DE1252773B - - Google Patents
Info
- Publication number
- DE1252773B DE1252773B DES81525A DE1252773DA DE1252773B DE 1252773 B DE1252773 B DE 1252773B DE S81525 A DES81525 A DE S81525A DE 1252773D A DE1252773D A DE 1252773DA DE 1252773 B DE1252773 B DE 1252773B
- Authority
- DE
- Germany
- Prior art keywords
- ribs
- carrier
- adhesive
- cable runs
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000009415 formwork Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1252773B true DE1252773B (enExample) |
Family
ID=605613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DES81525A Pending DE1252773B (enExample) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1252773B (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023905A1 (de) * | 1980-06-26 | 1982-01-14 | Adam Opel AG, 6090 Rüsselsheim | Armaturentafel fuer fahrzeuge, insbesondere kraftfahrzeuge, und verfahren zur herstellung einer solchen |
| DE3640760A1 (de) * | 1986-11-28 | 1988-06-01 | Richard Landgraf | Anordnung mit elektrischen leiterbahnen und verfahren zur herstellung der anordnung |
| DE19649116A1 (de) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Körper mit leitender Struktur, Verfahren zur Herstellung eines solchen Körpers und zugehörige Vorrichtung |
-
0
- DE DES81525A patent/DE1252773B/de active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023905A1 (de) * | 1980-06-26 | 1982-01-14 | Adam Opel AG, 6090 Rüsselsheim | Armaturentafel fuer fahrzeuge, insbesondere kraftfahrzeuge, und verfahren zur herstellung einer solchen |
| DE3640760A1 (de) * | 1986-11-28 | 1988-06-01 | Richard Landgraf | Anordnung mit elektrischen leiterbahnen und verfahren zur herstellung der anordnung |
| DE19649116A1 (de) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Körper mit leitender Struktur, Verfahren zur Herstellung eines solchen Körpers und zugehörige Vorrichtung |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE68909067T2 (de) | Heizeinheit. | |
| DE3522708A1 (de) | Leiterplatten-verbinder | |
| DE2822245A1 (de) | Verfahren zur herstellung elektrisch leitender verbindungen zwischen gedruckten rueckwandverdrahtungen von leiterplatten und federleisten sowie fuer dieses verfahren geeignete federleiste | |
| DE4138818A1 (de) | Gehaeuse mit darin angeordneten elektrischen leitungen | |
| DE2926535A1 (de) | Sockelbuchse fuer elektrische schaltungsplatten | |
| DE3032492A1 (de) | Elektrisches netzwerk und verfahren zu seiner herstellung | |
| DE1927008A1 (de) | Elektrischer oder elektronischer Einsteckbauteil fuer gedruckte Schaltungen | |
| DE1440907A1 (de) | Elektrischer Schaltungsaufbau | |
| DE2916329C3 (de) | Elektrisches Netzwerk | |
| DE1816808A1 (de) | Gedruckte Schaltung | |
| DE1252773B (enExample) | ||
| DE19955538A1 (de) | Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht | |
| DE3137279A1 (de) | Mehrlagige leiterplatte und verfahren zu deren herstellung | |
| EP0278484B1 (de) | Verfahren zur Herstellung eines Digitalisiertabletts | |
| DE2013258C3 (de) | Verfahren zur Herstellung von stiftförmigen Anschlußteilen einer gedruckten Schaltungsplatte | |
| DE3527332A1 (de) | Folie mit beidseitig aufgedruckten leiterbahnen | |
| EP0171642B1 (de) | Varistor in Chip-Bauweise zur Verwendung in gedruckten Schaltungen und Verfahren zu seiner Herstellung | |
| DE3207585A1 (de) | Verfahren zur herstellung elektrischer verbindungen zwischen den beiden oberflaechen einer leiterplatte | |
| DE3704497A1 (de) | Verfahren zur herstellung eines digitalisiertabletts | |
| DE10308663A1 (de) | Flachbandleitung mit Metall beschichten | |
| AT501429B1 (de) | Verfahren zur durchkontaktierung | |
| DE1267738B (de) | Verfahren zur Herstellung von elektrischen Verbindungen zwischen den Stromkreisen von mehrlagigen gedruckten elektrischen Schaltungen | |
| DE1540512C3 (de) | Verfahren zur Herstellung einer Mehrschicht-Letterplatte | |
| DE2623640A1 (de) | Elektrischer schichtwiderstand und verfahren zu seiner herstellung | |
| DE2708229A1 (de) | Verfahren und vorrichtung zur herstellung von mit einem oder mehreren widerstaenden bestueckten leiterplatten |