DE1590251A1 - Mit einer Umhuellung versehene elektrische Vorrichtung und Verfahren zu ihrer Herstellung - Google Patents

Mit einer Umhuellung versehene elektrische Vorrichtung und Verfahren zu ihrer Herstellung

Info

Publication number
DE1590251A1
DE1590251A1 DE19661590251 DE1590251A DE1590251A1 DE 1590251 A1 DE1590251 A1 DE 1590251A1 DE 19661590251 DE19661590251 DE 19661590251 DE 1590251 A DE1590251 A DE 1590251A DE 1590251 A1 DE1590251 A1 DE 1590251A1
Authority
DE
Germany
Prior art keywords
layer
carrier
vitreous material
sio
total amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19661590251
Other languages
German (de)
English (en)
Inventor
Tarcza Walter Howard
Asher John Walker
Martin Francis Willis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of DE1590251A1 publication Critical patent/DE1590251A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • H10W90/00—
    • H10W95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19661590251 1965-08-10 1966-08-09 Mit einer Umhuellung versehene elektrische Vorrichtung und Verfahren zu ihrer Herstellung Pending DE1590251A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US478690A US3405441A (en) 1965-08-10 1965-08-10 Method of enclosing an electrical device

Publications (1)

Publication Number Publication Date
DE1590251A1 true DE1590251A1 (de) 1970-05-14

Family

ID=23900984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661590251 Pending DE1590251A1 (de) 1965-08-10 1966-08-09 Mit einer Umhuellung versehene elektrische Vorrichtung und Verfahren zu ihrer Herstellung

Country Status (7)

Country Link
US (1) US3405441A (enExample)
CH (1) CH451274A (enExample)
DE (1) DE1590251A1 (enExample)
ES (2) ES123823Y (enExample)
FR (1) FR1488922A (enExample)
GB (1) GB1160732A (enExample)
NL (1) NL6611257A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672034A (en) * 1970-01-14 1972-06-27 Bell Telephone Labor Inc Method for bonding a beam-lead device to a substrate
US4063349A (en) * 1976-12-02 1977-12-20 Honeywell Information Systems Inc. Method of protecting micropackages from their environment
US5268533A (en) * 1991-05-03 1993-12-07 Hughes Aircraft Company Pre-stressed laminated lid for electronic circuit package
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105868A (en) * 1960-12-29 1963-10-01 Sylvania Electric Prod Circuit packaging module
US3187240A (en) * 1961-08-08 1965-06-01 Bell Telephone Labor Inc Semiconductor device encapsulation and method
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3178506A (en) * 1962-08-09 1965-04-13 Westinghouse Electric Corp Sealed functional molecular electronic device

Also Published As

Publication number Publication date
GB1160732A (en) 1969-08-06
ES123823Y (es) 1967-11-01
CH451274A (fr) 1968-05-15
ES330076A1 (es) 1967-06-01
FR1488922A (fr) 1967-07-13
NL6611257A (enExample) 1967-02-13
US3405441A (en) 1968-10-15
ES123823U (es) 1967-06-16

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