CN104024807B - 流量传感器及其制造方法 - Google Patents
流量传感器及其制造方法 Download PDFInfo
- Publication number
- CN104024807B CN104024807B CN201280065517.8A CN201280065517A CN104024807B CN 104024807 B CN104024807 B CN 104024807B CN 201280065517 A CN201280065517 A CN 201280065517A CN 104024807 B CN104024807 B CN 104024807B
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- framework
- flow
- testing division
- chip chp1
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Volume Flow (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390927.XA CN106092233B (zh) | 2012-03-19 | 2012-12-04 | 流量传感器及其制造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012062577A JP5763575B2 (ja) | 2012-03-19 | 2012-03-19 | 流量センサおよびその製造方法 |
| JP2012-062577 | 2012-03-19 | ||
| PCT/JP2012/081340 WO2013140674A1 (ja) | 2012-03-19 | 2012-12-04 | 流量センサおよびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390927.XA Division CN106092233B (zh) | 2012-03-19 | 2012-12-04 | 流量传感器及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104024807A CN104024807A (zh) | 2014-09-03 |
| CN104024807B true CN104024807B (zh) | 2016-07-06 |
Family
ID=49222161
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280065517.8A Expired - Fee Related CN104024807B (zh) | 2012-03-19 | 2012-12-04 | 流量传感器及其制造方法 |
| CN201610390927.XA Expired - Fee Related CN106092233B (zh) | 2012-03-19 | 2012-12-04 | 流量传感器及其制造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390927.XA Expired - Fee Related CN106092233B (zh) | 2012-03-19 | 2012-12-04 | 流量传感器及其制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5763575B2 (ja) |
| CN (2) | CN104024807B (ja) |
| DE (1) | DE112012006049T5 (ja) |
| WO (1) | WO2013140674A1 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6018903B2 (ja) | 2012-12-17 | 2016-11-02 | 日立オートモティブシステムズ株式会社 | 物理量センサ |
| JP5916637B2 (ja) | 2013-01-11 | 2016-05-11 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法 |
| US10444175B2 (en) | 2015-04-03 | 2019-10-15 | Denso Corporation | Measurement device |
| JP6507804B2 (ja) * | 2015-04-03 | 2019-05-08 | 株式会社デンソー | 空気流量測定装置 |
| JP6553587B2 (ja) * | 2016-12-20 | 2019-07-31 | Ｎｉｓｓｈａ株式会社 | ガスセンサモジュール及びその製造方法 |
| JP6905962B2 (ja) * | 2018-07-12 | 2021-07-21 | 日立Astemo株式会社 | 流量センサ |
| WO2022208931A1 (ja) * | 2021-03-29 | 2022-10-06 | 日立Astemo株式会社 | 流量測定装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102162744A (zh) * | 2009-12-11 | 2011-08-24 | 日立汽车系统株式会社 | 流量传感器及其制造方法以及流量传感器组件 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469958A (ja) * | 1990-07-10 | 1992-03-05 | Mitsubishi Electric Corp | 半導体装置 |
| CN1040577C (zh) * | 1990-08-01 | 1998-11-04 | 涂相征 | 一种集成硅膜热流量传感器及其制造方法 |
| JP3882592B2 (ja) * | 2001-11-26 | 2007-02-21 | 松下電工株式会社 | 半導体イオンセンサとその製造方法 |
| EP1365216B1 (en) * | 2002-05-10 | 2018-01-17 | Azbil Corporation | Flow sensor and method of manufacturing the same |
| JP4609019B2 (ja) * | 2004-09-24 | 2011-01-12 | 株式会社デンソー | 熱式流量センサ及びその製造方法 |
| JP4966526B2 (ja) * | 2005-09-07 | 2012-07-04 | 日立オートモティブシステムズ株式会社 | 流量センサ |
| JP5012330B2 (ja) * | 2007-08-29 | 2012-08-29 | 株式会社デンソー | センサ装置の製造方法及びセンサ装置 |
| JP5168184B2 (ja) * | 2009-02-23 | 2013-03-21 | 株式会社デンソー | センサ装置およびその製造方法 |
| JP5315304B2 (ja) * | 2010-07-30 | 2013-10-16 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
-
2012
- 2012-03-19 JP JP2012062577A patent/JP5763575B2/ja not_active Expired - Fee Related
- 2012-12-04 WO PCT/JP2012/081340 patent/WO2013140674A1/ja active Application Filing
- 2012-12-04 DE DE112012006049.0T patent/DE112012006049T5/de not_active Withdrawn
- 2012-12-04 CN CN201280065517.8A patent/CN104024807B/zh not_active Expired - Fee Related
- 2012-12-04 CN CN201610390927.XA patent/CN106092233B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102162744A (zh) * | 2009-12-11 | 2011-08-24 | 日立汽车系统株式会社 | 流量传感器及其制造方法以及流量传感器组件 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104024807A (zh) | 2014-09-03 |
| JP5763575B2 (ja) | 2015-08-12 |
| JP2013195231A (ja) | 2013-09-30 |
| CN106092233B (zh) | 2019-01-22 |
| CN106092233A (zh) | 2016-11-09 |
| WO2013140674A1 (ja) | 2013-09-26 |
| DE112012006049T5 (de) | 2014-12-18 |
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