DE20122371U1 - Projektionsanzeigeeinrichtung - Google Patents
Projektionsanzeigeeinrichtung Download PDFInfo
- Publication number
- DE20122371U1 DE20122371U1 DE20122371U DE20122371U DE20122371U1 DE 20122371 U1 DE20122371 U1 DE 20122371U1 DE 20122371 U DE20122371 U DE 20122371U DE 20122371 U DE20122371 U DE 20122371U DE 20122371 U1 DE20122371 U1 DE 20122371U1
- Authority
- DE
- Germany
- Prior art keywords
- micromirror
- micromirrors
- substrate
- display device
- projection display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 166
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000010453 quartz Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 230000031700 light absorption Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 48
- 229910052751 metal Inorganic materials 0.000 abstract description 33
- 239000002184 metal Substances 0.000 abstract description 33
- 230000003287 optical effect Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 167
- 239000000463 material Substances 0.000 description 87
- 229920002120 photoresistant polymer Polymers 0.000 description 27
- 238000000151 deposition Methods 0.000 description 16
- 238000005530 etching Methods 0.000 description 16
- 229910052581 Si3N4 Inorganic materials 0.000 description 15
- 210000002381 plasma Anatomy 0.000 description 15
- 239000000460 chlorine Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 13
- 229910021417 amorphous silicon Inorganic materials 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 229910052723 transition metal Inorganic materials 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- -1 transition metal silicon nitride Chemical class 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910015844 BCl3 Inorganic materials 0.000 description 2
- 229910007991 Si-N Inorganic materials 0.000 description 2
- 229910006294 Si—N Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003701 inert diluent Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910002109 metal ceramic alloy Inorganic materials 0.000 description 2
- 239000000078 metal ceramic alloy Substances 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 210000001525 retina Anatomy 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910017150 AlTi Inorganic materials 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 102000052666 B-Cell Lymphoma 3 Human genes 0.000 description 1
- 108700009171 B-Cell Lymphoma 3 Proteins 0.000 description 1
- 101150072667 Bcl3 gene Proteins 0.000 description 1
- 229910014263 BrF3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 101001094044 Mus musculus Solute carrier family 26 member 6 Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004028 SiCU Inorganic materials 0.000 description 1
- 229910003910 SiCl4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910004166 TaN Inorganic materials 0.000 description 1
- 241000826860 Trapezium Species 0.000 description 1
- SYKNUAWMBRIEKB-UHFFFAOYSA-N [Cl].[Br] Chemical compound [Cl].[Br] SYKNUAWMBRIEKB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- VQYHBXLHGKQYOY-UHFFFAOYSA-N aluminum oxygen(2-) titanium(4+) Chemical compound [O-2].[Al+3].[Ti+4] VQYHBXLHGKQYOY-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- RWRIWBAIICGTTQ-UHFFFAOYSA-N difluoromethane Chemical compound FCF RWRIWBAIICGTTQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- FZGIHSNZYGFUGM-UHFFFAOYSA-L iron(ii) fluoride Chemical compound [F-].[F-].[Fe+2] FZGIHSNZYGFUGM-UHFFFAOYSA-L 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- FQFKTKUFHWNTBN-UHFFFAOYSA-N trifluoro-$l^{3}-bromane Chemical compound FBr(F)F FQFKTKUFHWNTBN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/28—Reflectors in projection beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/74—Projection arrangements for image reproduction, e.g. using eidophor
- H04N5/7416—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal
- H04N5/7458—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0369—Static structures characterized by their profile
- B81B2203/0384—Static structures characterized by their profile sloped profile
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Projection Apparatus (AREA)
- Micromachines (AREA)
- Led Device Packages (AREA)
- Prostheses (AREA)
- Transforming Electric Information Into Light Information (AREA)
- Hybrid Cells (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/631,536 US6529310B1 (en) | 1998-09-24 | 2000-08-03 | Deflectable spatial light modulator having superimposed hinge and deflectable element |
| US631,536 | 2000-08-03 | ||
| US22924600P | 2000-08-30 | 2000-08-30 | |
| US229,246 | 2000-08-30 | ||
| US732,445 | 2000-12-07 | ||
| US09/732,445 US6523961B2 (en) | 2000-08-30 | 2000-12-07 | Projection system and mirror elements for improved contrast ratio in spatial light modulators |
| EP05000598A EP1555562A3 (en) | 2000-08-03 | 2001-08-03 | Projection display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE20122371U1 true DE20122371U1 (de) | 2005-05-19 |
Family
ID=27397927
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE20122371U Expired - Lifetime DE20122371U1 (de) | 2000-08-03 | 2001-08-03 | Projektionsanzeigeeinrichtung |
| DE20122370U Expired - Lifetime DE20122370U1 (de) | 2000-08-03 | 2001-08-03 | Verpacktes Mikrospiegelfeld für eine Projektions-Anzeigeeinrichtung |
| DE20122614U Expired - Lifetime DE20122614U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122615U Expired - Lifetime DE20122615U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122617U Expired - Lifetime DE20122617U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122373U Expired - Lifetime DE20122373U1 (de) | 2000-08-03 | 2001-08-03 | Projektionssystem zum Projizieren eines Farbbildes |
| DE60126849T Expired - Fee Related DE60126849T2 (de) | 2000-08-03 | 2001-08-03 | Vereinzelte Die-Wafer mit Mikrospiegeln |
| DE20122618U Expired - Lifetime DE20122618U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122616U Expired - Lifetime DE20122616U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122372U Expired - Lifetime DE20122372U1 (de) | 2000-08-03 | 2001-08-03 | Chip abgetrennt von einem Wafer |
Family Applications After (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE20122370U Expired - Lifetime DE20122370U1 (de) | 2000-08-03 | 2001-08-03 | Verpacktes Mikrospiegelfeld für eine Projektions-Anzeigeeinrichtung |
| DE20122614U Expired - Lifetime DE20122614U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122615U Expired - Lifetime DE20122615U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122617U Expired - Lifetime DE20122617U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122373U Expired - Lifetime DE20122373U1 (de) | 2000-08-03 | 2001-08-03 | Projektionssystem zum Projizieren eines Farbbildes |
| DE60126849T Expired - Fee Related DE60126849T2 (de) | 2000-08-03 | 2001-08-03 | Vereinzelte Die-Wafer mit Mikrospiegeln |
| DE20122618U Expired - Lifetime DE20122618U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122616U Expired - Lifetime DE20122616U1 (de) | 2000-08-03 | 2001-08-03 | Mikrospiegelelemente, Gehäuse für Mikrospiegelelemente und zugehöriges Projektionssystem |
| DE20122372U Expired - Lifetime DE20122372U1 (de) | 2000-08-03 | 2001-08-03 | Chip abgetrennt von einem Wafer |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1315993A4 (enExample) |
