DE112014003593A5 - Optoelektronischer Halbleiterchip und Anordnung mit mindestens einem solchen optoelektronischen Halbleiterchip - Google Patents

Optoelektronischer Halbleiterchip und Anordnung mit mindestens einem solchen optoelektronischen Halbleiterchip Download PDF

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Publication number
DE112014003593A5
DE112014003593A5 DE112014003593.9T DE112014003593T DE112014003593A5 DE 112014003593 A5 DE112014003593 A5 DE 112014003593A5 DE 112014003593 T DE112014003593 T DE 112014003593T DE 112014003593 A5 DE112014003593 A5 DE 112014003593A5
Authority
DE
Germany
Prior art keywords
semiconductor chip
optoelectronic semiconductor
arrangement
optoelectronic
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014003593.9T
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English (en)
Other versions
DE112014003593B4 (de
Inventor
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014003593A5 publication Critical patent/DE112014003593A5/de
Application granted granted Critical
Publication of DE112014003593B4 publication Critical patent/DE112014003593B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112014003593.9T 2013-10-30 2014-10-24 Anordnung mit mindestens einem optoelektronischen Halbleiterchip Expired - Fee Related DE112014003593B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE201310111977 DE102013111977A1 (de) 2013-10-30 2013-10-30 Optoelektronischer Halbleiterchip und Anordnung mit mindestens einem solchen optoelektronischen Halbleiterchip
DE102013111977.8 2013-10-30
PCT/EP2014/072888 WO2015062990A1 (de) 2013-10-30 2014-10-24 Optoelektronischer halbleiterchip und anordnung mit mindestens einem solchen optoelektronischen halbleiterchip

Publications (2)

Publication Number Publication Date
DE112014003593A5 true DE112014003593A5 (de) 2016-06-02
DE112014003593B4 DE112014003593B4 (de) 2021-11-04

Family

ID=51844698

Family Applications (2)

Application Number Title Priority Date Filing Date
DE201310111977 Withdrawn DE102013111977A1 (de) 2013-10-30 2013-10-30 Optoelektronischer Halbleiterchip und Anordnung mit mindestens einem solchen optoelektronischen Halbleiterchip
DE112014003593.9T Expired - Fee Related DE112014003593B4 (de) 2013-10-30 2014-10-24 Anordnung mit mindestens einem optoelektronischen Halbleiterchip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE201310111977 Withdrawn DE102013111977A1 (de) 2013-10-30 2013-10-30 Optoelektronischer Halbleiterchip und Anordnung mit mindestens einem solchen optoelektronischen Halbleiterchip

Country Status (2)

Country Link
DE (2) DE102013111977A1 (de)
WO (1) WO2015062990A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014103828A1 (de) 2014-03-20 2015-09-24 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen
DE102015109755A1 (de) 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
DE102017100812B4 (de) * 2017-01-17 2024-04-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
DE102018125281A1 (de) * 2018-10-12 2020-04-16 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
KR102518803B1 (ko) 2018-10-24 2023-04-07 삼성전자주식회사 반도체 패키지

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040012958A1 (en) 2001-04-23 2004-01-22 Takuma Hashimoto Light emitting device comprising led chip
EP1872400A4 (de) 2005-04-05 2009-06-24 Tir Technology Lp Anbringbaugruppe für optoelektronische einrichtungen
KR20080027355A (ko) 2005-06-30 2008-03-26 마츠시다 덴코 가부시키가이샤 발광 장치
DE102007022947B4 (de) * 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102008045653B4 (de) * 2008-09-03 2020-03-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
KR101502420B1 (ko) * 2008-09-22 2015-03-25 삼성디스플레이 주식회사 광원 모듈 및 이를 갖는 표시장치
KR101545941B1 (ko) * 2009-01-07 2015-08-21 삼성디스플레이 주식회사 광원, 이를 갖는 광출사 모듈 및 백라이트 어셈블리
KR101077264B1 (ko) * 2009-02-17 2011-10-27 (주)포인트엔지니어링 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법
JP5246791B2 (ja) * 2009-04-22 2013-07-24 株式会社ジャパンディスプレイウェスト バックライトユニット
DE102009032606A1 (de) * 2009-07-10 2011-01-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Flachlichtquelle
US8507940B2 (en) * 2010-04-05 2013-08-13 Taiwan Semiconductor Manufacturing Company, Ltd. Heat dissipation by through silicon plugs
JP2012212733A (ja) * 2011-03-30 2012-11-01 Toyoda Gosei Co Ltd 発光装置
DE102011015821B4 (de) * 2011-04-01 2023-04-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US9222648B2 (en) * 2011-11-03 2015-12-29 Cooledge Lighting, Inc. Broad-area lighting systems
CN108336076A (zh) 2012-02-02 2018-07-27 普瑞光电股份有限公司 在模制互连结构中封装仅具有顶侧连接的光子构建块
DE102012101102A1 (de) * 2012-02-10 2013-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Anordnung mit einer Mehrzahl von derartigen Bauelementen
DE102012102114B4 (de) * 2012-03-13 2021-09-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes Halbleiterbauteil, Beleuchtungsvorrichtung und Anzeigevorrichtung
DE102012102119A1 (de) * 2012-03-13 2013-09-19 Osram Opto Semiconductors Gmbh Flächenlichtquelle
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
DE102012217533A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements

Also Published As

Publication number Publication date
WO2015062990A1 (de) 2015-05-07
DE102013111977A1 (de) 2015-04-30
DE112014003593B4 (de) 2021-11-04

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