DE19729162C2 - Verbinder zwischen einer Tochterplatine und einer Mutterplatine - Google Patents

Verbinder zwischen einer Tochterplatine und einer Mutterplatine

Info

Publication number
DE19729162C2
DE19729162C2 DE19729162A DE19729162A DE19729162C2 DE 19729162 C2 DE19729162 C2 DE 19729162C2 DE 19729162 A DE19729162 A DE 19729162A DE 19729162 A DE19729162 A DE 19729162A DE 19729162 C2 DE19729162 C2 DE 19729162C2
Authority
DE
Germany
Prior art keywords
connector
housing
signal
board
connector assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19729162A
Other languages
German (de)
English (en)
Other versions
DE19729162A1 (de
Inventor
Richard A Schumacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE19729162A1 publication Critical patent/DE19729162A1/de
Application granted granted Critical
Publication of DE19729162C2 publication Critical patent/DE19729162C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE19729162A 1996-10-30 1997-07-08 Verbinder zwischen einer Tochterplatine und einer Mutterplatine Expired - Fee Related DE19729162C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/741,088 US5823795A (en) 1996-10-30 1996-10-30 Connector between a daughterboard and a motherboard for high-speed single-ended electrical signals

Publications (2)

Publication Number Publication Date
DE19729162A1 DE19729162A1 (de) 1998-05-07
DE19729162C2 true DE19729162C2 (de) 2001-05-03

Family

ID=24979343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19729162A Expired - Fee Related DE19729162C2 (de) 1996-10-30 1997-07-08 Verbinder zwischen einer Tochterplatine und einer Mutterplatine

Country Status (4)

Country Link
US (1) US5823795A (cg-RX-API-DMAC7.html)
JP (1) JPH10154559A (cg-RX-API-DMAC7.html)
DE (1) DE19729162C2 (cg-RX-API-DMAC7.html)
GB (1) GB2318923B (cg-RX-API-DMAC7.html)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5978873A (en) * 1997-09-24 1999-11-02 Intel Corporation Computer system including right angle processor and add-on card connectors
US6280201B1 (en) 2000-01-21 2001-08-28 Hewlett-Packard Company Laminated 90-degree connector
US6510050B1 (en) * 2000-11-21 2003-01-21 Sun Microsystems, Inc. High density packaging for multi-disk systems
US6979202B2 (en) 2001-01-12 2005-12-27 Litton Systems, Inc. High-speed electrical connector
US6910897B2 (en) 2001-01-12 2005-06-28 Litton Systems, Inc. Interconnection system
US6843657B2 (en) * 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
US6617526B2 (en) * 2001-04-23 2003-09-09 Lockheed Martin Corporation UHF ground interconnects
US6639144B1 (en) 2001-08-31 2003-10-28 Gateway, Inc. Electromagnetic interference reduction system
US6712620B1 (en) * 2002-09-12 2004-03-30 High Connection Density, Inc. Coaxial elastomeric connector system
US6929482B2 (en) * 2003-01-27 2005-08-16 Litton Systems, Inc. Interconnection arrangement
CN2626161Y (zh) * 2003-04-28 2004-07-14 华为技术有限公司 一种双面插背板
US6997753B2 (en) * 2003-10-22 2006-02-14 Gore Enterprise Holdings, Inc. Apparatus, system and method for improved calibration and measurement of differential devices
US7112067B1 (en) * 2005-04-11 2006-09-26 Hon Hai Precision Ind. Co., Ltd Connector assembly for printed circuit board interconnection
TW200712841A (en) * 2005-09-30 2007-04-01 Tyan Computer Corp Processor configuration architecture of multi-processor system
US20090027844A1 (en) * 2007-07-23 2009-01-29 Hau Jiun Chen Translator for supporting different memory protocols
US20100254109A1 (en) 2009-03-19 2010-10-07 Olympus Corporation Mount assembly and method for manufacturing mount assembly
CN105792515A (zh) * 2014-12-25 2016-07-20 台达电子工业股份有限公司 电路板组合及其组装方法
CN107658587A (zh) * 2017-07-31 2018-02-02 芜湖宏景电子股份有限公司 电路板与线束插接结构
KR102651499B1 (ko) * 2021-08-20 2024-03-27 현대모비스 주식회사 양방향 시그널핀 모듈, 이를 포함한 파워 모듈 및 이의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195899A (en) * 1991-05-13 1993-03-23 Fujitsu Limited Impedance matched electrical connector
WO1994016478A1 (en) * 1992-12-30 1994-07-21 United Technologies Corporation Backshell interface system
DE4332996A1 (de) * 1993-09-28 1995-03-30 Siemens Ag Steckverbinder zur Kontaktierung einer Leiterplatte
DE19502408A1 (de) * 1995-01-26 1996-08-01 Siemens Ag Leiterplatten-Anschlußeinrichtung mit einer Vielzahl von elektrischen Kontaktierungsstellen in der Bestückungsebene der Leiterplatte

