DE112023001376T5 - Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip - Google Patents

Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip Download PDF

Info

Publication number
DE112023001376T5
DE112023001376T5 DE112023001376.4T DE112023001376T DE112023001376T5 DE 112023001376 T5 DE112023001376 T5 DE 112023001376T5 DE 112023001376 T DE112023001376 T DE 112023001376T DE 112023001376 T5 DE112023001376 T5 DE 112023001376T5
Authority
DE
Germany
Prior art keywords
wafer
unit
processing apparatus
ring structure
transporter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023001376.4T
Other languages
German (de)
English (en)
Inventor
Yoshikuni Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of DE112023001376T5 publication Critical patent/DE112023001376T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Dicing (AREA)
DE112023001376.4T 2022-04-27 2023-02-03 Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip Pending DE112023001376T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/019154 WO2023209891A1 (ja) 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ
JPPCT/JP2022/019154 2022-04-27
PCT/JP2023/003613 WO2023210089A1 (ja) 2022-04-27 2023-02-03 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Publications (1)

Publication Number Publication Date
DE112023001376T5 true DE112023001376T5 (de) 2024-12-24

Family

ID=88518315

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023001376.4T Pending DE112023001376T5 (de) 2022-04-27 2023-02-03 Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip

Country Status (7)

Country Link
US (1) US20250336705A1 (https=)
JP (1) JP7821876B2 (https=)
KR (1) KR20240151811A (https=)
CN (1) CN119013766A (https=)
DE (1) DE112023001376T5 (https=)
TW (1) TWI869826B (https=)
WO (2) WO2023209891A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0333110Y2 (https=) * 1987-03-12 1991-07-12
JP5381865B2 (ja) * 2010-03-30 2014-01-08 富士電機株式会社 ウェハ搬送装置およびウェハ搬送方法
JP5961047B2 (ja) * 2012-06-22 2016-08-02 株式会社ディスコ ウエーハの加工方法
JP2016040203A (ja) * 2015-10-09 2016-03-24 三星ダイヤモンド工業株式会社 基板反転搬送装置
WO2018135492A1 (ja) 2017-01-23 2018-07-26 東京エレクトロン株式会社 半導体基板の処理方法及び半導体基板の処理装置
JP6868447B2 (ja) * 2017-04-05 2021-05-12 株式会社ディスコ 分割装置
JP6912924B2 (ja) 2017-04-18 2021-08-04 株式会社ディスコ レーザー加工装置
WO2019188518A1 (ja) * 2018-03-30 2019-10-03 東京エレクトロン株式会社 レーザー加工装置、およびレーザー加工方法
CN211254290U (zh) 2019-09-09 2020-08-14 苏州河图电子科技有限公司 一种具有自动翻转功能的通用型电路板运输机构

Also Published As

Publication number Publication date
JPWO2023210089A1 (https=) 2023-11-02
CN119013766A (zh) 2024-11-22
US20250336705A1 (en) 2025-10-30
JP7821876B2 (ja) 2026-02-27
TWI869826B (zh) 2025-01-11
WO2023209891A1 (ja) 2023-11-02
WO2023210089A1 (ja) 2023-11-02
TW202347572A (zh) 2023-12-01
KR20240151811A (ko) 2024-10-18

Similar Documents

Publication Publication Date Title
AT515730B1 (de) Verfahren zum Bearbeiten von Wafern
DE102019206887B4 (de) Waferbearbeitungsverfahren
EP1470747B1 (de) Chipentnahmevorrichtung, bestücksystem und verfahren zum entnehmen von chips von einem wafer
DE102014206297B4 (de) Schneidvorrichtung
DE102019208260B4 (de) Waferbearbeitungsverfahren
DE102019219077B4 (de) Waferbearbeitungsverfahren
DE102019219223B4 (de) Schneidvorrichtung
DE102024129524B3 (de) System und verfahren zum polieren und schleifen von wafern
DE112007000520T5 (de) Halbleiterscheibenbearbeitungsverfahren
DE102016200527A1 (de) Laserbearbeitungsvorrichtung
DE102006035031B4 (de) Verfahren zum Bearbeiten eines Halbleiterwafers
DE112015002397T5 (de) Automatische Handhabungsvorrichtung
DE102021203017A1 (de) Beförderungsmechanismus
DE102019208259B4 (de) Waferbearbeitungsverfahren
DE102019211538B4 (de) Waferbearbeitungsverfahren
DE102019209925B4 (de) Waferbearbeitungsverfahren
DE102020201864B4 (de) Waferbearbeitungsverfahren
DE102019213500A1 (de) Waferbearbeitungsverfahren
DE112017003551B4 (de) Modulares die-handhabungssystem und die-handhabungsverfahren
DE102019217091B4 (de) Waferbearbeitungsverfahren
DE69020103T2 (de) Vorrichtung zum Laden und Abschneiden einer Halbleiterscheibe.
DE112023001376T5 (de) Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip
DE102021214707B4 (de) Bandanbringer zum anbringen eines bands an einem ringrahmen und einem wafer
DE102020200438A1 (de) Waferbearbeitungsverfahren
DE112022006517T5 (de) Dicing- bzw. Vereinzelungseinrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021677000

Ipc: H10P0072300000