DE112008002580A5 - Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen - Google Patents

Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen Download PDF

Info

Publication number
DE112008002580A5
DE112008002580A5 DE112008002580T DE112008002580T DE112008002580A5 DE 112008002580 A5 DE112008002580 A5 DE 112008002580A5 DE 112008002580 T DE112008002580 T DE 112008002580T DE 112008002580 T DE112008002580 T DE 112008002580T DE 112008002580 A5 DE112008002580 A5 DE 112008002580A5
Authority
DE
Germany
Prior art keywords
solar cells
laser structuring
structuring
laser
solar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112008002580T
Other languages
English (en)
Inventor
Mario SCHRÖDNER
Ralph-Ingo Stohn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thueringisches Institut fuer Textil und Kunststoff Forschung eV
Original Assignee
Thueringisches Institut fuer Textil und Kunststoff Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thueringisches Institut fuer Textil und Kunststoff Forschung eV filed Critical Thueringisches Institut fuer Textil und Kunststoff Forschung eV
Publication of DE112008002580A5 publication Critical patent/DE112008002580A5/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
DE112008002580T 2007-07-23 2008-07-12 Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen Ceased DE112008002580A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007034644.3 2007-07-23
DE102007034644A DE102007034644A1 (de) 2007-07-23 2007-07-23 Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen
PCT/DE2008/001153 WO2009012750A2 (de) 2007-07-23 2008-07-12 Verfahren und vorrichtung zur laserstrukturierung von solarzellen

Publications (1)

Publication Number Publication Date
DE112008002580A5 true DE112008002580A5 (de) 2010-06-24

Family

ID=40157168

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102007034644A Withdrawn DE102007034644A1 (de) 2007-07-23 2007-07-23 Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen
DE112008002580T Ceased DE112008002580A5 (de) 2007-07-23 2008-07-12 Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102007034644A Withdrawn DE102007034644A1 (de) 2007-07-23 2007-07-23 Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen

Country Status (2)

Country Link
DE (2) DE102007034644A1 (de)
WO (1) WO2009012750A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037964A1 (de) 2009-08-15 2011-03-03 Frank Bentzinger Photovoltaikmodul mit wenigstens einer Solarzelle und Verfahren zur Strukturierung einer Solarzelle
DE202009011260U1 (de) 2009-08-15 2009-10-22 Bentzinger, Frank Photovoltaikmodul mit wenigstens einer Solarzelle
DE102010001036A1 (de) * 2010-01-20 2011-07-21 Robert Bosch GmbH, 70469 Verfahren und Vorrichtung zur mehrfachen Nutzung von Laserquellen
DE102010038259B4 (de) * 2010-10-19 2013-02-07 4Jet Sales + Service Gmbh Verfahren und Vorrichtung zum Gravieren eines flexiblen Bands
CN109841549B (zh) * 2017-11-28 2020-11-13 中国科学院金属研究所 一种无损转移自支撑低维材料的方法
WO2024046736A1 (de) 2022-09-01 2024-03-07 Saint-Gobain Glass France Verbundglasscheibe mit verbesserter spektraler reflektion
CN115815821B (zh) * 2022-12-08 2023-08-11 深圳铭创智能装备有限公司 激光加工连续图形的装置与方法及电子器件蚀刻装置与方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216543A (en) 1987-03-04 1993-06-01 Minnesota Mining And Manufacturing Company Apparatus and method for patterning a film
DE3880807T2 (de) 1987-12-23 1993-08-12 Semiconductor Energy Lab Verfahren fuer die herstellung von duennen filmmustern auf substraten.
DE59103714D1 (de) * 1991-10-07 1995-01-12 Siemens Ag Laserbearbeitungsverfahren für einen Dünnschichtaufbau.
JP3017422B2 (ja) * 1995-09-11 2000-03-06 キヤノン株式会社 光起電力素子アレー及びその製造方法
US6040552A (en) * 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure
JPH10256583A (ja) 1997-03-14 1998-09-25 Mitsubishi Heavy Ind Ltd 集積型薄膜太陽電池
JPH1147965A (ja) * 1997-05-28 1999-02-23 Komatsu Ltd レーザ加工装置
JPH11354818A (ja) 1998-06-05 1999-12-24 Matsushita Battery Industrial Co Ltd 太陽電池の製造方法
JP2000208794A (ja) 1999-01-19 2000-07-28 Fuji Electric Co Ltd 薄膜太陽電池等のパタ―ン状薄膜層のレ―ザパタ―ニング方法および装置
DE19915666A1 (de) * 1999-04-07 2000-10-19 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur selektiven Kontaktierung von Solarzellen
US6300593B1 (en) * 1999-12-07 2001-10-09 First Solar, Llc Apparatus and method for laser scribing a coated substrate
US20020117199A1 (en) * 2001-02-06 2002-08-29 Oswald Robert S. Process for producing photovoltaic devices
US20020110673A1 (en) 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
US6762124B2 (en) 2001-02-14 2004-07-13 Avery Dennison Corporation Method for patterning a multilayered conductor/substrate structure
US6538230B2 (en) * 2001-05-17 2003-03-25 Preco Laser Systems, Llc Method and apparatus for improving laser hole resolution
US20030047695A1 (en) * 2001-09-07 2003-03-13 Preco Laser Systems, Llc System and method for synchronizing a laser beam to a moving web
EP1466368A1 (de) * 2002-01-07 2004-10-13 BP Corporation North America Inc. Herstellungsverfahren für dünnfilm photovoltaic module
DE10212639A1 (de) * 2002-03-21 2003-10-16 Siemens Ag Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen
DE102004016313A1 (de) * 2004-03-29 2005-10-13 Klaus Dr. Kalberlah Verfahren und Einrichtung zur Separation von Einzelzellen aus einem flexiblen Solarzellen-Band
US20050272175A1 (en) * 2004-06-02 2005-12-08 Johannes Meier Laser structuring for manufacture of thin film silicon solar cells
JP4641172B2 (ja) 2004-10-18 2011-03-02 大日本印刷株式会社 Ｉｔｏ膜のパターンニング方法
JP4765448B2 (ja) * 2005-07-13 2011-09-07 富士電機株式会社 薄膜太陽電池製造方法および製造装置

Also Published As

Publication number Publication date
DE102007034644A1 (de) 2009-01-29
WO2009012750A2 (de) 2009-01-29
WO2009012750A3 (de) 2009-07-09

Similar Documents

Publication Publication Date Title
ATE544835T2 (de) Verfahren und vorrichtung zur verarbeitung von biomasse
DE602005022123D1 (de) Vorrichtung und verfahren zur beförderung von bohrklein
DE102007039939A8 (de) Verfahren und Vorrichtung zur Einsparung von Diafiltrat
AT10628U2 (de) Vorrichtung und verfahren zur herstellung von säcken
DE602007000729D1 (de) Verfahren und Vorrichtung zur Authentifizierung
DE112010003221A5 (de) Vorrichtung und verfahren zur eliminierung von bioschädlichen stoffen aus korperflüssigkeiten
ATE533707T1 (de) Verfahren und vorrichtung zur visuellen unterstützung von kommissioniervorgängen
DE602006007458D1 (de) Verfahren und vorrichtung zur bohrlochfluidanalyse
DE602006006454D1 (de) Verfahren und Vorrichtung zur Authentifizierung
DE602006020112D1 (de) Einrichtung und Verfahren zur Sammlung der Abflüsse einer Elektrolysezelle
DE602006001379D1 (de) Vorrichtung und Verfahren zur Erfassung von Verschiebungen
ATE473570T1 (de) Verfahren und vorrichtung zur endknoten- gestützten neighbor-erkennung
DE602006017793D1 (de) Verfahren und Vorrichtung zur Gleichstromversorgung
DE602006018379D1 (de) Verfahren und Vorrichtung zur segmentierten Stack-Verwaltung
DE112008002580A5 (de) Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen
DE112007000562A5 (de) Verfahren und Vorrichtung zur Lageverfolgung
DE502007001541D1 (de) Verfahren und vorrichtung zur fälschungssicherung von produkten
DE602007002933D1 (de) Vorrichtung und Verfahren zur Antriebskraftverteilung
DE112009003125A5 (de) Verfahren und vorrichtung zum schnelltransport von glasplatten
DE112007003762A5 (de) Verfahren und Vorrichtung zur Echtzeit-Multiview-Erzeugung
DE502008001475D1 (de) Vorrichtung und Verfahren zum spurgenauen Transport von Substraten
DE102007034814A8 (de) Vorrichtung und Verfahren zur Klassifizierung einer Solarzelle
DE602007001112D1 (de) Verfahren und Vorrichtung zur Formmessung
DE112006001246A5 (de) Verfahren und Vorrichtung zur Verbesserung des Wirkungsgrades von Energieumwandlungseinrichtungen
DE112007003608A5 (de) Vorrichtung und Verfahren zum Ablösen von Zellen

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final