GB1160732A - Electrical Device Enclosure and Method - Google Patents

Electrical Device Enclosure and Method

Info

Publication number
GB1160732A
GB1160732A GB34393/66A GB3439366A GB1160732A GB 1160732 A GB1160732 A GB 1160732A GB 34393/66 A GB34393/66 A GB 34393/66A GB 3439366 A GB3439366 A GB 3439366A GB 1160732 A GB1160732 A GB 1160732A
Authority
GB
United Kingdom
Prior art keywords
substrate
electrical device
aug
stainless steel
vitreous material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34393/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of GB1160732A publication Critical patent/GB1160732A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • H10W90/00—
    • H10W95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB34393/66A 1965-08-10 1966-08-01 Electrical Device Enclosure and Method Expired GB1160732A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US478690A US3405441A (en) 1965-08-10 1965-08-10 Method of enclosing an electrical device

Publications (1)

Publication Number Publication Date
GB1160732A true GB1160732A (en) 1969-08-06

Family

ID=23900984

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34393/66A Expired GB1160732A (en) 1965-08-10 1966-08-01 Electrical Device Enclosure and Method

Country Status (7)

Country Link
US (1) US3405441A (enExample)
CH (1) CH451274A (enExample)
DE (1) DE1590251A1 (enExample)
ES (2) ES123823Y (enExample)
FR (1) FR1488922A (enExample)
GB (1) GB1160732A (enExample)
NL (1) NL6611257A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672034A (en) * 1970-01-14 1972-06-27 Bell Telephone Labor Inc Method for bonding a beam-lead device to a substrate
US4063349A (en) * 1976-12-02 1977-12-20 Honeywell Information Systems Inc. Method of protecting micropackages from their environment
US5268533A (en) * 1991-05-03 1993-12-07 Hughes Aircraft Company Pre-stressed laminated lid for electronic circuit package
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105868A (en) * 1960-12-29 1963-10-01 Sylvania Electric Prod Circuit packaging module
US3187240A (en) * 1961-08-08 1965-06-01 Bell Telephone Labor Inc Semiconductor device encapsulation and method
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3178506A (en) * 1962-08-09 1965-04-13 Westinghouse Electric Corp Sealed functional molecular electronic device

Also Published As

Publication number Publication date
ES123823Y (es) 1967-11-01
CH451274A (fr) 1968-05-15
ES330076A1 (es) 1967-06-01
FR1488922A (fr) 1967-07-13
DE1590251A1 (de) 1970-05-14
NL6611257A (enExample) 1967-02-13
US3405441A (en) 1968-10-15
ES123823U (es) 1967-06-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees