DE1938316B2 - Halbleiterbauelement mit empfindlichkeit fuer mechanische spannungen - Google Patents

Halbleiterbauelement mit empfindlichkeit fuer mechanische spannungen

Info

Publication number
DE1938316B2
DE1938316B2 DE19691938316 DE1938316A DE1938316B2 DE 1938316 B2 DE1938316 B2 DE 1938316B2 DE 19691938316 DE19691938316 DE 19691938316 DE 1938316 A DE1938316 A DE 1938316A DE 1938316 B2 DE1938316 B2 DE 1938316B2
Authority
DE
Germany
Prior art keywords
sensitivity
semiconductor component
mechanical voltages
voltages
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19691938316
Other languages
English (en)
Other versions
DE1938316A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1938316A1 publication Critical patent/DE1938316A1/de
Publication of DE1938316B2 publication Critical patent/DE1938316B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DE19691938316 1968-07-29 1969-07-28 Halbleiterbauelement mit empfindlichkeit fuer mechanische spannungen Withdrawn DE1938316B2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5415068 1968-07-29
JP8574968 1968-11-20
JP3181969 1969-04-17

Publications (2)

Publication Number Publication Date
DE1938316A1 DE1938316A1 (de) 1970-09-24
DE1938316B2 true DE1938316B2 (de) 1971-06-24

Family

ID=27287480

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691938316 Withdrawn DE1938316B2 (de) 1968-07-29 1969-07-28 Halbleiterbauelement mit empfindlichkeit fuer mechanische spannungen

Country Status (5)

Country Link
US (1) US3699405A (de)
DE (1) DE1938316B2 (de)
FR (1) FR2014764B1 (de)
GB (1) GB1220436A (de)
NL (1) NL142826B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033457B4 (de) 2004-07-05 2007-12-20 Visteon Global Technologies, Inc., Dearborn Verbundwerkstoff aus einer hochfesten Aluminiumlegierung
DE102005059309A1 (de) * 2005-12-09 2007-11-22 Hydro Aluminium Mandl&Berger Gmbh Aus mindestens zwei vorgegossenen Abschnitten zusammengesetztes Bauteil und Verfahren zu seiner Herstellung
CN100561153C (zh) * 2007-12-24 2009-11-18 中国水电顾问集团中南勘测设计研究院 摩阻力计及其测试方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3215568A (en) * 1960-07-18 1965-11-02 Bell Telephone Labor Inc Semiconductor devices
FR1354527A (fr) * 1962-04-14 1964-03-06 Toko Radio Coil Kenkyusho Kk Filtre électro-mécanique
NL6700819A (de) * 1966-03-14 1967-09-15
US3550094A (en) * 1968-04-01 1970-12-22 Gen Electric Semiconductor data storage apparatus with electron beam readout
US3532910A (en) * 1968-07-29 1970-10-06 Bell Telephone Labor Inc Increasing the power output of certain diodes

Also Published As

Publication number Publication date
FR2014764A1 (de) 1970-04-17
GB1220436A (en) 1971-01-27
US3699405A (en) 1972-10-17
DE1938316A1 (de) 1970-09-24
NL142826B (nl) 1974-07-15
NL6911529A (de) 1970-02-02
FR2014764B1 (de) 1974-05-03

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Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee