DE20011330U1 - Optoelektronische Bauteilgruppe - Google Patents

Optoelektronische Bauteilgruppe

Info

Publication number
DE20011330U1
DE20011330U1 DE20011330U DE20011330U DE20011330U1 DE 20011330 U1 DE20011330 U1 DE 20011330U1 DE 20011330 U DE20011330 U DE 20011330U DE 20011330 U DE20011330 U DE 20011330U DE 20011330 U1 DE20011330 U1 DE 20011330U1
Authority
DE
Germany
Prior art keywords
component group
optoelectronic component
carrier
group according
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20011330U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority to DE20011330U priority Critical patent/DE20011330U1/de
Publication of DE20011330U1 publication Critical patent/DE20011330U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (13)

1. Optoelektronische Bauteilgruppe, die auf einem Träger (3) montiert ist, und die min­ destens zwei benachbarte LEDs (2) mit einem vorgegebenen Abstand (a) sowie zu­ gehörige Verbindungsleitungen (4) umfaßt, dadurch gekennzeichnet, daß der Trä­ ger (3) aus einem Material mit einer Wärmeleitfähigkeit von besser als 1 W/K×m, insbesondere von mindestens 1,5 W/K×m, besteht.
2. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß der Träger aus einem Material besteht, das mittels SMD-Technik bestückbar ist.
3. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß der Träger aus einem Material besteht, das aus der Gruppe Keramik, nichtleitendes Cermet, Kunststoff und/oder Verbundmaterial ausgewählt ist.
4. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß auf dem Träger mindestens eine weitere Komponente (7) befestigt ist.
5. Optoelektronische Bauteilgruppe nach Anspruch 3, dadurch gekennzeichnet, daß die Komponente eine elektronische Schaltung, insbesondere eine integrierte Schaltung oder komplette Ansteuerschaltung, oder eine LED ist.
6. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß die Bauteilgruppe Bestandteil einer Flächenleuchte oder Lampe ist.
7. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß auf dem Träger mehrere LEDs (2) regelmäßig angeordnet sind.
8. Optoelektronische Bauteilgruppe nach Anspruch 7, dadurch gekennzeichnet, daß die LEDs (2) einen Strang oder ein Array bilden, mit vorgegebenem Abstand (a bzw. b) in den Zeilen bzw. Spalten.
9. Optoelektronische Bauteilgruppe nach Anspruch 6, dadurch gekennzeichnet, daß der Abstand zwischen zwei benachbarten LEDs höchstens 5 mm, bevorzugt weni­ ger als 2 mm, beträgt.
10. Optoelektronische Bauteilgruppe nach Anspruch 1, dadurch gekennzeichnet, daß der Träger auf einem weiteren wärmeableitenden Material, insbesondere einem se­ paraten Wärmeblech oder Karosserieteile eines Fahrzeugs, montiert ist.
11. Optoelektronische Bauteilgruppe nach Anspruch 2, dadurch gekennzeichnet, daß auf dem Träger weitere, insbesondere elektronische Bestandteile aufintegriert sind.
12. Optoelektronische Bauteilgruppe nach Anspruch 6, dadurch gekennzeichnet, daß die Bauhöhe der Gruppe kleiner 10 mm ist.
13. Optoelektronische Bauteilgruppe, die auf einem Träger (3) montiert ist, und die min­ destens zwei benachbarte LEDs (2), die voneinander beabstandet sind, sowie zu­ gehörige Verbindungsleitungen (4) umfaßt, dadurch gekennzeichnet, daß der Trä­ ger (3) aus einem ausreichend gut wärmeableitenden Material besteht, um ohne Beschränkung des spezifizierten Durchlaßstroms der LEDs und ohne weitere Hilfs­ mittel einen Abstand zwischen benachbarten LEDs von höchstens 5 mm, bevorzugt weniger als 2 mm zu realisieren.
DE20011330U 1999-07-08 2000-06-27 Optoelektronische Bauteilgruppe Expired - Lifetime DE20011330U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20011330U DE20011330U1 (de) 1999-07-08 2000-06-27 Optoelektronische Bauteilgruppe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19931689A DE19931689A1 (de) 1999-07-08 1999-07-08 Optoelektronische Bauteilgruppe
DE20011330U DE20011330U1 (de) 1999-07-08 2000-06-27 Optoelektronische Bauteilgruppe

Publications (1)

Publication Number Publication Date
DE20011330U1 true DE20011330U1 (de) 2000-09-21

Family

ID=7913989

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19931689A Ceased DE19931689A1 (de) 1999-07-08 1999-07-08 Optoelektronische Bauteilgruppe
DE20011330U Expired - Lifetime DE20011330U1 (de) 1999-07-08 2000-06-27 Optoelektronische Bauteilgruppe

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19931689A Ceased DE19931689A1 (de) 1999-07-08 1999-07-08 Optoelektronische Bauteilgruppe

Country Status (5)

Country Link
US (1) US6375340B1 (de)
JP (1) JP3074622U (de)
CA (1) CA2313442A1 (de)
DE (2) DE19931689A1 (de)
TW (1) TW460039U (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10063876A1 (de) * 2000-12-21 2002-07-04 Siemens Ag Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle
EP1663706A2 (de) * 2003-09-08 2006-06-07 Schefenacker Vision Systems USA Inc. Led-lichtquelle
EP1681202A2 (de) * 2005-01-15 2006-07-19 Schmitz Gotha Fahrzeugwerke GmbH Fahrzeugleuchte
DE202010000020U1 (de) 2010-01-11 2010-04-15 Loewe Opta Gmbh Elektronikbaugruppe
DE102010000035A1 (de) 2010-01-11 2011-07-14 Loewe Opta GmbH, 96317 Elektronikbaugruppe

