DE112016000248A5 - Kameramodul sowie Verfahren zur Herstellung - Google Patents

Kameramodul sowie Verfahren zur Herstellung Download PDF

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Publication number
DE112016000248A5
DE112016000248A5 DE112016000248.3T DE112016000248T DE112016000248A5 DE 112016000248 A5 DE112016000248 A5 DE 112016000248A5 DE 112016000248 T DE112016000248 T DE 112016000248T DE 112016000248 A5 DE112016000248 A5 DE 112016000248A5
Authority
DE
Germany
Prior art keywords
manufacture
camera module
camera
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112016000248.3T
Other languages
English (en)
Inventor
Boris Werthessen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Autonomous Mobility Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112016000248A5 publication Critical patent/DE112016000248A5/de
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B43/00—Testing correct operation of photographic apparatus or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
DE112016000248.3T 2015-02-05 2016-01-27 Kameramodul sowie Verfahren zur Herstellung Pending DE112016000248A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015201998.5A DE102015201998A1 (de) 2015-02-05 2015-02-05 Kameramodul sowie Verfahren zur Herstellung
DE102015201998.5 2015-02-05
PCT/DE2016/200047 WO2016124184A1 (de) 2015-02-05 2016-01-27 Kameramodul sowie verfahren zur herstellung

Publications (1)

Publication Number Publication Date
DE112016000248A5 true DE112016000248A5 (de) 2017-09-07

Family

ID=55361300

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102015201998.5A Withdrawn DE102015201998A1 (de) 2015-02-05 2015-02-05 Kameramodul sowie Verfahren zur Herstellung
DE112016000248.3T Pending DE112016000248A5 (de) 2015-02-05 2016-01-27 Kameramodul sowie Verfahren zur Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102015201998.5A Withdrawn DE102015201998A1 (de) 2015-02-05 2015-02-05 Kameramodul sowie Verfahren zur Herstellung

Country Status (4)

Country Link
US (1) US10154184B2 (de)
CN (1) CN107211082B (de)
DE (2) DE102015201998A1 (de)
WO (1) WO2016124184A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102647850B1 (ko) * 2016-11-21 2024-03-15 엘지이노텍 주식회사 카메라 모듈
JP6730239B2 (ja) * 2017-09-27 2020-07-29 京セラ株式会社 撮像装置、撮像装置の製造方法、及び移動体
DE102017124550A1 (de) 2017-10-20 2019-04-25 Connaught Electronics Ltd. Kamera für ein Kraftfahrzeug mit zumindest zwei Leiterplatten und verbesserter elektromagnetischer Abschirmung, Kamerasystem, Kraftfahrzeug sowie Herstellungsverfahren
DE102020214215A1 (de) 2020-11-12 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Ausrichtvorrichtung zum Ausrichten eines Objektivs und eines Bildsensors einer Bilderfassungseinrichtung für ein Fahrzeug, Bilderfassungsvorrichtung und Verfahren zum Herstellen einer Ausrichtvorrichtung
DE102022116003A1 (de) 2022-06-28 2023-12-28 Valeo Schalter Und Sensoren Gmbh Verfahren zum Herstellen einer Kamera-Unterbaugruppe, Kamera-Unterbaugruppe und Kraftfahrzeugkamera

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1034467B (de) 1955-10-14 1958-07-17 Kochs Adler Ag Deckel fuer Saeulennaehmaschinen
SE469864B (sv) * 1992-06-30 1993-09-27 Icl Systems Ab Anordning vid en bildavläsningsenhet
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
JPH09181287A (ja) 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
JP2000069336A (ja) * 1998-08-26 2000-03-03 Sanyo Electric Co Ltd 撮像装置の取付け構造
JP4033669B2 (ja) * 2001-12-04 2008-01-16 シャープ株式会社 カメラモジュール
CN100380924C (zh) * 2002-07-18 2008-04-09 皇家飞利浦电子股份有限公司 照相机模块,供照相机模块中使用的固定器,照相机系统以及制造照相机模块的方法
JP2004146946A (ja) * 2002-10-22 2004-05-20 Sony Corp 固体撮像装置及びその製造方法
US20050007484A1 (en) * 2003-07-10 2005-01-13 Inventec Micro-Electronic Corporation Digital image capturing module assembly and method of fabricating the same
US20050041098A1 (en) * 2003-08-18 2005-02-24 Inventec Micro-Electronics Corporation Digital image capturing module assembly and method of fabricating the same
US20050052568A1 (en) * 2003-09-10 2005-03-10 Inventec Micro-Electronics Corporation Digital image capturing module assembly and method of fabricating the same
DE10344767B4 (de) * 2003-09-26 2010-06-17 Continental Automotive Gmbh Optisches Modul und optisches System
KR101294419B1 (ko) * 2006-03-10 2013-08-08 엘지이노텍 주식회사 카메라 모듈 및 그 제조 방법
KR100831710B1 (ko) * 2006-08-17 2008-05-22 삼성전기주식회사 카메라 모듈의 조립 장치 및 그 조립 방법
DE602007013722D1 (de) * 2007-05-14 2011-05-19 Varioptic Sa Gehäuse für variable Linse
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US20110019062A1 (en) * 2008-03-27 2011-01-27 Mika Honda Optical Element Assembly, Image Pickup Module, and Method for Manufacturing Electronic Apparatus
TWM357665U (en) * 2009-01-22 2009-05-21 Quanta Comp Inc Camera module
KR20110064156A (ko) * 2009-12-07 2011-06-15 삼성전자주식회사 촬상 장치 및 그 제조방법
US8553131B2 (en) * 2010-06-03 2013-10-08 Bendix Commercial Vehicle Systems Llc Six-axis mount
KR101175869B1 (ko) * 2010-08-18 2012-08-21 삼성전기주식회사 카메라 모듈
DE102012206831A1 (de) 2012-04-25 2013-10-31 Robert Bosch Gmbh Kameramodul, insbesondere für ein Fahrzeug
KR20140019535A (ko) * 2012-08-06 2014-02-17 엘지이노텍 주식회사 카메라 모듈 및 그를 구비한 전자장치
DE102013102819A1 (de) 2013-03-19 2014-09-25 Conti Temic Microelectronic Gmbh Kameramodul sowie Verfahren zur Herstellung
US9258467B2 (en) * 2013-11-19 2016-02-09 Stmicroelectronics Pte Ltd. Camera module
US9674414B1 (en) * 2015-12-02 2017-06-06 Bendix Commercial Vehicle Systems Llc Camera module having compact camera subassembly insertable into the camera housing

Also Published As

Publication number Publication date
US20180020140A1 (en) 2018-01-18
WO2016124184A1 (de) 2016-08-11
US10154184B2 (en) 2018-12-11
CN107211082A (zh) 2017-09-26
DE102015201998A1 (de) 2016-08-11
CN107211082B (zh) 2020-05-01

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Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: CONTINENTAL AUTONOMOUS MOBILITY GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

R081 Change of applicant/patentee

Owner name: CONTINENTAL AUTONOMOUS MOBILITY GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H04N0005225000

Ipc: H04N0023000000

R012 Request for examination validly filed