DE1539111B2 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1539111B2
DE1539111B2 DE1539111A DE1539111A DE1539111B2 DE 1539111 B2 DE1539111 B2 DE 1539111B2 DE 1539111 A DE1539111 A DE 1539111A DE 1539111 A DE1539111 A DE 1539111A DE 1539111 B2 DE1539111 B2 DE 1539111B2
Authority
DE
Germany
Prior art keywords
contact electrodes
semiconductor
base
ring
emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1539111A
Other languages
German (de)
English (en)
Other versions
DE1539111A1 (de
Inventor
Joseph Irwin Marino
William R. Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of DE1539111A1 publication Critical patent/DE1539111A1/de
Publication of DE1539111B2 publication Critical patent/DE1539111B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
DE1539111A 1965-03-01 1966-02-25 Halbleiterbauelement Pending DE1539111B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US436725A US3418543A (en) 1965-03-01 1965-03-01 Semiconductor device contact structure

Publications (2)

Publication Number Publication Date
DE1539111A1 DE1539111A1 (de) 1970-09-24
DE1539111B2 true DE1539111B2 (de) 1973-12-06

Family

ID=23733571

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1539111A Pending DE1539111B2 (de) 1965-03-01 1966-02-25 Halbleiterbauelement

Country Status (5)

Country Link
US (1) US3418543A (forum.php)
BE (1) BE677006A (forum.php)
CH (1) CH444318A (forum.php)
DE (1) DE1539111B2 (forum.php)
GB (1) GB1080632A (forum.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE333197B (sv) * 1966-12-27 1971-03-08 Asea Ab Halvledaranordning foer stora stroemstyrkor
US3519895A (en) * 1968-02-06 1970-07-07 Westinghouse Electric Corp Combination of solderless terminal assembly and semiconductor
JPH0214777B2 (forum.php) * 1979-07-04 1990-04-10 Uesuchinguhausu Bureiku Ando Shigunaru Co Ltd
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL104654C (forum.php) * 1952-12-31 1900-01-01
US2849665A (en) * 1955-10-17 1958-08-26 Westinghouse Electric Corp Ultra high power transistor
US3124640A (en) * 1960-01-20 1964-03-10 Figure
US3122680A (en) * 1960-02-25 1964-02-25 Burroughs Corp Miniaturized switching circuit
BE624264A (forum.php) * 1961-10-31 1900-01-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung

Also Published As

Publication number Publication date
DE1539111A1 (de) 1970-09-24
US3418543A (en) 1968-12-24
BE677006A (forum.php) 1966-07-18
CH444318A (de) 1967-09-30
GB1080632A (en) 1967-08-23

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