DE19515188C2 - Chip-Abdeckung - Google Patents

Chip-Abdeckung

Info

Publication number
DE19515188C2
DE19515188C2 DE19515188A DE19515188A DE19515188C2 DE 19515188 C2 DE19515188 C2 DE 19515188C2 DE 19515188 A DE19515188 A DE 19515188A DE 19515188 A DE19515188 A DE 19515188A DE 19515188 C2 DE19515188 C2 DE 19515188C2
Authority
DE
Germany
Prior art keywords
chip
cover according
chip cover
activator
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19515188A
Other languages
German (de)
English (en)
Other versions
DE19515188A1 (de
Inventor
Christine Niederle
Peter Stampka
Hans-Hinnerk Steckhan
Josef Michael Kirschbauer
Detlef Dr Ing Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19515188A priority Critical patent/DE19515188C2/de
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to JP8532078A priority patent/JPH11504164A/ja
Priority to PCT/DE1996/000616 priority patent/WO1996034409A1/de
Priority to KR1019970707692A priority patent/KR100407042B1/ko
Priority to CNB961934808A priority patent/CN1135616C/zh
Priority to EP96908022A priority patent/EP0823129A1/de
Priority to RU97119080/28A priority patent/RU2164720C2/ru
Priority to IN692CA1996 priority patent/IN188645B/en
Priority to UA97105206A priority patent/UA57704C2/uk
Publication of DE19515188A1 publication Critical patent/DE19515188A1/de
Priority to US08/958,261 priority patent/US5883429A/en
Application granted granted Critical
Publication of DE19515188C2 publication Critical patent/DE19515188C2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Storage Device Security (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19515188A 1995-04-25 1995-04-25 Chip-Abdeckung Expired - Lifetime DE19515188C2 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE19515188A DE19515188C2 (de) 1995-04-25 1995-04-25 Chip-Abdeckung
PCT/DE1996/000616 WO1996034409A1 (de) 1995-04-25 1996-04-09 Chip-abdeckung
KR1019970707692A KR100407042B1 (ko) 1995-04-25 1996-04-09 칩커버
CNB961934808A CN1135616C (zh) 1995-04-25 1996-04-09 芯片罩盖
EP96908022A EP0823129A1 (de) 1995-04-25 1996-04-09 Chip-abdeckung
RU97119080/28A RU2164720C2 (ru) 1995-04-25 1996-04-09 Покрытие кристалла интегральной схемы
JP8532078A JPH11504164A (ja) 1995-04-25 1996-04-09 チップカバー
IN692CA1996 IN188645B (enExample) 1995-04-25 1996-04-16
UA97105206A UA57704C2 (uk) 1995-04-25 1996-09-04 Оболонка кристала інтегральної схеми
US08/958,261 US5883429A (en) 1995-04-25 1997-10-27 Chip cover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19515188A DE19515188C2 (de) 1995-04-25 1995-04-25 Chip-Abdeckung

Publications (2)

Publication Number Publication Date
DE19515188A1 DE19515188A1 (de) 1996-11-07
DE19515188C2 true DE19515188C2 (de) 1998-02-19

Family

ID=7760323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19515188A Expired - Lifetime DE19515188C2 (de) 1995-04-25 1995-04-25 Chip-Abdeckung

Country Status (9)

Country Link
EP (1) EP0823129A1 (enExample)
JP (1) JPH11504164A (enExample)
KR (1) KR100407042B1 (enExample)
CN (1) CN1135616C (enExample)
DE (1) DE19515188C2 (enExample)
IN (1) IN188645B (enExample)
RU (1) RU2164720C2 (enExample)
UA (1) UA57704C2 (enExample)
WO (1) WO1996034409A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19841498A1 (de) * 1998-09-10 2000-03-23 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7739520B2 (en) 2001-02-09 2010-06-15 Infineon Technologies Ag Data processing device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1041482A1 (de) * 1999-03-26 2000-10-04 Siemens Aktiengesellschaft Manipulationssichere integrierte Schaltung
DE19957120A1 (de) * 1999-11-26 2001-05-31 Infineon Technologies Ag Vertikal integrierte Schaltungsanordnung und Verfahren zum Betreiben einer vertikal integrierten Schaltungsanordnung
DE10131014C1 (de) * 2001-06-27 2002-09-05 Infineon Technologies Ag Gegen Analyse geschütztes Halbleiterbauelement und zugehöriges Herstellungsverfahren
FR2872610B1 (fr) * 2004-07-02 2007-06-08 Commissariat Energie Atomique Dispositif de securisation de composants
JP5194932B2 (ja) * 2008-03-26 2013-05-08 富士通セミコンダクター株式会社 半導体装置および半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3602960C1 (de) * 1986-01-31 1987-02-19 Philips Patentverwaltung Dickschicht-Schaltungsanordnung mit einer keramischen Substratplatte
DE4138665A1 (de) * 1990-11-28 1992-06-04 Mitsubishi Electric Corp Halbleitereinrichtung und gehaeuse

