DE112012006049T5 - Strömungssensor mit Herstellungsverfahren - Google Patents

Strömungssensor mit Herstellungsverfahren Download PDF

Info

Publication number
DE112012006049T5
DE112012006049T5 DE112012006049.0T DE112012006049T DE112012006049T5 DE 112012006049 T5 DE112012006049 T5 DE 112012006049T5 DE 112012006049 T DE112012006049 T DE 112012006049T DE 112012006049 T5 DE112012006049 T5 DE 112012006049T5
Authority
DE
Germany
Prior art keywords
semiconductor chip
frame body
detection unit
flow sensor
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112012006049.0T
Other languages
German (de)
English (en)
Inventor
c/o Hitachi Automotive Systems Tashiro Shinobu
c/o Hitachi Ltd. Kono Tsutomu
c/o Hitachi Automotive Systems L Hanzawa Keiji
c/o Hitachi Automotive Systems Tokuyasu Noboru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of DE112012006049T5 publication Critical patent/DE112012006049T5/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
DE112012006049.0T 2012-03-19 2012-12-04 Strömungssensor mit Herstellungsverfahren Withdrawn DE112012006049T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012062577A JP5763575B2 (ja) 2012-03-19 2012-03-19 流量センサおよびその製造方法
JP2012-062577 2012-03-19
PCT/JP2012/081340 WO2013140674A1 (ja) 2012-03-19 2012-12-04 流量センサおよびその製造方法

Publications (1)

Publication Number Publication Date
DE112012006049T5 true DE112012006049T5 (de) 2014-12-18

Family

ID=49222161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112012006049.0T Withdrawn DE112012006049T5 (de) 2012-03-19 2012-12-04 Strömungssensor mit Herstellungsverfahren

Country Status (4)

Country Link
JP (1) JP5763575B2 (ja)
CN (2) CN104024807B (ja)
DE (1) DE112012006049T5 (ja)
WO (1) WO2013140674A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013006033B4 (de) 2012-12-17 2021-10-07 Hitachi Automotive Systems, Ltd. Sensor für physikalische Größen
DE112013006408B4 (de) 2013-01-11 2021-10-14 Hitachi Automotive Systems, Ltd. Durchflusssensor und Fertigungsverfahren dafür

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10444175B2 (en) 2015-04-03 2019-10-15 Denso Corporation Measurement device
JP6507804B2 (ja) * 2015-04-03 2019-05-08 株式会社デンソー 空気流量測定装置
JP6553587B2 (ja) * 2016-12-20 2019-07-31 Ｎｉｓｓｈａ株式会社 ガスセンサモジュール及びその製造方法
JP6905962B2 (ja) * 2018-07-12 2021-07-21 日立Astemo株式会社 流量センサ
WO2022208931A1 (ja) * 2021-03-29 2022-10-06 日立Astemo株式会社 流量測定装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469958A (ja) * 1990-07-10 1992-03-05 Mitsubishi Electric Corp 半導体装置
CN1040577C (zh) * 1990-08-01 1998-11-04 涂相征 一种集成硅膜热流量传感器及其制造方法
JP3882592B2 (ja) * 2001-11-26 2007-02-21 松下電工株式会社 半導体イオンセンサとその製造方法
EP1365216B1 (en) * 2002-05-10 2018-01-17 Azbil Corporation Flow sensor and method of manufacturing the same
JP4609019B2 (ja) * 2004-09-24 2011-01-12 株式会社デンソー 熱式流量センサ及びその製造方法
JP4966526B2 (ja) * 2005-09-07 2012-07-04 日立オートモティブシステムズ株式会社 流量センサ
JP5012330B2 (ja) * 2007-08-29 2012-08-29 株式会社デンソー センサ装置の製造方法及びセンサ装置
JP5168184B2 (ja) * 2009-02-23 2013-03-21 株式会社デンソー センサ装置およびその製造方法
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
JP5315304B2 (ja) * 2010-07-30 2013-10-16 日立オートモティブシステムズ株式会社 熱式流量計

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013006033B4 (de) 2012-12-17 2021-10-07 Hitachi Automotive Systems, Ltd. Sensor für physikalische Größen
DE112013006408B4 (de) 2013-01-11 2021-10-14 Hitachi Automotive Systems, Ltd. Durchflusssensor und Fertigungsverfahren dafür

Also Published As

Publication number Publication date
CN104024807A (zh) 2014-09-03
JP5763575B2 (ja) 2015-08-12
JP2013195231A (ja) 2013-09-30
CN104024807B (zh) 2016-07-06
CN106092233B (zh) 2019-01-22
CN106092233A (zh) 2016-11-09
WO2013140674A1 (ja) 2013-09-26

Similar Documents

Publication Publication Date Title
DE112012006049T5 (de) Strömungssensor mit Herstellungsverfahren
DE112013006408B4 (de) Durchflusssensor und Fertigungsverfahren dafür
DE19801484B4 (de) Meßelement und damit ausgerüsteter Luftmassenmesser
DE102007029356B4 (de) Differenzialdrucksensor mit symmetrisch vorgesehenen Sensorchips und Druckeinleitungskanälen
DE112013002993B4 (de) Thermischer Durchflussmesser
DE112013002999B4 (de) Thermischer Durchflussmesser
DE112013003231B4 (de) Thermischer Luftstromsensor
DE60030333T2 (de) Einrichtung zur messung einer physikalischen grösse, verfahren zu ihrer herstellung und fahrzeugsteuersystem mit der einrichtung zur messung einer physikalischen grösse
DE112013002936B4 (de) Thermischer Durchflussmesser
EP0908703A1 (de) Vorrichtung zur Messung der Masse eines strömenden Mediums
DE19919398B4 (de) Wärmeempfindlicher Flußratensensor
DE112012006520T5 (de) Thermischer Durchflussmesser
EP2909593B1 (de) Temperatursensor und thermisches durchflussmessgerät
DE102015225358B4 (de) Luftmassenmesser
DE112013002992B4 (de) Thermischer Durchflussmesser
DE102006060343B4 (de) Durchflussdetektorelement eines thermosensiblen Durchflusssensors
DE112013002939T5 (de) Thermischer Durchflussmesser
EP0955524A2 (de) Luftmassensensor
DE112013002966T5 (de) Thermischer Durchflussmesser
DE112013002996T5 (de) Thermischer Durchflussmesser
DE10324292B4 (de) Messelement für einen Durchflusssensor, insbesondere einen Luftmassensensor für Brennkraftmaschinen
DE112013006062B4 (de) Drucksensor und Verfahren zu dessen Fertigung
DE112013002949T5 (de) Thermischer Durchflussmesser
WO2020187370A1 (de) Sensoranordnung mit einem temperatursensorelement und verfahren zu deren herstellung
DE112013002965T5 (de) Thermischer Durchflussmesser

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: HITACHI ASTEMO, LTD., HITACHINAKA-SHI, JP

Free format text: FORMER OWNER: HITACHI AUTOMOTIVE SYSTEMS, LTD., HITACHINAKA-SHI, IBARAKI, JP

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee