DE1907017B2 - Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen - Google Patents

Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen

Info

Publication number
DE1907017B2
DE1907017B2 DE19691907017 DE1907017A DE1907017B2 DE 1907017 B2 DE1907017 B2 DE 1907017B2 DE 19691907017 DE19691907017 DE 19691907017 DE 1907017 A DE1907017 A DE 1907017A DE 1907017 B2 DE1907017 B2 DE 1907017B2
Authority
DE
Germany
Prior art keywords
powder
resin
coefficient
powdery
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691907017
Other languages
German (de)
English (en)
Other versions
DE1907017A1 (de
Inventor
Michio; Watanabe Yutaka; Suzuki Hiroshi;Kitamura Masahiro; Hitachi; Mori Yoshisuke Shimodate; Tsukui (Japan)
Original Assignee
Hitachi Ltd.; Hitachi Chemical Co. Ltd.; Tokio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3289668A external-priority patent/JPS52975B1/ja
Priority claimed from JP8525468A external-priority patent/JPS548696B1/ja
Priority claimed from JP8525368A external-priority patent/JPS5120541B1/ja
Application filed by Hitachi Ltd.; Hitachi Chemical Co. Ltd.; Tokio filed Critical Hitachi Ltd.; Hitachi Chemical Co. Ltd.; Tokio
Publication of DE1907017A1 publication Critical patent/DE1907017A1/de
Publication of DE1907017B2 publication Critical patent/DE1907017B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
  • Resistance Heating (AREA)
DE19691907017 1968-02-14 1969-02-12 Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen Pending DE1907017B2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP954968 1968-02-14
JP3289668A JPS52975B1 (enExample) 1968-05-17 1968-05-17
JP3400368 1968-05-22
JP8525468A JPS548696B1 (enExample) 1968-11-22 1968-11-22
JP8525368A JPS5120541B1 (enExample) 1968-11-22 1968-11-22

Publications (2)

Publication Number Publication Date
DE1907017A1 DE1907017A1 (de) 1971-06-16
DE1907017B2 true DE1907017B2 (de) 1976-04-15

Family

ID=27519077

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691907017 Pending DE1907017B2 (de) 1968-02-14 1969-02-12 Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen

Country Status (4)

Country Link
DE (1) DE1907017B2 (enExample)
FR (1) FR2001918A1 (enExample)
GB (1) GB1252601A (enExample)
NL (1) NL6902369A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2164100A1 (de) * 1971-12-23 1973-06-28 Semikron Gleichrichterbau Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen
IE45857B1 (en) 1976-05-24 1982-12-15 Kroyer K K K Moulding compositions comprising glass particles and a polymeric binder
JPH03157448A (ja) * 1989-11-15 1991-07-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
US5397401A (en) * 1992-06-29 1995-03-14 Canon Kabushiki Kaisha Semiconductor apparatus covered with a sealing resin composition
DE602005026215D1 (de) * 2004-07-13 2011-03-17 Areva T & D Sas Verfahren zur herstellung eines isolators für hochspannungsanwendungen

Also Published As

Publication number Publication date
NL6902369A (enExample) 1969-08-18
DE1907017A1 (de) 1971-06-16
GB1252601A (enExample) 1971-11-10
FR2001918A1 (enExample) 1969-10-03

Similar Documents

Publication Publication Date Title
DE112008002566B4 (de) Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul
DE112014002796B4 (de) Wärmehärtbare Harzzusammensetzung, Verfahren zur Herstellung einer wärmeleitenden Folie und Leistungsmodul
DE112004001768B4 (de) Gemischtes leitendes Pulver und dessen Verwendung
DE60200279T2 (de) Epoxidharzzusammensetzung zum Verkapseln von Halbleiterbauteilen sowie Halbleiterbauteil, welches von der Zusammensetzung Gebrauch macht
DE2713299C2 (de) Dynamoelektrische Maschine mit in eine gefüllte Harzmasse eingebetteten Wicklungen und Kern
DE4006153C2 (de) Epoxidharzmassen und deren Verwendung zum Einkapseln von Halbleiterbauelementen
DE60224957T2 (de) Harzzusammensetzung zur Einkapselung von Halbleitern und diese enthaltende Halbleiteranordnungen
DE19701771A1 (de) Melaminborat-Teilchen, Verfahren zu deren Herstellung und ihre Verwendung sowie Verfahren zum Herstellen von hexagonalem Bornitrid-Pulver
DE112010005303T5 (de) Wärmehärtende Kunstharzzusammensetzung, B-Stufen Wärmeleitfähigkeitsschicht und Leistungsmodul
DE2916954A1 (de) In kunststoff eingebettete halbleitervorrichtung
DE2705905A1 (de) Ungesaettigte polyesterharzmasse
DE112018003560T5 (de) Elektrisch leitende Klebstoffzusammensetzung
DE3302552A1 (de) Elektrisch leitendes element, verfahren zu dessen herstellung und verwendung desselben
DE112014001422B4 (de) Herstellen eines Leistungsmoduls mittels eines Spritzpressverfahrens
DE60118276T2 (de) Wärmeleitendes Material und Verfahren zu seiner Herstellung
DE1907017B2 (de) Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen
WO2004065469A1 (de) Hochgefülltes giessharzsystem
DE102019204191A1 (de) Gießharz, Formstoff daraus, Verwendung dazu und eine elektrische Isolierung
EP3334779A1 (de) Kunststoffzusammensetzung, herstellungsverfahren und verwendung
KR20190027089A (ko) 무기나노입자 분산을 통해 열전도도가 향상된 나노복합절연소재 및 그 제조방법
EP1478688A1 (de) Hochgefülltes giessharzsystem
DE102021131621B4 (de) Verbindungsmaterial zum verbinden sich überlappender komponenten von leistungselektronischen geräten
DE202023105362U1 (de) Beryl-Ceroxid-Hybridmetall-Matrix-Verbundwerkstoff
DE112019000487T5 (de) Elektroleitende Adhäsiv-Zusammensetzung, gehärtetes Produkt eines elektro-leitenden Adhäsivs und elektronische Vorrichtung
EP0579088A1 (de) Verfahren zur Herstellung einer magnetisierbaren Füllstoff enthaltenden Epoxidharzmasse