DE19980819T1 - Plate-shaped heat sink pipe and cooling device using the same - Google Patents

Plate-shaped heat sink pipe and cooling device using the same

Info

Publication number
DE19980819T1
DE19980819T1 DE19980819T DE19980819T DE19980819T1 DE 19980819 T1 DE19980819 T1 DE 19980819T1 DE 19980819 T DE19980819 T DE 19980819T DE 19980819 T DE19980819 T DE 19980819T DE 19980819 T1 DE19980819 T1 DE 19980819T1
Authority
DE
Germany
Prior art keywords
plate
same
heat sink
cooling device
shaped heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19980819T
Other languages
German (de)
Inventor
Masaaki Yamamoto
Masami Ikeda
Tatsuhiko Ueki
Hitoshi Sho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of DE19980819T1 publication Critical patent/DE19980819T1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19980819T 1998-04-15 1999-04-07 Plate-shaped heat sink pipe and cooling device using the same Withdrawn DE19980819T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10453098 1998-04-15
PCT/JP1999/001841 WO1999053256A1 (en) 1998-04-15 1999-04-07 Plate type heat pipe and its installation structure

Publications (1)

Publication Number Publication Date
DE19980819T1 true DE19980819T1 (en) 2000-05-31

Family

ID=14383059

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980819T Withdrawn DE19980819T1 (en) 1998-04-15 1999-04-07 Plate-shaped heat sink pipe and cooling device using the same

Country Status (6)

Country Link
JP (1) JP4278720B2 (en)
CN (1) CN1179188C (en)
DE (1) DE19980819T1 (en)
GB (1) GB2342152B (en)
TW (1) TW414854B (en)
WO (1) WO1999053256A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001183080A (en) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for manufacturing compressed mesh wick and flat surface type heat pipe having compressed mesh wick
ES2241948T3 (en) * 2002-12-20 2005-11-01 Innowert Gmbh REFRIGERATION DEVICE FOR AN ELECTRICAL OR ELECTRONIC UNIT.
CN100447989C (en) * 2005-05-18 2008-12-31 新灯源科技有限公司 Integrated circuit packaging and manufacturing method
CN100424860C (en) * 2005-08-19 2008-10-08 南茂科技股份有限公司 Heat elimination type structure for packing complex crystal
US7447029B2 (en) 2006-03-14 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber for dissipation heat generated by electronic component
CN101709929B (en) * 2008-11-03 2012-05-30 赵耀华 Plate-type heat pipe and process for processing same
CN101403578A (en) * 2008-11-03 2009-04-08 赵耀华 Plate-shaped heat pipe and its processing technique
CN105338784A (en) * 2014-08-08 2016-02-17 联想(北京)有限公司 Cooling device and electronic equipment
JP6513427B2 (en) * 2015-02-27 2019-05-15 昭和電工株式会社 Liquid cooling system
CN204707386U (en) * 2015-04-30 2015-10-14 讯凯国际股份有限公司 Radiating subassembly, water cooled heat radiating assembly and cooling system
CN108458613A (en) * 2017-02-21 2018-08-28 Ibt株式会社 For outdoor template vacuum heat transfer unit (HTU)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07208884A (en) * 1994-01-19 1995-08-11 Fujikura Ltd Plate type heat pipe
JP3403307B2 (en) * 1997-02-13 2003-05-06 古河電気工業株式会社 Heat spreader and cooler using it
JP3106429B2 (en) * 1997-04-11 2000-11-06 古河電気工業株式会社 Plate type heat pipe and cooling structure using it

Also Published As

Publication number Publication date
CN1263592A (en) 2000-08-16
CN1179188C (en) 2004-12-08
GB2342152B (en) 2002-01-09
GB2342152A (en) 2000-04-05
WO1999053256A1 (en) 1999-10-21
GB9928393D0 (en) 2000-01-26
TW414854B (en) 2000-12-11
JP4278720B2 (en) 2009-06-17

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP

8130 Withdrawal