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725671A (en) * 1970-11-02 1973-04-03 Us Navy Pyrotechnic eradication of microcircuits
WO1991005306A1 (en) * 1989-10-03 1991-04-18 University Of Technology, Sydney Electro-active cradle circuits for the detection of access or penetration
RU2024110C1 (ru) * 1991-04-10 1994-11-30 Научно-исследовательский институт точной технологии Интегральная микросхема
US5072331A (en) * 1991-04-26 1991-12-10 Hughes Aircraft Company Secure circuit structure
US5233563A (en) * 1992-01-13 1993-08-03 Ncr Corporation Memory security device
US5389738A (en) * 1992-05-04 1995-02-14 Motorola, Inc. Tamperproof arrangement for an integrated circuit device
US5399441A (en) * 1994-04-12 1995-03-21 Dow Corning Corporation Method of applying opaque coatings

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3602960C1 (de) * 1986-01-31 1987-02-19 Philips Patentverwaltung Dickschicht-Schaltungsanordnung mit einer keramischen Substratplatte
DE4138665A1 (de) * 1990-11-28 1992-06-04 Mitsubishi Electric Corp Halbleitereinrichtung und gehaeuse

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Components Bd. 32 (1994) Heft 4, S. 106-110 *
IBM Technical Disclosure Bulletin Bd. 32, Nr. 7, (1989), S. 183-184 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19841498A1 (de) * 1998-09-10 2000-03-23 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7739520B2 (en) 2001-02-09 2010-06-15 Infineon Technologies Ag Data processing device

Also Published As

Publication number Publication date
CN1182499A (zh) 1998-05-20
IN188645B (enExample) 2002-10-26
KR19990008167A (ko) 1999-01-25
UA57704C2 (uk) 2003-07-15
KR100407042B1 (ko) 2004-02-18
JPH11504164A (ja) 1999-04-06
DE19515188A1 (de) 1996-11-07
WO1996034409A1 (de) 1996-10-31
RU2164720C2 (ru) 2001-03-27
EP0823129A1 (de) 1998-02-11
CN1135616C (zh) 2004-01-21

Similar Documents

Publication Publication Date Title
DE3635938C2 (enExample)
EP1054316B1 (de) Vorrichtung zur Sicherung elektronischer Schaltungen gegen unberechtigten Zugang
DE69504208T2 (de) Sicherheitsvorrichtung mit einem elektronischen speicher
EP1182702B1 (de) Vorrichtung zum Schutz einer integrierten Schaltung
DE102013108015A1 (de) Sicherheitshülle mit zerbrechlichen Leitern
DE102013108016A1 (de) Sicherheitshülle
DE68921057T2 (de) Schutzvorrichtung für eine elektronische Karte und Verwendung zum Schutz eines Abtastterminals für eine Magnet- und/oder Mikroprozessor-Karte.
DE3730554A1 (de) Sicherheitseinrichtung fuer sensitive daten
DE102013108017A1 (de) Mehrschichtige Sicherheitshülle
DE4115703C1 (enExample)
DE102013114293A1 (de) Elektronische Vorrichtung mit manipulationsbeständiger Umhüllung
DE19515188A1 (de) Chip-Abdeckung
DE69223073T2 (de) Datensicherheitsvorrichtung
DE29722653U1 (de) Manipulationsgeschütztes elektrisches Gerät
EP1323015A1 (de) Sicherheitsmodul
EP2210221B1 (de) Herstellen eines portablen datenträgers
EP1746872B1 (de) Leiterplattenanordnung und Verfahren zu deren Herstellung
DE4305849C2 (de) Nichtflüchtige Speichervorrichtung mit einer Polyimid-Maskenschicht
DE19515187A1 (de) Chip-Abdeckung
EP1058178B1 (de) Schutzschaltung
DE102010033662A1 (de) Schutzstruktur einer elektronischen Komponente
EP2195760A1 (de) Schutzanordnung und herstellungsverfahren für eine schutzanordnung
DE10141484A1 (de) Schreibschutzsteuerung für elektronische Baugruppe
DE19515189A1 (de) Chip-Abdeckung
DE102008012572A1 (de) Leiterbahnanordnung zum Kontaktieren elektronischer Bauteile

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
R081 Change of applicant/patentee

Owner name: INFINEON TECHNOLOGIES AG, DE

Free format text: FORMER OWNER: SIEMENS AKTIENGESELLSCHAFT, 80333 MUENCHEN, DE

Effective date: 20111107

R071 Expiry of right
R071 Expiry of right