DE112022003166T5 - Leistungshalbleitermodul und halbleiterbauteil - Google Patents

Leistungshalbleitermodul und halbleiterbauteil Download PDF

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Publication number
DE112022003166T5
DE112022003166T5 DE112022003166.2T DE112022003166T DE112022003166T5 DE 112022003166 T5 DE112022003166 T5 DE 112022003166T5 DE 112022003166 T DE112022003166 T DE 112022003166T DE 112022003166 T5 DE112022003166 T5 DE 112022003166T5
Authority
DE
Germany
Prior art keywords
terminals
power semiconductor
circuit
body side
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022003166.2T
Other languages
German (de)
English (en)
Inventor
Hideo Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022003166T5 publication Critical patent/DE112022003166T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
DE112022003166.2T 2021-07-29 2022-07-22 Leistungshalbleitermodul und halbleiterbauteil Pending DE112022003166T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021124283 2021-07-29
JP2021-124283 2021-07-29
PCT/JP2022/028534 WO2023008344A1 (ja) 2021-07-29 2022-07-22 パワー半導体モジュール、半導体装置

Publications (1)

Publication Number Publication Date
DE112022003166T5 true DE112022003166T5 (de) 2024-04-18

Family

ID=85086889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022003166.2T Pending DE112022003166T5 (de) 2021-07-29 2022-07-22 Leistungshalbleitermodul und halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240162123A1 (https=)
JP (1) JPWO2023008344A1 (https=)
CN (1) CN117795667A (https=)
DE (1) DE112022003166T5 (https=)
WO (1) WO2023008344A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021000527B4 (de) * 2020-03-10 2025-11-27 Rohm Co., Ltd. Elektronikbauteil

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186665A (ja) * 1990-11-19 1992-07-03 Matsushita Electric Ind Co Ltd 集積回路パッケージ
JPH05326624A (ja) * 1992-05-20 1993-12-10 Nec Corp 集積回路パッケージ
US10833595B2 (en) * 2016-07-01 2020-11-10 Rohm Co., Ltd. Semiconductor device with upper and lower switching devices and isolation transformer
CN112655087B (zh) * 2018-09-06 2024-08-13 三菱电机株式会社 功率半导体装置及其制造方法以及电力变换装置

Also Published As

Publication number Publication date
JPWO2023008344A1 (https=) 2023-02-02
WO2023008344A1 (ja) 2023-02-02
CN117795667A (zh) 2024-03-29
US20240162123A1 (en) 2024-05-16

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Legal Events

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R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023495000

Ipc: H10W0070400000