DE1960554C3 - Herstellung von Dünnschicht-Schaltungen - Google Patents

Herstellung von Dünnschicht-Schaltungen

Info

Publication number
DE1960554C3
DE1960554C3 DE1960554A DE1960554A DE1960554C3 DE 1960554 C3 DE1960554 C3 DE 1960554C3 DE 1960554 A DE1960554 A DE 1960554A DE 1960554 A DE1960554 A DE 1960554A DE 1960554 C3 DE1960554 C3 DE 1960554C3
Authority
DE
Germany
Prior art keywords
layer
circuit
mask
layers
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1960554A
Other languages
German (de)
English (en)
Other versions
DE1960554A1 (de
DE1960554B2 (de
Inventor
James Frederick Emmaus Pa. Schneck (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE1960554A1 publication Critical patent/DE1960554A1/de
Publication of DE1960554B2 publication Critical patent/DE1960554B2/de
Application granted granted Critical
Publication of DE1960554C3 publication Critical patent/DE1960554C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE1960554A 1968-12-06 1969-12-03 Herstellung von Dünnschicht-Schaltungen Expired DE1960554C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78181768A 1968-12-06 1968-12-06

Publications (3)

Publication Number Publication Date
DE1960554A1 DE1960554A1 (de) 1970-07-09
DE1960554B2 DE1960554B2 (de) 1971-07-08
DE1960554C3 true DE1960554C3 (de) 1974-08-22

Family

ID=25124033

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1960554A Expired DE1960554C3 (de) 1968-12-06 1969-12-03 Herstellung von Dünnschicht-Schaltungen

Country Status (7)

Country Link
US (1) US3649392A (enExample)
BE (1) BE742697A (enExample)
DE (1) DE1960554C3 (enExample)
FR (1) FR2025569A1 (enExample)
GB (1) GB1284109A (enExample)
NL (1) NL144811B (enExample)
SE (1) SE362774B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004053336B4 (de) * 2003-11-07 2011-06-22 MEC Co., Ltd., Hyogo Wässrige Ätzmittellösung für Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium sowie Verwendung zur Herstellung von Leiterplatten

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3883947A (en) * 1971-11-05 1975-05-20 Bosch Gmbh Robert Method of making a thin film electronic circuit unit
US3907620A (en) * 1973-06-27 1975-09-23 Hewlett Packard Co A process of forming metallization structures on semiconductor devices
DE2710004A1 (de) * 1977-03-08 1978-09-14 Bosch Gmbh Robert Kraftstoffeinspritzduese
DE3139670A1 (de) * 1981-10-06 1983-04-21 Robert Bosch Gmbh, 7000 Stuttgart Elektronische duennschichtschaltung und deren herstellungsverfahren
US4435498A (en) 1981-12-07 1984-03-06 Burroughs Corporation Manufacture of wafer-scale integrated circuits
FR2532472B1 (fr) * 1982-08-31 1985-12-20 Lignes Telegraph Telephon Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions
US4847138A (en) * 1987-10-07 1989-07-11 Corning Glass Works Thermal writing on glass and glass-ceramic substrates
CN114245569B (zh) * 2022-01-11 2023-06-23 刘良江 一种lcp基高频超高频柔性线路板制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004053336B4 (de) * 2003-11-07 2011-06-22 MEC Co., Ltd., Hyogo Wässrige Ätzmittellösung für Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium sowie Verwendung zur Herstellung von Leiterplatten

Also Published As

Publication number Publication date
NL144811B (nl) 1975-01-15
FR2025569A1 (enExample) 1970-09-11
US3649392A (en) 1972-03-14
BE742697A (enExample) 1970-05-14
NL6918164A (enExample) 1970-06-09
DE1960554A1 (de) 1970-07-09
GB1284109A (en) 1972-08-02
SE362774B (enExample) 1973-12-17
DE1960554B2 (de) 1971-07-08

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee