JPWO2023008344A1 - - Google Patents
Info
- Publication number
- JPWO2023008344A1 JPWO2023008344A1 JP2023538498A JP2023538498A JPWO2023008344A1 JP WO2023008344 A1 JPWO2023008344 A1 JP WO2023008344A1 JP 2023538498 A JP2023538498 A JP 2023538498A JP 2023538498 A JP2023538498 A JP 2023538498A JP WO2023008344 A1 JPWO2023008344 A1 JP WO2023008344A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/468—Circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021124283 | 2021-07-29 | ||
| PCT/JP2022/028534 WO2023008344A1 (ja) | 2021-07-29 | 2022-07-22 | パワー半導体モジュール、半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008344A1 true JPWO2023008344A1 (https=) | 2023-02-02 |
| JPWO2023008344A5 JPWO2023008344A5 (https=) | 2025-07-24 |
Family
ID=85086889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538498A Pending JPWO2023008344A1 (https=) | 2021-07-29 | 2022-07-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240162123A1 (https=) |
| JP (1) | JPWO2023008344A1 (https=) |
| CN (1) | CN117795667A (https=) |
| DE (1) | DE112022003166T5 (https=) |
| WO (1) | WO2023008344A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112021000527B4 (de) * | 2020-03-10 | 2025-11-27 | Rohm Co., Ltd. | Elektronikbauteil |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186665A (ja) * | 1990-11-19 | 1992-07-03 | Matsushita Electric Ind Co Ltd | 集積回路パッケージ |
| JPH05326624A (ja) * | 1992-05-20 | 1993-12-10 | Nec Corp | 集積回路パッケージ |
| US10833595B2 (en) * | 2016-07-01 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device with upper and lower switching devices and isolation transformer |
| CN112655087B (zh) * | 2018-09-06 | 2024-08-13 | 三菱电机株式会社 | 功率半导体装置及其制造方法以及电力变换装置 |
-
2022
- 2022-07-22 JP JP2023538498A patent/JPWO2023008344A1/ja active Pending
- 2022-07-22 WO PCT/JP2022/028534 patent/WO2023008344A1/ja not_active Ceased
- 2022-07-22 CN CN202280051715.2A patent/CN117795667A/zh active Pending
- 2022-07-22 DE DE112022003166.2T patent/DE112022003166T5/de active Pending
-
2024
- 2024-01-22 US US18/419,222 patent/US20240162123A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023008344A1 (ja) | 2023-02-02 |
| CN117795667A (zh) | 2024-03-29 |
| US20240162123A1 (en) | 2024-05-16 |
| DE112022003166T5 (de) | 2024-04-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240125 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240228 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250715 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250715 |