DE202009007540U1 - LED-Packungsanordnung und LED-Balken unter Verwendung derselben - Google Patents

LED-Packungsanordnung und LED-Balken unter Verwendung derselben Download PDF

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Publication number
DE202009007540U1
DE202009007540U1 DE202009007540U DE202009007540U DE202009007540U1 DE 202009007540 U1 DE202009007540 U1 DE 202009007540U1 DE 202009007540 U DE202009007540 U DE 202009007540U DE 202009007540 U DE202009007540 U DE 202009007540U DE 202009007540 U1 DE202009007540 U1 DE 202009007540U1
Authority
DE
Germany
Prior art keywords
connection block
led
packing body
connection
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202009007540U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LumenMax Optoelectronics Co Ltd Guishan
Lumenmax Optoelectronics Co Ltd
Original Assignee
LumenMax Optoelectronics Co Ltd Guishan
Lumenmax Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LumenMax Optoelectronics Co Ltd Guishan, Lumenmax Optoelectronics Co Ltd filed Critical LumenMax Optoelectronics Co Ltd Guishan
Publication of DE202009007540U1 publication Critical patent/DE202009007540U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
DE202009007540U 2008-07-03 2009-05-27 LED-Packungsanordnung und LED-Balken unter Verwendung derselben Expired - Lifetime DE202009007540U1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW097125009 2008-07-03
TW97125009 2008-07-03
TW098105067 2009-02-18
TW098105067A TW201003991A (en) 2008-07-03 2009-02-18 Package structure of LED and light bar using the same

Publications (1)

Publication Number Publication Date
DE202009007540U1 true DE202009007540U1 (de) 2009-08-20

Family

ID=40984554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202009007540U Expired - Lifetime DE202009007540U1 (de) 2008-07-03 2009-05-27 LED-Packungsanordnung und LED-Balken unter Verwendung derselben

Country Status (5)

Country Link
US (1) US7939919B2 (https=)
JP (1) JP3152802U (https=)
KR (1) KR200470083Y1 (https=)
DE (1) DE202009007540U1 (https=)
TW (1) TW201003991A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009298A (ja) * 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
KR101352276B1 (ko) * 2009-07-24 2014-01-16 엘지디스플레이 주식회사 발광다이오드의 방열장치와 이를 이용한 액정표시장치
KR101075774B1 (ko) * 2009-10-29 2011-10-26 삼성전기주식회사 발광소자 패키지 및 그 제조 방법
CN106067511A (zh) 2010-03-30 2016-11-02 大日本印刷株式会社 带树脂引线框、半导体装置及其制造方法
KR101298406B1 (ko) * 2010-05-17 2013-08-20 엘지이노텍 주식회사 발광소자
US8933548B2 (en) 2010-11-02 2015-01-13 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
JP6286857B2 (ja) * 2013-04-10 2018-03-07 三菱電機株式会社 照明ランプおよび照明装置
JP2019114624A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 半導体発光装置及びその製造方法
KR102307915B1 (ko) 2019-10-31 2021-10-05 김순희 골프 티꽂이
CN113921682B (zh) * 2021-10-12 2024-10-22 深圳市伟特立光电有限公司 基于半导体led发光芯片用封装结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4359195B2 (ja) * 2004-06-11 2009-11-04 株式会社東芝 半導体発光装置及びその製造方法並びに半導体発光ユニット
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
TWI277223B (en) * 2004-11-03 2007-03-21 Chen-Lun Hsingchen A low thermal resistance LED package
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
TW200843130A (en) * 2007-04-17 2008-11-01 Wen Lin Package structure of a surface-mount high-power light emitting diode chip and method of making the same

Also Published As

Publication number Publication date
US7939919B2 (en) 2011-05-10
KR20100000463U (ko) 2010-01-13
TW201003991A (en) 2010-01-16
US20100001298A1 (en) 2010-01-07
JP3152802U (ja) 2009-08-13
KR200470083Y1 (ko) 2013-11-26
TWI379445B (https=) 2012-12-11

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R207 Utility model specification

Effective date: 20090924

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20120523

R157 Lapse of ip right after 6 years