DE19980819T1 - Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet - Google Patents
Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendetInfo
- Publication number
- DE19980819T1 DE19980819T1 DE19980819T DE19980819T DE19980819T1 DE 19980819 T1 DE19980819 T1 DE 19980819T1 DE 19980819 T DE19980819 T DE 19980819T DE 19980819 T DE19980819 T DE 19980819T DE 19980819 T1 DE19980819 T1 DE 19980819T1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- same
- heat sink
- cooling device
- shaped heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10453098 | 1998-04-15 | ||
PCT/JP1999/001841 WO1999053256A1 (en) | 1998-04-15 | 1999-04-07 | Plate type heat pipe and its installation structure |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19980819T1 true DE19980819T1 (de) | 2000-05-31 |
Family
ID=14383059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19980819T Withdrawn DE19980819T1 (de) | 1998-04-15 | 1999-04-07 | Plattenförmiges Wärmeableitrohr und Kühlvorrichtung, die dieses verwendet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4278720B2 (zh) |
CN (1) | CN1179188C (zh) |
DE (1) | DE19980819T1 (zh) |
GB (1) | GB2342152B (zh) |
TW (1) | TW414854B (zh) |
WO (1) | WO1999053256A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001183080A (ja) * | 1999-12-24 | 2001-07-06 | Furukawa Electric Co Ltd:The | 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ |
EP1432295B1 (de) * | 2002-12-20 | 2005-04-13 | Innowert GmbH | Kühlvorrichtung für eine elektrische und/oder elektronische Einheit |
CN100447989C (zh) * | 2005-05-18 | 2008-12-31 | 新灯源科技有限公司 | 集成电路封装及其制造方法 |
CN100424860C (zh) * | 2005-08-19 | 2008-10-08 | 南茂科技股份有限公司 | 散热型覆晶封装结构 |
US7447029B2 (en) | 2006-03-14 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber for dissipation heat generated by electronic component |
CN101709929B (zh) * | 2008-11-03 | 2012-05-30 | 赵耀华 | 一种板状热管及其加工工艺 |
CN101403578A (zh) * | 2008-11-03 | 2009-04-08 | 赵耀华 | 一种板状热管及其加工工艺 |
CN105338784A (zh) * | 2014-08-08 | 2016-02-17 | 联想(北京)有限公司 | 一种散热装置及电子设备 |
JP6513427B2 (ja) * | 2015-02-27 | 2019-05-15 | 昭和電工株式会社 | 液冷式冷却装置 |
CN204707386U (zh) * | 2015-04-30 | 2015-10-14 | 讯凯国际股份有限公司 | 散热组件、水冷式散热组件及散热系统 |
CN108458613A (zh) * | 2017-02-21 | 2018-08-28 | Ibt株式会社 | 用于户外的板型真空传热装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07208884A (ja) * | 1994-01-19 | 1995-08-11 | Fujikura Ltd | 平板型ヒートパイプ |
JP3403307B2 (ja) * | 1997-02-13 | 2003-05-06 | 古河電気工業株式会社 | ヒートスプレッダとそれを用いた冷却器 |
JP3106429B2 (ja) * | 1997-04-11 | 2000-11-06 | 古河電気工業株式会社 | 板型ヒートパイプとそれを用いた冷却構造 |
-
1999
- 1999-04-07 JP JP55147499A patent/JP4278720B2/ja not_active Expired - Fee Related
- 1999-04-07 GB GB9928393A patent/GB2342152B/en not_active Expired - Fee Related
- 1999-04-07 WO PCT/JP1999/001841 patent/WO1999053256A1/ja active Application Filing
- 1999-04-07 DE DE19980819T patent/DE19980819T1/de not_active Withdrawn
- 1999-04-07 CN CNB998005541A patent/CN1179188C/zh not_active Expired - Lifetime
- 1999-04-14 TW TW088105915A patent/TW414854B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999053256A1 (en) | 1999-10-21 |
GB9928393D0 (en) | 2000-01-26 |
CN1263592A (zh) | 2000-08-16 |
TW414854B (en) | 2000-12-11 |
GB2342152A (en) | 2000-04-05 |
GB2342152B (en) | 2002-01-09 |
JP4278720B2 (ja) | 2009-06-17 |
CN1179188C (zh) | 2004-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP |
|
8130 | Withdrawal |