GB9928393D0 - Plate type heat pipe and its installation structure - Google Patents

Plate type heat pipe and its installation structure

Info

Publication number
GB9928393D0
GB9928393D0 GBGB9928393.9A GB9928393A GB9928393D0 GB 9928393 D0 GB9928393 D0 GB 9928393D0 GB 9928393 A GB9928393 A GB 9928393A GB 9928393 D0 GB9928393 D0 GB 9928393D0
Authority
GB
United Kingdom
Prior art keywords
heat pipe
type heat
plate type
installation structure
installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9928393.9A
Other versions
GB2342152A (en
GB2342152B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of GB9928393D0 publication Critical patent/GB9928393D0/en
Publication of GB2342152A publication Critical patent/GB2342152A/en
Application granted granted Critical
Publication of GB2342152B publication Critical patent/GB2342152B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H10W40/73—
    • H10W72/877—

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9928393A 1998-04-15 1999-04-07 Plate type heat pipe and cooling device using same Expired - Fee Related GB2342152B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10453098 1998-04-15
PCT/JP1999/001841 WO1999053256A1 (en) 1998-04-15 1999-04-07 Plate type heat pipe and its installation structure

Publications (3)

Publication Number Publication Date
GB9928393D0 true GB9928393D0 (en) 2000-01-26
GB2342152A GB2342152A (en) 2000-04-05
GB2342152B GB2342152B (en) 2002-01-09

Family

ID=14383059

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9928393A Expired - Fee Related GB2342152B (en) 1998-04-15 1999-04-07 Plate type heat pipe and cooling device using same

Country Status (6)

Country Link
JP (1) JP4278720B2 (en)
CN (1) CN1179188C (en)
DE (1) DE19980819T1 (en)
GB (1) GB2342152B (en)
TW (1) TW414854B (en)
WO (1) WO1999053256A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001183080A (en) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for producing compressed mesh wick, and flat heat pipe provided with compressed mesh wick
EP1432295B1 (en) * 2002-12-20 2005-04-13 Innowert GmbH Cooling device for an electric or electronic unit
CN100447989C (en) * 2005-05-18 2008-12-31 新灯源科技有限公司 Integrated circuit package and manufacturing method thereof
CN100424860C (en) * 2005-08-19 2008-10-08 南茂科技股份有限公司 Heat dissipation type flip chip package structure
US7447029B2 (en) 2006-03-14 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber for dissipation heat generated by electronic component
CN101709929B (en) * 2008-11-03 2012-05-30 赵耀华 A kind of plate heat pipe and its processing technology
CN101403578A (en) * 2008-11-03 2009-04-08 赵耀华 Plate-shaped heat pipe and its processing technique
CN105338784A (en) * 2014-08-08 2016-02-17 联想(北京)有限公司 Cooling device and electronic equipment
JP6513427B2 (en) * 2015-02-27 2019-05-15 昭和電工株式会社 Liquid cooling system
CN204707386U (en) * 2015-04-30 2015-10-14 讯凯国际股份有限公司 Heat dissipation component, water-cooled heat dissipation component and heat dissipation system
CN108458613A (en) * 2017-02-21 2018-08-28 Ibt株式会社 For outdoor template vacuum heat transfer unit (HTU)
US11716808B2 (en) * 2020-12-10 2023-08-01 International Business Machines Corporation Tamper-respondent assemblies with porous heat transfer element(s)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07208884A (en) * 1994-01-19 1995-08-11 Fujikura Ltd Flat plate heat pipe
JP3106429B2 (en) * 1997-04-11 2000-11-06 古河電気工業株式会社 Plate type heat pipe and cooling structure using it
JP3403307B2 (en) * 1997-02-13 2003-05-06 古河電気工業株式会社 Heat spreader and cooler using it

Also Published As

Publication number Publication date
TW414854B (en) 2000-12-11
CN1263592A (en) 2000-08-16
WO1999053256A1 (en) 1999-10-21
JP4278720B2 (en) 2009-06-17
CN1179188C (en) 2004-12-08
GB2342152A (en) 2000-04-05
DE19980819T1 (en) 2000-05-31
GB2342152B (en) 2002-01-09

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Legal Events

Date Code Title Description
789A Request for publication of translation (sect. 89(a)/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030407