DE19958082A1 - Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben - Google Patents

Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben

Info

Publication number
DE19958082A1
DE19958082A1 DE19958082A DE19958082A DE19958082A1 DE 19958082 A1 DE19958082 A1 DE 19958082A1 DE 19958082 A DE19958082 A DE 19958082A DE 19958082 A DE19958082 A DE 19958082A DE 19958082 A1 DE19958082 A1 DE 19958082A1
Authority
DE
Germany
Prior art keywords
light
monitoring system
carriage
movement
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19958082A
Other languages
German (de)
English (en)
Inventor
Hans Leitner
Xaver Kollmer
Guenther Schindler
Ernst Georg Frisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Logitex Reinstmedientechnik GmbH
Original Assignee
Logitex Reinstmedientechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Logitex Reinstmedientechnik GmbH filed Critical Logitex Reinstmedientechnik GmbH
Priority to DE19958082A priority Critical patent/DE19958082A1/de
Priority to US10/149,046 priority patent/US6681148B2/en
Priority to EP00993283A priority patent/EP1234323A2/fr
Priority to PCT/EP2000/012103 priority patent/WO2001040884A2/fr
Publication of DE19958082A1 publication Critical patent/DE19958082A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37571—Camera detecting reflected light from laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
DE19958082A 1999-12-02 1999-12-02 Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben Ceased DE19958082A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19958082A DE19958082A1 (de) 1999-12-02 1999-12-02 Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben
US10/149,046 US6681148B2 (en) 1999-12-02 2000-12-01 Monitoring system for a conveying device for flat articles, especially wafers
EP00993283A EP1234323A2 (fr) 1999-12-02 2000-12-01 Systeme de surveillance pour dispositif de transport de pieces plates, notamment de pastilles
PCT/EP2000/012103 WO2001040884A2 (fr) 1999-12-02 2000-12-01 Systeme de surveillance pour dispositif de transport de pieces plates, notamment de pastilles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19958082A DE19958082A1 (de) 1999-12-02 1999-12-02 Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben

Publications (1)

Publication Number Publication Date
DE19958082A1 true DE19958082A1 (de) 2001-06-07

Family

ID=7931162

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19958082A Ceased DE19958082A1 (de) 1999-12-02 1999-12-02 Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben

Country Status (4)

Country Link
US (1) US6681148B2 (fr)
EP (1) EP1234323A2 (fr)
DE (1) DE19958082A1 (fr)
WO (1) WO2001040884A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489779B2 (en) * 2001-03-22 2009-02-10 Qstholdings, Llc Hardware implementation of the secure hash standard
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen
DE4310149A1 (de) * 1993-03-29 1994-10-06 Jenoptik Jena Gmbh Einrichtung zum Handeln von scheibenförmigen Objekten in einer Handlingebene eines lokalen Reinraumes

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115773B2 (ja) * 1986-01-29 1995-12-13 株式会社ニコン 基板搬送装置
US5605428A (en) * 1993-03-05 1997-02-25 Jenoptik Gmbh Device for indexing magazine compartments and wafer-shaped objects in the compartments
US5466945A (en) * 1994-03-23 1995-11-14 Eaton Corporation Apparatus for detecting proper positioning of objects in a holder
US5604443A (en) * 1994-05-23 1997-02-18 Tokyo Electron Limited Probe test apparatus
KR100315007B1 (ko) * 1995-11-22 2002-02-28 이시다 아키라 카세트내의 기판 검출 및 반송장치와 그 방법
JP3327130B2 (ja) * 1996-07-24 2002-09-24 ウシオ電機株式会社 物体検出方法およびウエハ搬送アームの検出装置
JPH11150078A (ja) * 1997-11-17 1999-06-02 Ulvac Corp 縦型熱処理炉
JPH11179692A (ja) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd 産業用ロボットのハンド異常検出装置及びハンド異常検出方法
JPH11254359A (ja) * 1998-03-12 1999-09-21 Toyota Autom Loom Works Ltd 部材搬送システム
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6430468B1 (en) * 2000-11-17 2002-08-06 Applied Materials, Inc. Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4310149A1 (de) * 1993-03-29 1994-10-06 Jenoptik Jena Gmbh Einrichtung zum Handeln von scheibenförmigen Objekten in einer Handlingebene eines lokalen Reinraumes
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen

Also Published As

Publication number Publication date
EP1234323A2 (fr) 2002-08-28
WO2001040884A9 (fr) 2002-09-19
WO2001040884A2 (fr) 2001-06-07
US20020182052A1 (en) 2002-12-05
US6681148B2 (en) 2004-01-20
WO2001040884A3 (fr) 2002-02-14

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection