DE202013102632U1 - Sensorbaustein - Google Patents

Sensorbaustein Download PDF

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Publication number
DE202013102632U1
DE202013102632U1 DE202013102632U DE202013102632U DE202013102632U1 DE 202013102632 U1 DE202013102632 U1 DE 202013102632U1 DE 202013102632 U DE202013102632 U DE 202013102632U DE 202013102632 U DE202013102632 U DE 202013102632U DE 202013102632 U1 DE202013102632 U1 DE 202013102632U1
Authority
DE
Germany
Prior art keywords
sensor module
module according
sensor
sensor chip
measuring element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202013102632U
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensirion AG
Original Assignee
Sensirion AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensirion AG filed Critical Sensirion AG
Priority to DE202013102632U priority Critical patent/DE202013102632U1/de
Publication of DE202013102632U1 publication Critical patent/DE202013102632U1/de
Priority to CN201420323400.1U priority patent/CN203929747U/zh
Priority to KR2020140004612U priority patent/KR200489765Y1/ko
Priority to JP2014003245U priority patent/JP3193497U/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
DE202013102632U 2013-06-19 2013-06-19 Sensorbaustein Expired - Lifetime DE202013102632U1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE202013102632U DE202013102632U1 (de) 2013-06-19 2013-06-19 Sensorbaustein
CN201420323400.1U CN203929747U (zh) 2013-06-19 2014-06-18 传感器组件
KR2020140004612U KR200489765Y1 (ko) 2013-06-19 2014-06-18 센서 모듈
JP2014003245U JP3193497U (ja) 2013-06-19 2014-06-19 センサモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202013102632U DE202013102632U1 (de) 2013-06-19 2013-06-19 Sensorbaustein

Publications (1)

Publication Number Publication Date
DE202013102632U1 true DE202013102632U1 (de) 2013-12-20

Family

ID=49999594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202013102632U Expired - Lifetime DE202013102632U1 (de) 2013-06-19 2013-06-19 Sensorbaustein

Country Status (4)

Country Link
JP (1) JP3193497U (ko)
KR (1) KR200489765Y1 (ko)
CN (1) CN203929747U (ko)
DE (1) DE202013102632U1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016016078A1 (de) * 2014-08-01 2016-02-04 Carl Freudenberg Kg Sensor
CN105466463A (zh) * 2014-09-26 2016-04-06 盛思锐股份公司 传感器芯片
EP3124962A1 (en) * 2015-07-29 2017-02-01 Sensirion AG Gas sensor, array and a method for manufacturing thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105137023B (zh) * 2015-10-14 2018-08-03 浙江公正检验中心有限公司 一种在线检测水产品的系统与方法
EP3139159A1 (en) * 2016-08-23 2017-03-08 Sensirion AG Sensor assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1236038B1 (de) 1999-12-08 2005-11-23 Sensirion AG Kapazitiver sensor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2481703B1 (en) * 2011-01-27 2020-07-01 Sensirion AG Sensor protection
DE202011051190U1 (de) * 2011-09-02 2011-11-21 Sensirion Ag Sensorbaustein

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1236038B1 (de) 1999-12-08 2005-11-23 Sensirion AG Kapazitiver sensor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016016078A1 (de) * 2014-08-01 2016-02-04 Carl Freudenberg Kg Sensor
US9863829B2 (en) 2014-08-01 2018-01-09 Carl Freudenberg Kg Sensor
RU2664690C1 (ru) * 2014-08-01 2018-08-21 Карл Фройденберг Кг Датчик
RU2665341C1 (ru) * 2014-08-01 2018-08-29 Карл Фройденберг Кг Датчик, фильтрующий элемент с датчиком и применение такого фильтрующего элемента
US10189701B2 (en) 2014-08-01 2019-01-29 Carl Freudenberg Kg Sensor, filter element comprising a sensor and use of said type of filter element
CN105466463A (zh) * 2014-09-26 2016-04-06 盛思锐股份公司 传感器芯片
CN105466463B (zh) * 2014-09-26 2019-11-15 盛思锐股份公司 传感器芯片
EP3124962A1 (en) * 2015-07-29 2017-02-01 Sensirion AG Gas sensor, array and a method for manufacturing thereof

Also Published As

Publication number Publication date
CN203929747U (zh) 2014-11-05
KR200489765Y1 (ko) 2019-08-02
KR20140006470U (ko) 2014-12-30
JP3193497U (ja) 2014-10-09

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20140213

R150 Utility model maintained after payment of first maintenance fee after three years
R151 Utility model maintained after payment of second maintenance fee after six years
R152 Utility model maintained after payment of third maintenance fee after eight years
R071 Expiry of right