DE1254773B - Anschlusskoerper fuer Halbleiterbauelemente - Google Patents

Anschlusskoerper fuer Halbleiterbauelemente

Info

Publication number
DE1254773B
DE1254773B DES71091A DES0071091A DE1254773B DE 1254773 B DE1254773 B DE 1254773B DE S71091 A DES71091 A DE S71091A DE S0071091 A DES0071091 A DE S0071091A DE 1254773 B DE1254773 B DE 1254773B
Authority
DE
Germany
Prior art keywords
plate
shaped
connection
recesses
shaped part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES71091A
Other languages
German (de)
English (en)
Inventor
Dr Karl-Heinz Geyer
Dipl-Phys Goetz Von Bernuth
Hans-Juergen Nixdorf
August Meyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL270438D priority Critical patent/NL270438A/xx
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES71091A priority patent/DE1254773B/de
Priority to FR877460A priority patent/FR1304795A/fr
Priority to CH1261961A priority patent/CH419349A/de
Priority to GB39340/61A priority patent/GB992588A/en
Publication of DE1254773B publication Critical patent/DE1254773B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
DES71091A 1960-11-02 1960-11-02 Anschlusskoerper fuer Halbleiterbauelemente Pending DE1254773B (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL270438D NL270438A (OSRAM) 1960-11-02
DES71091A DE1254773B (de) 1960-11-02 1960-11-02 Anschlusskoerper fuer Halbleiterbauelemente
FR877460A FR1304795A (fr) 1960-11-02 1961-10-30 Corps de raccordement pour dispositifs semi-conducteurs
CH1261961A CH419349A (de) 1960-11-02 1961-10-31 Halbleiterbauelement mit einem elektrischen Anschlusskörper
GB39340/61A GB992588A (en) 1960-11-02 1961-11-02 Semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES71091A DE1254773B (de) 1960-11-02 1960-11-02 Anschlusskoerper fuer Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
DE1254773B true DE1254773B (de) 1967-11-23

Family

ID=7502230

Family Applications (1)

Application Number Title Priority Date Filing Date
DES71091A Pending DE1254773B (de) 1960-11-02 1960-11-02 Anschlusskoerper fuer Halbleiterbauelemente

Country Status (4)

Country Link
CH (1) CH419349A (OSRAM)
DE (1) DE1254773B (OSRAM)
GB (1) GB992588A (OSRAM)
NL (1) NL270438A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
EP0022359A1 (en) * 1979-07-04 1981-01-14 Westinghouse Brake And Signal Company Limited Semiconductor contact shim, attachment method and semiconductor device including a contact shim
US5739556A (en) * 1995-02-17 1998-04-14 Asea Brown Boveri Ag Pressure contact housing for semiconductor components
DE10335111A1 (de) * 2003-07-31 2005-03-10 Infineon Technologies Ag Montageverfahren für ein Halbleiterbauteil
DE102009039227B4 (de) * 2008-08-28 2015-06-18 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauelements

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326663A (en) 1978-07-20 1982-04-27 Eltec Instruments, Inc. Pyroelectric detector
US4218620A (en) 1978-07-20 1980-08-19 Eltec Instruments, Inc. Pyroelectric detector having improved suspension means
CN103056639B (zh) * 2012-12-31 2015-04-22 中国科学院自动化研究所 径向张开装置作用件的定位方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT187598B (de) * 1954-04-07 1956-11-10 Int Standard Electric Corp Kristallgleichrichter oder Kristallverstärker
FR1205947A (fr) * 1957-04-18 1960-02-05 Siemens Ag Procédé de réalisation d'une connexion entre un conducteur électrique de jonction et l'électrode d'un élément semi-conducteur et élément semi-conducteur fabriqué d'après ce procédé, avec un conducteur de jonction
FR1213484A (fr) * 1958-08-04 1960-04-01 Thomson Houston Comp Francaise Milieu conducteur non isotrope pour flux thermique intense

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT187598B (de) * 1954-04-07 1956-11-10 Int Standard Electric Corp Kristallgleichrichter oder Kristallverstärker
FR1205947A (fr) * 1957-04-18 1960-02-05 Siemens Ag Procédé de réalisation d'une connexion entre un conducteur électrique de jonction et l'électrode d'un élément semi-conducteur et élément semi-conducteur fabriqué d'après ce procédé, avec un conducteur de jonction
FR1213484A (fr) * 1958-08-04 1960-04-01 Thomson Houston Comp Francaise Milieu conducteur non isotrope pour flux thermique intense

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
EP0022359A1 (en) * 1979-07-04 1981-01-14 Westinghouse Brake And Signal Company Limited Semiconductor contact shim, attachment method and semiconductor device including a contact shim
WO1981000172A1 (en) * 1979-07-04 1981-01-22 Westinghouse Brake & Signal Semiconductor contact shim and attachment method
US5739556A (en) * 1995-02-17 1998-04-14 Asea Brown Boveri Ag Pressure contact housing for semiconductor components
DE10335111A1 (de) * 2003-07-31 2005-03-10 Infineon Technologies Ag Montageverfahren für ein Halbleiterbauteil
DE10335111B4 (de) * 2003-07-31 2006-12-28 Infineon Technologies Ag Montageverfahren für ein Halbleiterbauteil
US7323359B2 (en) 2003-07-31 2008-01-29 Infineon Technologies Ag Mounting method for a semiconductor component
DE102009039227B4 (de) * 2008-08-28 2015-06-18 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauelements

Also Published As

Publication number Publication date
NL270438A (OSRAM) 1900-01-01
GB992588A (en) 1965-05-19
CH419349A (de) 1966-08-31

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