| JP (5) | JP3889705B2 (enExample) |
| KR (1) | KR100724081B1 (enExample) |
| CN (5) | CN100412604C (enExample) |
| AT (1) | ATE354814T1 (enExample) |
| AU (1) | AU2001281019A1 (enExample) |
| DE (10) | DE20122371U1 (enExample) |
| WO (1) | WO2002012925A2 (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6969635B2 (en) | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US7012731B2 (en) | 2000-08-30 | 2006-03-14 | Reflectivity, Inc | Packaged micromirror array for a projection display |
| US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US7023606B2 (en) | 2001-08-03 | 2006-04-04 | Reflectivity, Inc | Micromirror array for projection TV |
| SG111972A1 (en) * | 2002-10-17 | 2005-06-29 | Agency Science Tech & Res | Wafer-level package for micro-electro-mechanical systems |
| US7042622B2 (en) | 2003-10-30 | 2006-05-09 | Reflectivity, Inc | Micromirror and post arrangements on substrates |
| US7397517B2 (en) * | 2003-05-30 | 2008-07-08 | Kazuhiro Ohara | Display system and signal processing using diamond-shaped DMDs |
| US7012669B2 (en) | 2003-08-18 | 2006-03-14 | Evans & Sutherland Computer Corporation | Reflection barrier for panoramic display |
| US7334902B2 (en) | 2003-08-18 | 2008-02-26 | Evans & Sutherland Computer Corporation | Wide angle scanner for panoramic display |
| US6871958B2 (en) | 2003-08-18 | 2005-03-29 | Evans & Sutherland Computer Corporation | Wide angle scanner for panoramic display |
| US6861277B1 (en) * | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
| US6995830B2 (en) * | 2003-12-22 | 2006-02-07 | Asml Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
| US7057794B2 (en) * | 2004-05-19 | 2006-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micromirror for MEMS device |
| US7273693B2 (en) * | 2004-07-30 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | Method for forming a planar mirror using a sacrificial oxide |
| US7038831B2 (en) * | 2004-09-30 | 2006-05-02 | Lucent Technologies, Inc. | Micromirror apparatus with improved in-plane rotation tolerance |
| KR100815358B1 (ko) * | 2004-10-08 | 2008-03-19 | 삼성전기주식회사 | 경사진 광투과성 덮개를 가진 광변조기 패키지 |
| JP4568579B2 (ja) | 2004-10-29 | 2010-10-27 | 富士通株式会社 | 光スイッチ |
| IL165212A (en) | 2004-11-15 | 2012-05-31 | Elbit Systems Electro Optics Elop Ltd | Device for scanning light |
| US7372617B2 (en) * | 2005-07-06 | 2008-05-13 | Peter Enoksson | Hidden hinge MEMS device |
| GB2453104B (en) | 2007-09-19 | 2012-04-25 | Wolfson Microelectronics Plc | Mems device and process |
| US11157977B1 (en) | 2007-10-26 | 2021-10-26 | Zazzle Inc. | Sales system using apparel modeling system and method |
| TWI418850B (zh) | 2007-11-09 | 2013-12-11 | 尼康股份有限公司 | 微致動器、光學設備、顯示裝置、曝光裝置及設備製造方法 |
| JP2009233836A (ja) * | 2008-03-28 | 2009-10-15 | Yamaha Corp | Ｍｅｍｓおよびｍｅｍｓ製造方法 |
| US8537446B2 (en) * | 2008-04-08 | 2013-09-17 | Cornell University | Multi-axis, large tilt angle, wafer level micromirror array for large scale beam steering applications |
| DE102008001038B4 (de) | 2008-04-08 | 2016-08-11 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren |
| US8096182B2 (en) * | 2008-05-29 | 2012-01-17 | Freescale Semiconductor, Inc. | Capacitive sensor with stress relief that compensates for package stress |
| JP5151756B2 (ja) * | 2008-07-16 | 2013-02-27 | 株式会社豊田中央研究所 | 光学装置 |
| US10719862B2 (en) | 2008-07-29 | 2020-07-21 | Zazzle Inc. | System and method for intake of manufacturing patterns and applying them to the automated production of interactive, customizable product |
| WO2011006522A1 (en) * | 2009-07-17 | 2011-01-20 | Carl Zeiss Smt Gmbh | Microlithographic projection exposure apparatus and method of measuring a parameter related to an optical surface contained therein |
