GB1160753A - Electrical Device Enclosure and Method - Google Patents

Electrical Device Enclosure and Method

Info

Publication number
GB1160753A
GB1160753A GB3439466A GB3439466A GB1160753A GB 1160753 A GB1160753 A GB 1160753A GB 3439466 A GB3439466 A GB 3439466A GB 3439466 A GB3439466 A GB 3439466A GB 1160753 A GB1160753 A GB 1160753A
Authority
GB
United Kingdom
Prior art keywords
ring
substrate
aug
ceramic
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3439466A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of GB1160753A publication Critical patent/GB1160753A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Laminated Bodies (AREA)

Abstract

1,160,753. Ceramic-metal seals. CORNING GLASS WORKS. 1 Aug., 1966 [10 Aug., 1965], No. 34394/66. Heading B3V. [Also in Division C1] An electrical resistance 16 on a dielectric substrate 18 has an aluminium ring 22 sealed thereto by a snatched vitreous seal 24 and, after adjustment of the resistance in known manner, a metal (aluminium) sheet 26 is hermetically bonded to the ring by ultrasonic welding or other means at a temperature of less than 250‹ C. The vitreous material is coated on one surface of the ring which is then placed on the substrate and bonded thereto by a tool heated, e.g. by induction heating. The ring 22 and sheet 26 may also be of copper, nickel or stainless steel. The substrate may be of alumina beryllia or other ceramic.
GB3439466A 1965-08-10 1966-08-01 Electrical Device Enclosure and Method Expired GB1160753A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47865065A 1965-08-10 1965-08-10

Publications (1)

Publication Number Publication Date
GB1160753A true GB1160753A (en) 1969-08-06

Family

ID=23900811

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3439466A Expired GB1160753A (en) 1965-08-10 1966-08-01 Electrical Device Enclosure and Method

Country Status (5)

Country Link
JP (1) JPS4811388B1 (en)
CH (1) CH457572A (en)
ES (1) ES330075A1 (en)
GB (1) GB1160753A (en)
NL (1) NL6611136A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213492U (en) * 1975-07-18 1977-01-31
JP6618248B2 (en) * 2014-10-24 2019-12-11 Koa株式会社 Resistor and manufacturing method thereof
CN113366028A (en) 2019-01-28 2021-09-07 日本聚乙烯株式会社 Polar group-containing olefin copolymer
JPWO2021131733A1 (en) 2019-12-27 2021-07-01

Also Published As

Publication number Publication date
ES330075A1 (en) 1967-06-01
NL6611136A (en) 1967-02-13
CH457572A (en) 1968-06-15
JPS4811388B1 (en) 1973-04-12

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Legal Events

Date Code Title Description
PS Patent sealed
PLE Entries relating assignments, transmissions, licences in the register of patents
PLNP Patent lapsed through nonpayment of renewal fees