruehen von Kathodenmaterial auf ein Werkstueck - Google Patents
Vorrichtung zum Aufspruehen von Kathodenmaterial auf ein WerkstueckInfo
- Publication number
- DE2042023A1 DE2042023A1 DE19702042023 DE2042023A DE2042023A1 DE 2042023 A1 DE2042023 A1 DE 2042023A1 DE 19702042023 DE19702042023 DE 19702042023 DE 2042023 A DE2042023 A DE 2042023A DE 2042023 A1 DE2042023 A1 DE 2042023A1
- Authority
- DE
- Germany
- Prior art keywords
- spray
- cathode
- workpiece
- anode
- concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010406 cathode material Substances 0.000 title claims description 9
- 238000005507 spraying Methods 0.000 title claims description 8
- 239000007921 spray Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 5
- 238000010849 ion bombardment Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3471—Introduction of auxiliary energy into the plasma
- C23C14/3478—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85676269A | 1969-09-10 | 1969-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2042023A1 true DE2042023A1 (de) | 1971-03-11 |
Family
ID=25324445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19702042023 Pending DE2042023A1 (de) | 1969-09-10 | 1970-08-25 | Vorrichtung zum Aufspruehen von Kathodenmaterial auf ein Werkstueck |
Country Status (5)
Country | Link |
---|---|
US (1) | US3669871A (enrdf_load_stackoverflow) |
JP (1) | JPS4817987B1 (enrdf_load_stackoverflow) |
DE (1) | DE2042023A1 (enrdf_load_stackoverflow) |
FR (1) | FR2060928A5 (enrdf_load_stackoverflow) |
GB (1) | GB1257766A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1985002866A1 (en) * | 1983-12-23 | 1985-07-04 | Ion Tech Limited | Sputter deposition |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4026787A (en) * | 1974-01-25 | 1977-05-31 | Coulter Information Systems, Inc. | Thin film deposition apparatus using segmented target means |
US3988232A (en) * | 1974-06-25 | 1976-10-26 | Matsushita Electric Industrial Co., Ltd. | Method of making crystal films |
US4096055A (en) * | 1976-12-29 | 1978-06-20 | Johnson Andrew G | Electron microscopy coating apparatus and methods |
JPS54144891U (enrdf_load_stackoverflow) * | 1978-03-31 | 1979-10-08 | ||
US4201654A (en) * | 1978-10-06 | 1980-05-06 | The United States Of America As Represented By The Secretary Of The Air Force | Anode assisted sputter etch and deposition apparatus |
US4597847A (en) * | 1984-10-09 | 1986-07-01 | Iodep, Inc. | Non-magnetic sputtering target |
US5215639A (en) * | 1984-10-09 | 1993-06-01 | Genus, Inc. | Composite sputtering target structures and process for producing such structures |
US4610774A (en) * | 1984-11-14 | 1986-09-09 | Hitachi, Ltd. | Target for sputtering |
US4957605A (en) * | 1989-04-17 | 1990-09-18 | Materials Research Corporation | Method and apparatus for sputter coating stepped wafers |
US6024843A (en) * | 1989-05-22 | 2000-02-15 | Novellus Systems, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
US5196400A (en) * | 1990-08-17 | 1993-03-23 | At&T Bell Laboratories | High temperature superconductor deposition by sputtering |
JPH06505304A (ja) * | 1991-01-28 | 1994-06-16 | マティリアルズ リサーチ コーポレイション | 陰極スパッタ用ターゲット |
CA2065581C (en) * | 1991-04-22 | 2002-03-12 | Andal Corp. | Plasma enhancement apparatus and method for physical vapor deposition |
US5556525A (en) * | 1994-09-30 | 1996-09-17 | Advanced Micro Devices, Inc. | PVD sputter system having nonplanar target configuration and methods for operating same |
US6042706A (en) * | 1997-01-14 | 2000-03-28 | Applied Materials, Inc. | Ionized PVD source to produce uniform low-particle deposition |
US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
US6217716B1 (en) | 1998-05-06 | 2001-04-17 | Novellus Systems, Inc. | Apparatus and method for improving target erosion in hollow cathode magnetron sputter source |
US6500321B1 (en) * | 1999-05-26 | 2002-12-31 | Novellus Systems, Inc. | Control of erosion profile and process characteristics in magnetron sputtering by geometrical shaping of the sputtering target |
US6277253B1 (en) * | 1999-10-06 | 2001-08-21 | Applied Materials, Inc. | External coating of tungsten or tantalum or other refractory metal on IMP coils |
US6699375B1 (en) | 2000-06-29 | 2004-03-02 | Applied Materials, Inc. | Method of extending process kit consumable recycling life |
US7820020B2 (en) * | 2005-02-03 | 2010-10-26 | Applied Materials, Inc. | Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas |
US8821701B2 (en) | 2010-06-02 | 2014-09-02 | Clifton Higdon | Ion beam sputter target and method of manufacture |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3250694A (en) * | 1962-10-17 | 1966-05-10 | Ibm | Apparatus for coating articles by cathode sputtering |
FR1502647A (enrdf_load_stackoverflow) * | 1965-12-17 | 1968-02-07 | ||
US3483114A (en) * | 1967-05-01 | 1969-12-09 | Victory Eng Corp | Rf sputtering apparatus including a wave reflector positioned behind the target |
-
1969
- 1969-09-10 US US856762A patent/US3669871A/en not_active Expired - Lifetime
-
1970
- 1970-08-10 FR FR7032131A patent/FR2060928A5/fr not_active Expired
- 1970-08-12 GB GB1257766D patent/GB1257766A/en not_active Expired
- 1970-08-21 JP JP45072864A patent/JPS4817987B1/ja active Pending
- 1970-08-25 DE DE19702042023 patent/DE2042023A1/de active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1985002866A1 (en) * | 1983-12-23 | 1985-07-04 | Ion Tech Limited | Sputter deposition |
Also Published As
Publication number | Publication date |
---|---|
US3669871A (en) | 1972-06-13 |
JPS4817987B1 (enrdf_load_stackoverflow) | 1973-06-02 |
FR2060928A5 (enrdf_load_stackoverflow) | 1971-06-18 |
GB1257766A (enrdf_load_stackoverflow) | 1971-12-22 |
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