DE19527027C2 - Doppelüberlagerungstuner - Google Patents
DoppelüberlagerungstunerInfo
- Publication number
- DE19527027C2 DE19527027C2 DE19527027A DE19527027A DE19527027C2 DE 19527027 C2 DE19527027 C2 DE 19527027C2 DE 19527027 A DE19527027 A DE 19527027A DE 19527027 A DE19527027 A DE 19527027A DE 19527027 C2 DE19527027 C2 DE 19527027C2
- Authority
- DE
- Germany
- Prior art keywords
- metal chassis
- tuner
- solder
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000009977 dual effect Effects 0.000 title description 2
- 239000002184 metal Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 238000005476 soldering Methods 0.000 claims description 24
- 210000000078 claw Anatomy 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 44
- 230000005855 radiation Effects 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
- H03D7/00—Transference of modulation from one carrier to another, e.g. frequency-changing
- H03D7/16—Multiple-frequency-changing
- H03D7/161—Multiple-frequency-changing all the frequency changers being connected in cascade
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/08—Constructional details, e.g. cabinet
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Receivers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17553394A JP3153711B2 (ja) | 1994-07-27 | 1994-07-27 | アップダウンチューナ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19527027A1 DE19527027A1 (de) | 1996-02-01 |
| DE19527027C2 true DE19527027C2 (de) | 1998-08-27 |
Family
ID=15997742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19527027A Expired - Fee Related DE19527027C2 (de) | 1994-07-27 | 1995-07-24 | Doppelüberlagerungstuner |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5668701A (en:Method) |
| JP (1) | JP3153711B2 (en:Method) |
| KR (1) | KR100187389B1 (en:Method) |
| DE (1) | DE19527027C2 (en:Method) |
| TW (1) | TW274657B (en:Method) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3427041B2 (ja) | 1994-07-27 | 2003-07-14 | シャープ株式会社 | アップダウンチューナ |
| JPH09307202A (ja) * | 1996-05-20 | 1997-11-28 | Mitsubishi Electric Corp | 混成集積回路 |
| JP3135877B2 (ja) * | 1997-11-27 | 2001-02-19 | シャープ株式会社 | Ｕｐ／Ｄｏｗｎチューナ |
| DE69930681T2 (de) | 1998-01-23 | 2006-08-31 | Matsushita Electric Industrial Co., Ltd., Kadoma | Abstimmbarer Demodulator für digital modulierte RF-Signale |
| US6049466A (en) * | 1998-03-20 | 2000-04-11 | Ford Motor Company | Substrate with embedded member for improving solder joint strength |
| EP1087651A1 (en) * | 1999-09-21 | 2001-03-28 | Lucent Technologies Inc. | Screen on circuit board, and process for its production |
| JP3875458B2 (ja) * | 2000-06-30 | 2007-01-31 | 株式会社東芝 | 送受信一体型高周波装置 |
| EP1384320B1 (en) * | 2001-05-03 | 2015-03-04 | Thomson Licensing | Method and apparatus for reducing electromagnetic radiation |
| KR101015689B1 (ko) * | 2002-07-25 | 2011-02-22 | 소니 주식회사 | 수신 장치 및 텔레비전 수상기 |
| US20060034063A1 (en) * | 2002-11-08 | 2006-02-16 | Kwong Kam C | High-frequency device |
| JP4113016B2 (ja) * | 2003-03-13 | 2008-07-02 | アルプス電気株式会社 | チューナ装置 |
| JP3100214U (ja) * | 2003-09-03 | 2004-05-13 | アルプス電気株式会社 | テレビジョンチューナ |
| JP4616775B2 (ja) * | 2006-01-26 | 2011-01-19 | ホシデン株式会社 | シールド端子 |
| JP4580884B2 (ja) * | 2006-03-17 | 2010-11-17 | アルプス電気株式会社 | 回路基板と枠体の接続構造 |
| TWI351115B (en) | 2007-05-18 | 2011-10-21 | Everlight Electronics Co Ltd | Light-emitting diode module and the manufacturing method thereof |
| US8064210B2 (en) * | 2008-10-16 | 2011-11-22 | Airtronics Metal Products, Inc. | One piece card guide for a printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903169A (en) * | 1986-04-03 | 1990-02-20 | Matsushita Electric Industrial Co., Ltd. | Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109362U (ja) * | 1983-12-28 | 1985-07-25 | アルプス電気株式会社 | 多層プリント基板のア−ス構造 |
| JP2936833B2 (ja) * | 1991-10-02 | 1999-08-23 | 株式会社村田製作所 | 表面実装型電子部品 |
-
1994
- 1994-07-27 JP JP17553394A patent/JP3153711B2/ja not_active Expired - Fee Related
-
1995
- 1995-07-12 TW TW084107197A patent/TW274657B/zh active
- 1995-07-24 DE DE19527027A patent/DE19527027C2/de not_active Expired - Fee Related
- 1995-07-25 KR KR1019950023034A patent/KR100187389B1/ko not_active Expired - Fee Related
- 1995-07-27 US US08/508,046 patent/US5668701A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903169A (en) * | 1986-04-03 | 1990-02-20 | Matsushita Electric Industrial Co., Ltd. | Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19527027A1 (de) | 1996-02-01 |
| JPH0846383A (ja) | 1996-02-16 |
| KR960006727A (ko) | 1996-02-23 |
| KR100187389B1 (ko) | 1999-05-15 |
| TW274657B (en:Method) | 1996-04-21 |
| US5668701A (en) | 1997-09-16 |
| JP3153711B2 (ja) | 2001-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8128 | New person/name/address of the agent |
Representative=s name: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20110201 |