DE1627596A1 - Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik - Google Patents

Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik

Info

Publication number
DE1627596A1
DE1627596A1 DE19671627596 DE1627596A DE1627596A1 DE 1627596 A1 DE1627596 A1 DE 1627596A1 DE 19671627596 DE19671627596 DE 19671627596 DE 1627596 A DE1627596 A DE 1627596A DE 1627596 A1 DE1627596 A1 DE 1627596A1
Authority
DE
Germany
Prior art keywords
solder
tinning
soldering
conductor tracks
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19671627596
Other languages
German (de)
English (en)
Inventor
Friedrich Dipl-Ing Krieger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of DE1627596A1 publication Critical patent/DE1627596A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19671627596 1967-02-24 1967-02-24 Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik Pending DE1627596A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0108491 1967-02-24

Publications (1)

Publication Number Publication Date
DE1627596A1 true DE1627596A1 (de) 1971-07-15

Family

ID=7528838

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19671627596 Pending DE1627596A1 (de) 1967-02-24 1967-02-24 Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik

Country Status (10)

Country Link
US (1) US3554793A (enExample)
AT (1) AT270783B (enExample)
BE (1) BE711211A (enExample)
CH (1) CH470816A (enExample)
DE (1) DE1627596A1 (enExample)
DK (1) DK125573B (enExample)
FR (1) FR1556554A (enExample)
GB (1) GB1221231A (enExample)
NL (1) NL6801371A (enExample)
SE (1) SE339159B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3311137A1 (de) * 1983-03-26 1984-09-27 Helmut 6487 Flörsbachtal Wicher Anordnung zur verbindung eines elektronischen bauelementes mit der platine eines elektronischen geraetes
CN111715999A (zh) * 2020-05-28 2020-09-29 南昌欧菲显示科技有限公司 半导体器件焊接装置及半导体器件焊接方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
US4493856A (en) * 1982-03-18 1985-01-15 International Business Machines Corporation Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4504322A (en) * 1982-10-20 1985-03-12 International Business Machines Corporation Re-work method for removing extraneous metal from cermic substrates
US11304310B1 (en) 2020-10-13 2022-04-12 Macronix International Co., Ltd. Method of fabricating circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3311137A1 (de) * 1983-03-26 1984-09-27 Helmut 6487 Flörsbachtal Wicher Anordnung zur verbindung eines elektronischen bauelementes mit der platine eines elektronischen geraetes
CN111715999A (zh) * 2020-05-28 2020-09-29 南昌欧菲显示科技有限公司 半导体器件焊接装置及半导体器件焊接方法

Also Published As

Publication number Publication date
BE711211A (enExample) 1968-08-23
FR1556554A (enExample) 1969-02-07
CH470816A (de) 1969-03-31
NL6801371A (enExample) 1968-08-26
DK125573B (da) 1973-03-12
AT270783B (de) 1969-05-12
SE339159B (enExample) 1971-09-27
GB1221231A (en) 1971-02-03
US3554793A (en) 1971-01-12

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