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869676A (en) * 1981-09-11 1989-09-26 Amp Incorporated Connector assembly for use between mother and daughter circuit boards
DE3528912A1 (de) * 1985-08-12 1987-02-19 Winchester Electronics Divisio Steckverbinder fuer leiterkarten
US4798544A (en) * 1986-01-06 1989-01-17 Minnesota Mining And Manufacturing Company Low profile clip connector with integral contact support insert
US4678252A (en) * 1986-05-27 1987-07-07 Rockwell International Corporation Electrical connector for circuit boards
US4867696A (en) * 1988-07-15 1989-09-19 Amp Incorporated Laminated bus bar with power tabs
US4917616A (en) * 1988-07-15 1990-04-17 Amp Incorporated Backplane signal connector with controlled impedance
US5205739A (en) * 1989-11-13 1993-04-27 Augat Inc. High density parallel interconnect
US4971574A (en) * 1989-12-08 1990-11-20 W. L. Gore & Associates, Inc. Shielded connector assembly for flat cable
US5152700A (en) * 1991-06-17 1992-10-06 Litton Systems, Inc. Printed circuit board connector system
US5212348A (en) * 1991-07-17 1993-05-18 W. L. Gore & Associates, Inc. Partially-stripped reinforced electric signal cable and processes for manufacture and termination thereof
FR2685555B1 (fr) * 1991-12-23 1994-03-25 Souriau Cie Connecteur electrique destine a recevoir un support plat.
US5199895A (en) * 1992-02-04 1993-04-06 Chang Lien Ker Low insertion force, self-locking connecting apparatus for electrically connecting memory modules to a printed circuit board
US5277595A (en) * 1992-06-29 1994-01-11 E. I. Du Pont De Nemours And Company Power receptacle for a daughterboard
US5417584A (en) * 1994-03-14 1995-05-23 W. L. Gore & Associates, Inc. Flat cable/connector strain relief connection and method thereof
US5498167A (en) * 1994-04-13 1996-03-12 Molex Incorporated Board to board electrical connectors
JP3007812U (ja) * 1994-05-25 1995-02-28 モレックス インコーポレーテッド 表面実装用電気コネクタ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195899A (en) * 1991-05-13 1993-03-23 Fujitsu Limited Impedance matched electrical connector
WO1994016478A1 (en) * 1992-12-30 1994-07-21 United Technologies Corporation Backshell interface system
DE4332996A1 (de) * 1993-09-28 1995-03-30 Siemens Ag Steckverbinder zur Kontaktierung einer Leiterplatte
DE19502408A1 (de) * 1995-01-26 1996-08-01 Siemens Ag Leiterplatten-Anschlußeinrichtung mit einer Vielzahl von elektrischen Kontaktierungsstellen in der Bestückungsebene der Leiterplatte

Also Published As

Publication number Publication date
GB2318923B (en) 2000-10-18
JPH10154559A (ja) 1998-06-09
DE19729162A1 (de) 1998-05-07
GB9721375D0 (en) 1997-12-10
US5823795A (en) 1998-10-20
GB2318923A (en) 1998-05-06

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee