DE112013006850A5 - Stereokameramodul sowie Verfahren zur Herstellung - Google Patents
Stereokameramodul sowie Verfahren zur Herstellung Download PDFInfo
- Publication number
- DE112013006850A5 DE112013006850A5 DE112013006850.8T DE112013006850T DE112013006850A5 DE 112013006850 A5 DE112013006850 A5 DE 112013006850A5 DE 112013006850 T DE112013006850 T DE 112013006850T DE 112013006850 A5 DE112013006850 A5 DE 112013006850A5
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- camera module
- stereo camera
- stereo
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
- H04N13/204—Image signal generators using stereoscopic image cameras
- H04N13/239—Image signal generators using stereoscopic image cameras using two 2D image sensors having a relative position equal to or related to the interocular distance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B35/00—Stereoscopic photography
- G03B35/08—Stereoscopic photography by simultaneous recording
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2213/00—Details of stereoscopic systems
- H04N2213/001—Constructional or mechanical details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Stereoscopic And Panoramic Photography (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013102820.9 | 2013-03-19 | ||
DE102013102820.9A DE102013102820A1 (de) | 2013-03-19 | 2013-03-19 | Stereokameramodul sowie Verfahren zur Herstellung |
PCT/DE2013/200361 WO2014146629A1 (de) | 2013-03-19 | 2013-12-12 | Stereokameramodul sowie verfahren zu dessen herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112013006850A5 true DE112013006850A5 (de) | 2015-11-26 |
Family
ID=50156519
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013102820.9A Withdrawn DE102013102820A1 (de) | 2013-03-19 | 2013-03-19 | Stereokameramodul sowie Verfahren zur Herstellung |
DE112013006850.8T Withdrawn DE112013006850A5 (de) | 2013-03-19 | 2013-12-12 | Stereokameramodul sowie Verfahren zur Herstellung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013102820.9A Withdrawn DE102013102820A1 (de) | 2013-03-19 | 2013-03-19 | Stereokameramodul sowie Verfahren zur Herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150358605A1 (de) |
EP (1) | EP2976880A1 (de) |
JP (1) | JP2016522596A (de) |
KR (1) | KR20150131059A (de) |
CN (1) | CN105191299A (de) |
DE (2) | DE102013102820A1 (de) |
WO (1) | WO2014146629A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016126243A (ja) * | 2015-01-07 | 2016-07-11 | 株式会社リコー | カメラ装置 |
TWI558200B (zh) * | 2015-02-26 | 2016-11-11 | 晶睿通訊股份有限公司 | 攝像模組及攝影裝置 |
DE102015003963A1 (de) | 2015-03-26 | 2015-08-20 | Daimler Ag | Vorrichtung und Verfahren zur Erkennung von Verkehrszeichen |
JP6722287B2 (ja) * | 2015-12-09 | 2020-07-15 | タイタン メディカル インコーポレイテッドTitan Medical Inc. | 立体撮像センサ装置及び立体撮像に用いる画像センサ対を製作するための方法 |
US10979607B2 (en) * | 2016-07-20 | 2021-04-13 | Apple Inc. | Camera apparatus and methods |
EP3432569B1 (de) * | 2016-12-27 | 2022-06-29 | Huawei Technologies Co., Ltd. | Kamerasubstratanordnung, kameramodul und endgerätvorrichtung |
CN110169048B (zh) | 2017-01-09 | 2022-07-19 | Lg伊诺特有限公司 | 双透镜驱动装置、双相机模块和光学装置 |
CN107529001B (zh) * | 2017-08-28 | 2020-07-24 | 信利光电股份有限公司 | 一种双摄像模组搭载对位方法 |
DE102017221474A1 (de) * | 2017-11-29 | 2019-05-29 | Robert Bosch Gmbh | Überwachungsmodul, Überwachungsmodulanordnung, Überwachungsanlage und Verfahren |
DE102017222708A1 (de) * | 2017-12-14 | 2019-06-19 | Conti Temic Microelectronic Gmbh | 3D-Umfelderfassung mittels Projektor und Kameramodulen |
JP7242500B2 (ja) * | 2019-10-18 | 2023-03-20 | 日立Astemo株式会社 | ステレオカメラ装置 |
CN113824857A (zh) * | 2021-08-10 | 2021-12-21 | 浙江时空道宇科技有限公司 | 一种图像采集与处理系统和空间遥感相机 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4703343A (en) | 1984-12-25 | 1987-10-27 | Matsushita Electric Industrial Co., Ltd. | Noise reduction feedback type comb filter |
US6950121B2 (en) * | 1999-12-28 | 2005-09-27 | Vrex, Inc. | 3D camera |
DE10259795A1 (de) * | 2002-12-19 | 2004-07-08 | Siemens Ag | Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges |
JP4679864B2 (ja) * | 2004-09-21 | 2011-05-11 | 富士フイルム株式会社 | ステレオカメラ、およびステレオカメラ用ステー |
JP4115981B2 (ja) * | 2004-10-06 | 2008-07-09 | 本田技研工業株式会社 | 車両用ステレオカメラの取付構造 |
JP4691508B2 (ja) * | 2004-11-15 | 2011-06-01 | 日立オートモティブシステムズ株式会社 | ステレオカメラ |
US8081207B2 (en) * | 2006-06-06 | 2011-12-20 | Point Grey Research Inc. | High accuracy stereo camera |
DE102006035232A1 (de) * | 2006-07-26 | 2008-01-31 | Robert Bosch Gmbh | Optische Messeinrichtung mit einer Bildaufnahmeeinheit |
JP5224142B2 (ja) * | 2007-11-01 | 2013-07-03 | コニカミノルタホールディングス株式会社 | 撮像装置 |
DE102007057172B4 (de) * | 2007-11-26 | 2009-07-02 | Silicon Micro Sensors Gmbh | Stereokamera zur Umgebungserfassung |
JP2009265412A (ja) * | 2008-04-25 | 2009-11-12 | Fuji Heavy Ind Ltd | ステレオカメラユニット |
JP5324946B2 (ja) * | 2008-04-25 | 2013-10-23 | 富士重工業株式会社 | ステレオカメラユニット |
DE102008035150A1 (de) * | 2008-07-28 | 2010-02-04 | Hella Kgaa Hueck & Co. | Stereokamerasystem |
DE112011100181B4 (de) * | 2010-04-21 | 2022-09-29 | Continental Autonomous Mobility Germany GmbH | Positionierung eines optischen Elements über einem Bildaufnahmeelement |
KR101149021B1 (ko) * | 2010-10-08 | 2012-05-24 | 엘지이노텍 주식회사 | 3차원 촬상장치와 그 제조방법 |
KR101182549B1 (ko) * | 2010-12-16 | 2012-09-12 | 엘지이노텍 주식회사 | 3차원 입체 카메라 모듈 |
CN102256150A (zh) * | 2011-07-14 | 2011-11-23 | 深圳市掌网立体时代视讯技术有限公司 | 一种双光路双传感器合成模组及三维成像装置 |
US9438889B2 (en) * | 2011-09-21 | 2016-09-06 | Qualcomm Incorporated | System and method for improving methods of manufacturing stereoscopic image sensors |
-
2013
- 2013-03-19 DE DE102013102820.9A patent/DE102013102820A1/de not_active Withdrawn
- 2013-12-12 KR KR1020157025766A patent/KR20150131059A/ko not_active Application Discontinuation
- 2013-12-12 US US14/759,551 patent/US20150358605A1/en not_active Abandoned
- 2013-12-12 CN CN201380074113.XA patent/CN105191299A/zh active Pending
- 2013-12-12 DE DE112013006850.8T patent/DE112013006850A5/de not_active Withdrawn
- 2013-12-12 JP JP2016503538A patent/JP2016522596A/ja active Pending
- 2013-12-12 EP EP13831851.4A patent/EP2976880A1/de not_active Ceased
- 2013-12-12 WO PCT/DE2013/200361 patent/WO2014146629A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN105191299A (zh) | 2015-12-23 |
JP2016522596A (ja) | 2016-07-28 |
KR20150131059A (ko) | 2015-11-24 |
US20150358605A1 (en) | 2015-12-10 |
DE102013102820A1 (de) | 2014-09-25 |
WO2014146629A1 (de) | 2014-09-25 |
EP2976880A1 (de) | 2016-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H04N0013020000 Ipc: H04N0013200000 |
|
R005 | Application deemed withdrawn due to failure to request examination |