| KR101912092B1 (ko) | 2010-10-05 | 2018-10-26 | 삼성전자 주식회사 | 액체 렌즈 |
| KR101912093B1 (ko) * | 2010-10-29 | 2018-10-26 | 삼성전자 주식회사 | 광학 장치 |
| CN102087414B (zh) * | 2010-11-03 | 2012-12-26 | 凝辉(天津)科技有限责任公司 | 一种阵列式分区投影方法 |
| CN102683474B (zh) * | 2011-03-18 | 2014-11-05 | 浙江大立科技股份有限公司 | 一种基于复合牺牲层的红外探测器制作方法 |
| US9641826B1 (en) | 2011-10-06 | 2017-05-02 | Evans & Sutherland Computer Corporation | System and method for displaying distant 3-D stereo on a dome surface |
| US10969743B2 (en) * | 2011-12-29 | 2021-04-06 | Zazzle Inc. | System and method for the efficient recording of large aperture wave fronts of visible and near visible light |
| AU2013294616B2 (en) | 2012-07-26 | 2016-04-28 | Apple Inc. | Dual-axis scanning mirror |
| US9110354B2 (en) * | 2012-09-20 | 2015-08-18 | Palo Alto Research Center Incorporated | Steerable illumination source for a compact camera |
| WO2014064606A1 (en) * | 2012-10-23 | 2014-05-01 | Primesense Ltd. | Production of micro-mechanical devices |
| DE102013213842A1 (de) * | 2013-07-16 | 2015-01-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
| DE102013217269A1 (de) * | 2013-08-29 | 2015-03-05 | Carl Zeiss Smt Gmbh | Mikrospiegel-Array |
| CN103777445B (zh) * | 2014-01-06 | 2018-12-25 | 杨毅 | 投影显示装置 |
| CN103777450A (zh) * | 2014-01-06 | 2014-05-07 | 吴震 | 发光装置、投影显示装置和发光系统 |
| JP2016029430A (ja) * | 2014-07-25 | 2016-03-03 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
| DE102015200626B3 (de) * | 2015-01-16 | 2016-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS Aktuator, System mit einer Mehrzahl vom MEMS Aktuatoren und Verfahren zum Herstellen eines MEMS Aktuators |
| CN104835908A (zh) * | 2015-04-17 | 2015-08-12 | 上海华虹宏力半导体制造有限公司 | 用于3d amr的氮化钽刻蚀方法 |
| US10589980B2 (en) * | 2017-04-07 | 2020-03-17 | Texas Instruments Incorporated | Isolated protrusion/recession features in a micro electro mechanical system |
| DE102018207783B4 (de) * | 2018-05-17 | 2022-11-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Array aus MEMS mit jeweils einem beweglichen Strukturelement |
| CN111246187B (zh) * | 2018-11-29 | 2022-07-29 | 青岛海信激光显示股份有限公司 | 光阀驱动控制方法及投影设备 |
| KR102211618B1 (ko) * | 2019-07-26 | 2021-02-02 | 인하대학교 산학협력단 | 3차원 플로팅 이미지 구현 장치용 역반사 마이크로 미러 어레이 |
| CN113675722B (zh) * | 2021-07-14 | 2024-10-29 | 威科赛乐微电子股份有限公司 | 一种Cap layer层蚀刻优化方法 |
| WO2025127562A1 (ko) * | 2023-12-14 | 2025-06-19 | 엘지이노텍 주식회사 | 프로젝트 장치 및 이를 포함하는 전자 디바이스 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4592628A (en) * | 1981-07-01 | 1986-06-03 | International Business Machines | Mirror array light valve |
| US5659374A (en) * | 1992-10-23 | 1997-08-19 | Texas Instruments Incorporated | Method of repairing defective pixels |
| US5696619A (en) * | 1995-02-27 | 1997-12-09 | Texas Instruments Incorporated | Micromechanical device having an improved beam |
| JPH08304924A (ja) * | 1995-05-10 | 1996-11-22 | Nikon Corp | プロジェクター装置 |
| JPH08304892A (ja) * | 1995-05-11 | 1996-11-22 | Asahi Optical Co Ltd | ストロボ付カメラ |
| US6288828B1 (en) * | 1997-09-10 | 2001-09-11 | Light And Sound Design Ltd. | Programmable light beam shape altering device using programmable micromirrors |
| KR100243190B1 (ko) * | 1996-06-10 | 2000-02-01 | 윤종용 | 가동미러장치 및 그 제조방법 |
| EP0877272B1 (en) * | 1997-05-08 | 2002-07-31 | Texas Instruments Incorporated | Improvements in or relating to spatial light modulators |
| KR100313851B1 (ko) * | 1998-04-10 | 2001-12-12 | 윤종용 | 화상표시장치용마이크로미러디바이스 |
| US6123985A (en) * | 1998-10-28 | 2000-09-26 | Solus Micro Technologies, Inc. | Method of fabricating a membrane-actuated charge controlled mirror (CCM) |
