DE1252321B - - Google Patents

Info

Publication number
DE1252321B
DE1252321B DES74367A DE1252321DA DE1252321B DE 1252321 B DE1252321 B DE 1252321B DE S74367 A DES74367 A DE S74367A DE 1252321D A DE1252321D A DE 1252321DA DE 1252321 B DE1252321 B DE 1252321B
Authority
DE
Germany
Prior art keywords
semiconductor
arrangement according
encapsulation
semiconductor element
semiconductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES74367A
Other languages
German (de)
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of DE1252321B publication Critical patent/DE1252321B/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DES74367A 1961-06-16 Pending DE1252321B (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0074367 1961-06-16

Publications (1)

Publication Number Publication Date
DE1252321B true DE1252321B (fi) 1967-10-19

Family

ID=7504602

Family Applications (1)

Application Number Title Priority Date Filing Date
DES74367A Pending DE1252321B (fi) 1961-06-16

Country Status (1)

Country Link
DE (1) DE1252321B (fi)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537250A (en) * 1968-07-05 1970-11-03 Alexander W P Mackintosh Means for imparting twist to yarns
DE3042093A1 (de) * 1979-11-07 1981-05-27 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Formmasse fuer halbleitervorrichtungen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537250A (en) * 1968-07-05 1970-11-03 Alexander W P Mackintosh Means for imparting twist to yarns
DE3042093A1 (de) * 1979-11-07 1981-05-27 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Formmasse fuer halbleitervorrichtungen

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