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6559777B1 (en) 2000-09-19 2003-05-06 L-3 Communications Corporation Dual mode light source for aircraft external lighting
US7055994B2 (en) * 2000-09-19 2006-06-06 L-3 Communications Corporation Light source assembly and methods for aircraft external lighting
DE10110835B4 (de) * 2001-03-06 2005-02-17 Osram Opto Semiconductors Gmbh Beleuchtungsanordnung mit einer Mehrzahl von LED-Modulen auf einer Kühlkörperoberfläche
TW575652B (en) * 2001-03-07 2004-02-11 Matsushita Electric Ind Co Ltd Light-emitting device
US6617795B2 (en) * 2001-07-26 2003-09-09 Koninklijke Philips Electronics N.V. Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
DE10141027C1 (de) * 2001-08-22 2003-04-10 Media Ag Projektionsvorrichtung und -verfahren
DE10216394B3 (de) 2002-04-12 2004-01-08 Osram Opto Semiconductors Gmbh LED-Modul
WO2006072071A2 (en) 2004-12-30 2006-07-06 Phoseon Technology Inc. Methods and systems relating to light sources for use in industrial processes
KR20050044865A (ko) * 2002-05-08 2005-05-13 포세온 테크날러지 인코퍼레이티드 고효율 고체상태 광원과 이용 및 제조 방법
DE10230103B4 (de) * 2002-07-04 2012-10-31 Tridonic Ag Stromversorgung für Lumineszenzdioden
US8063575B2 (en) 2002-07-04 2011-11-22 Tridonic Jennersdorf Gmbh Current supply for luminescent diodes
DE10245892A1 (de) * 2002-09-30 2004-05-13 Siemens Ag Beleuchtungseinrichtung zur Hinterleuchtung einer Bildwiedergabevorrichtung
US20040184272A1 (en) * 2003-03-20 2004-09-23 Wright Steven A. Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same
DE10315131A1 (de) * 2003-04-03 2004-10-14 Hella Kg Hueck & Co. Scheinwerfer für Fahrzeuge
US7262550B2 (en) * 2003-04-15 2007-08-28 Luminus Devices, Inc. Light emitting diode utilizing a physical pattern
KR101148332B1 (ko) * 2003-04-30 2012-05-25 크리, 인코포레이티드 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
JP2005073227A (ja) * 2003-08-04 2005-03-17 Sharp Corp 撮像装置
US7819550B2 (en) 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
DE102004002398A1 (de) * 2004-01-16 2005-08-25 J.S. Technology Co., Ltd. Lichtquelle mit Leuchtdioden
TWI312583B (en) * 2004-03-18 2009-07-21 Phoseon Technology Inc Micro-reflectors on a substrate for high-density led array
US7816638B2 (en) 2004-03-30 2010-10-19 Phoseon Technology, Inc. LED array having array-based LED detectors
PT1756876E (pt) * 2004-04-12 2011-06-02 Phoseon Technology Inc Rede de led de alta densidade
WO2005100961A2 (en) 2004-04-19 2005-10-27 Phoseon Technology, Inc. Imaging semiconductor strucutures using solid state illumination
TWI283321B (en) * 2004-06-18 2007-07-01 Au Optronics Corp Supporter and LED light-source module using the same
KR101097486B1 (ko) * 2004-06-28 2011-12-22 엘지디스플레이 주식회사 액정표시장치의 백라이트 유닛
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
WO2006033998A1 (en) 2004-09-16 2006-03-30 Magna International Inc. Thermal management system for solid state automotive lighting
US7284882B2 (en) 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
WO2006105644A1 (en) * 2005-04-05 2006-10-12 Tir Systems Ltd. Mounting assembly for optoelectronic devices
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
WO2006126122A2 (en) * 2005-05-25 2006-11-30 Koninklijke Philips Electronics N.V. Device for projecting a pixelated lighting pattern
US7196354B1 (en) 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
US20080099777A1 (en) * 2005-10-19 2008-05-01 Luminus Devices, Inc. Light-emitting devices and related systems
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
DE102006006573B4 (de) * 2006-02-13 2010-08-19 Schwille-Elektronik Produktions- Und Vertriebs- Gmbh Einbauleuchte für Fliesenflächen
US7440280B2 (en) * 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
DE102006015117A1 (de) * 2006-03-31 2007-10-04 Osram Opto Semiconductors Gmbh Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip
JP2009534866A (ja) 2006-04-24 2009-09-24 クリー， インコーポレイティッド 横向き平面実装白色ｌｅｄ
TWI298095B (en) * 2006-07-04 2008-06-21 Coretronic Corp Light emitting device
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US20090086491A1 (en) * 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US7686469B2 (en) * 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
DE102007015473A1 (de) * 2007-03-30 2008-10-09 Osram Gesellschaft mit beschränkter Haftung LED-Bauelement
US7976194B2 (en) * 2007-05-04 2011-07-12 Ruud Lighting, Inc. Sealing and thermal accommodation arrangement in LED package/secondary lens structure
US7938558B2 (en) * 2007-05-04 2011-05-10 Ruud Lighting, Inc. Safety accommodation arrangement in LED package/lens structure
WO2008149276A1 (en) * 2007-06-08 2008-12-11 Koninklijke Philips Electronics N.V. Light output device
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US7902761B2 (en) * 2008-10-03 2011-03-08 Next Gen Illumination, Inc Dimmable LED lamp
JP5650716B2 (ja) * 2009-04-03 2015-01-07 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス部品の製造方法、オプトエレクトロニクス部品、および複数のオプトエレクトロニクス部品を有する部品レイアウト
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
WO2011016908A1 (en) * 2009-08-03 2011-02-10 Illinois Tool Works Inc. Optical interruption sensor with opposed light emitting diodes
ES2535385T3 (es) * 2009-10-22 2015-05-11 Thermal Solution Resources, Llc Conjunto de iluminación LED sobremoldeado y método de fabricación
WO2011097425A2 (en) * 2010-02-04 2011-08-11 Cse, Inc. Compact led light module
CN101794739A (zh) * 2010-03-22 2010-08-04 苏州华菲特陶科技有限公司 二极管陶瓷封装模板
KR101047778B1 (ko) * 2010-04-01 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
TWM422644U (en) * 2010-09-27 2012-02-11 chong-yuan Cai Light-emitting diode capable of dissipating heat and controlling light shape
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
DE102012103198B4 (de) * 2012-04-13 2019-02-21 Vossloh-Schwabe Deutschland Gmbh Trägereinrichtung für ein Leuchtmodul und Verfahren zu deren Herstellung
DE102012109216A1 (de) 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Optoelektronische Baugruppe und Verfahren zum Betreiben einer optoelektronischen Baugruppe
KR102066614B1 (ko) * 2013-02-28 2020-01-15 엘지이노텍 주식회사 조명 장치
USD826871S1 (en) 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US9634206B1 (en) 2015-04-30 2017-04-25 Cse, Inc. LED luminaire
DE102015212910A1 (de) * 2015-07-09 2017-01-12 Sac Sirius Advanced Cybernetics Gmbh Vorrichtung zur Beleuchtung von Gegenständen
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
CN109084220A (zh) * 2018-07-27 2018-12-25 佛山市南海区东雄照明科技有限公司 Led照明灯具

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202335B1 (de) * 1984-11-15 1989-10-25 Japan Traffic Management Technology Association Signallichteinheit mit wärmeabfuhr
US5038255A (en) * 1989-09-09 1991-08-06 Stanley Electric Co., Ltd. Vehicle lamp
JP2818984B2 (ja) * 1992-03-04 1998-10-30 株式会社 ケー・シー・シー・商会 モザイク式パネル用照光表示装置
US5528474A (en) * 1994-07-18 1996-06-18 Grote Industries, Inc. Led array vehicle lamp
US5632551A (en) * 1994-07-18 1997-05-27 Grote Industries, Inc. LED vehicle lamp assembly
JP3579944B2 (ja) * 1995-01-27 2004-10-20 ソニー株式会社 表示装置
DE19528459C2 (de) * 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
DE19621124A1 (de) * 1996-05-24 1997-11-27 Siemens Ag Optoelektronischer Wandler und dessen Herstellungsverfahren
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US5782555A (en) * 1996-06-27 1998-07-21 Hochstein; Peter A. Heat dissipating L.E.D. traffic light
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
DE29825062U1 (de) 1997-07-29 2004-07-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
ATE239190T1 (de) 1997-09-09 2003-05-15 Hahn Glasbau Beleuchtungsvorrichtung mit leuchtdioden aufweisender glasplatte und kombination einer vitrine mit einer solchen beleuchtungsvorrichtung
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10063876A1 (de) * 2000-12-21 2002-07-04 Siemens Ag Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle
US6894901B2 (en) 2000-12-21 2005-05-17 Siemens Aktiengesellschaft Light source comprising a large number of light-emitting diodes
DE10063876B4 (de) * 2000-12-21 2009-02-26 Continental Automotive Gmbh Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle
EP1663706A2 (de) * 2003-09-08 2006-06-07 Schefenacker Vision Systems USA Inc. Led-lichtquelle
EP1663706A4 (de) * 2003-09-08 2008-11-05 Odelo Gmbh Led-lichtquelle
EP1681202A2 (de) * 2005-01-15 2006-07-19 Schmitz Gotha Fahrzeugwerke GmbH Fahrzeugleuchte
DE202010000020U1 (de) 2010-01-11 2010-04-15 Loewe Opta Gmbh Elektronikbaugruppe
DE102010000035A1 (de) 2010-01-11 2011-07-14 Loewe Opta GmbH, 96317 Elektronikbaugruppe

Also Published As

Publication number Publication date
DE19931689A1 (de) 2001-01-11
JP3074622U (ja) 2001-01-19
TW460039U (en) 2001-10-11
US6375340B1 (en) 2002-04-23
CA2313442A1 (en) 2001-01-08

Similar Documents

Publication Publication Date Title
DE20011330U1 (de) Optoelektronische Bauteilgruppe
DE19909399C1 (de) Flexibles LED-Mehrfachmodul, insb. für ein Leuchtengehäuse eines Kraftfahrzeuges
EP1709359B1 (de) Verformbares beleuchtungsmodul
EP1566846A3 (de) Optoelektronisches Bauelement
EP1191277A3 (de) Beleuchtungskörper für Kühlmöbel
DE60314355T2 (de) Einschnappbarer Kühlkörper für Halbleiterbauelemente
DE29923899U1 (de) Leuchteinrichtung
DE29914456U1 (de) Leuchtkörper für Leuchtreklamen
DE202007018552U1 (de) Verformbares Beleuchtungsmodul
CH648716A5 (de) Kombinierbares miniaturisiertes abstands- und befestigungselement fuer elektrische bauteile.
DE20120588U1 (de) Beleuchtungsvorrichtung
DE102008006536B4 (de) Kühlsystem für auf einer Trägerplatine angeordnete Leistungshalbleiter
DE20100376U1 (de) Beleuchtungsvorrichtung
DE102017106734A1 (de) Trägeranordnung für wenigstens ein elektrisches und/oder elektronisches Bauteil, Verfahren zu deren Herstellung sowie Leuchtenbaugruppe mit einer Trägeranordnung
DE20300699U1 (de) Lampensockel und Lampe mit einem Lampensockel
DE20204513U1 (de) Stufenplatte für die Osteotomie
DE20110222U1 (de) Etikett mit einer elektronischen Schaltung
DE20104407U1 (de) Leitungsverbinder
DE3525537C2 (de)
DE20107140U1 (de) Leiterplattenbaugruppe
DE102020124011A1 (de) Optoelektronische vorrichtung mit einem dreidimensionalen körper und einem an dem körper befestigten träger
DE20213577U1 (de) Vorrichtung zum Heben bzw. Tragen von Personen
DE20202333U1 (de) Keramischer Gegenstand
DE29922305U1 (de) Montierhilfe
DE2928960A1 (de) Halte- und anschlussvorrichtung fuer elektrische bauelemente

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20001026

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20030918

R157 Lapse of ip right after 6 years

Effective date: 20070103