| US6222667B1 (en) * | 1999-02-09 | 2001-04-24 | Advanced Optics Electronics, Inc. | Electro-optic light valve array |
| US6175443B1 (en) * | 1999-05-01 | 2001-01-16 | Lucent Technologies, Inc. | Article comprising a deformable segmented mirror |
-
2001
- 2001-08-03 DE DE20122371U patent/DE20122371U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122370U patent/DE20122370U1/de not_active Expired - Lifetime
- 2001-08-03 CN CNB2004100546604A patent/CN100412604C/zh not_active Expired - Fee Related
- 2001-08-03 JP JP2002517555A patent/JP3889705B2/ja not_active Expired - Fee Related
- 2001-08-03 DE DE20122614U patent/DE20122614U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122615U patent/DE20122615U1/de not_active Expired - Lifetime
- 2001-08-03 EP EP01959466A patent/EP1315993A4/en not_active Ceased
- 2001-08-03 DE DE20122617U patent/DE20122617U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122373U patent/DE20122373U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE60126849T patent/DE60126849T2/de not_active Expired - Fee Related
- 2001-08-03 CN CNB2004100546572A patent/CN100412602C/zh not_active Expired - Fee Related
- 2001-08-03 DE DE20122618U patent/DE20122618U1/de not_active Expired - Lifetime
- 2001-08-03 CN CNB2004100546587A patent/CN100412603C/zh not_active Expired - Fee Related
- 2001-08-03 AU AU2001281019A patent/AU2001281019A1/en not_active Abandoned
- 2001-08-03 DE DE20122616U patent/DE20122616U1/de not_active Expired - Lifetime
- 2001-08-03 WO PCT/US2001/024332 patent/WO2002012925A2/en not_active Ceased
- 2001-08-03 CN CNB2004100546591A patent/CN100371763C/zh not_active Expired - Fee Related
- 2001-08-03 AT AT05000599T patent/ATE354814T1/de not_active IP Right Cessation
- 2001-08-03 CN CNB018136087A patent/CN100392467C/zh not_active Expired - Fee Related
- 2001-08-03 DE DE20122372U patent/DE20122372U1/de not_active Expired - Lifetime
-
2003
- 2003-02-03 KR KR1020037001542A patent/KR100724081B1/ko not_active Expired - Fee Related
-
2004
- 2004-09-03 JP JP2004257715A patent/JP3889757B2/ja not_active Expired - Fee Related
- 2004-09-17 JP JP2004272332A patent/JP3768514B2/ja not_active Expired - Fee Related
- 2004-09-17 JP JP2004272333A patent/JP3889759B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-07 JP JP2005353848A patent/JP2006178447A/ja not_active Abandoned
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE20122371U1 (de) | Projektionsanzeigeeinrichtung | |
| US7167297B2 (en) | Micromirror array | |
| US6962419B2 (en) | Micromirror elements, package for the micromirror elements, and projection system therefor | |
| US7023606B2 (en) | Micromirror array for projection TV | |
| US6952301B2 (en) | Spatial light modulators with light blocking and absorbing areas | |
| US7405860B2 (en) | Spatial light modulators with light blocking/absorbing areas | |
| US6958846B2 (en) | Spatial light modulators with light absorbing areas | |
| US20040100677A1 (en) | Spatial light modulators with light blocking/absorbing areas | |
| US20030214639A1 (en) | Micromirrors with OFF-angle electrodes and stops | |
| EP1553437B1 (en) | Singulated wafer die having micromirrors | |
| DE DK et al. | Vereinzelte Die-Wafer mit Mikrospiegeln Puces nues séparées à micro-miroirs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 20050623 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20050819 |
|
| R081 | Change of applicant/patentee |
Owner name: TEXAS INSTRUMENTS INC. (N.D.GES.D.STAATES DELA, US Free format text: FORMER OWNER: REFLECTIVITY INC., SUNNYVALE, CALIF., US Effective date: 20070219 |
|
| R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20070822 |
|
| R158 | Lapse of ip right after 8 years |
Effective date: 20100302 |