DE112004002626D2 - Festes isolierendes und elektrisch leitendes Verbinden prozessierter Halbleiterscheiben - Google Patents

Festes isolierendes und elektrisch leitendes Verbinden prozessierter Halbleiterscheiben

Info

Publication number
DE112004002626D2
DE112004002626D2 DE112004002626T DE112004002626T DE112004002626D2 DE 112004002626 D2 DE112004002626 D2 DE 112004002626D2 DE 112004002626 T DE112004002626 T DE 112004002626T DE 112004002626 T DE112004002626 T DE 112004002626T DE 112004002626 D2 DE112004002626 D2 DE 112004002626D2
Authority
DE
Germany
Prior art keywords
electrically conductive
semiconductor wafers
conductive connection
solid insulating
processed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112004002626T
Other languages
English (en)
Inventor
Roy Knechtel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Fab Semiconductor Foundries GmbH
Original Assignee
X Fab Semiconductor Foundries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Fab Semiconductor Foundries GmbH filed Critical X Fab Semiconductor Foundries GmbH
Publication of DE112004002626D2 publication Critical patent/DE112004002626D2/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE112004002626T 2003-10-29 2004-10-29 Festes isolierendes und elektrisch leitendes Verbinden prozessierter Halbleiterscheiben Ceased DE112004002626D2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10350460A DE10350460B4 (de) 2003-10-29 2003-10-29 Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung
PCT/DE2004/002413 WO2005042401A1 (de) 2003-10-29 2004-10-29 Festes isolierendes und elektrisch leitendes verbinden prozessierter halbleiterscheiben

Publications (1)

Publication Number Publication Date
DE112004002626D2 true DE112004002626D2 (de) 2006-09-21

Family

ID=34529872

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10350460A Expired - Fee Related DE10350460B4 (de) 2003-10-29 2003-10-29 Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung
DE112004002626T Ceased DE112004002626D2 (de) 2003-10-29 2004-10-29 Festes isolierendes und elektrisch leitendes Verbinden prozessierter Halbleiterscheiben

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10350460A Expired - Fee Related DE10350460B4 (de) 2003-10-29 2003-10-29 Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung

Country Status (7)

Country Link
US (1) US8129255B2 (de)
EP (1) EP1678074A1 (de)
JP (1) JP2007510295A (de)
CN (1) CN1874956A (de)
CA (1) CA2543736A1 (de)
DE (2) DE10350460B4 (de)
WO (1) WO2005042401A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060113639A1 (en) * 2002-10-15 2006-06-01 Sehat Sutardja Integrated circuit including silicon wafer with annealed glass paste
US7760039B2 (en) * 2002-10-15 2010-07-20 Marvell World Trade Ltd. Crystal oscillator emulator
US7768360B2 (en) 2002-10-15 2010-08-03 Marvell World Trade Ltd. Crystal oscillator emulator
US7791424B2 (en) * 2002-10-15 2010-09-07 Marvell World Trade Ltd. Crystal oscillator emulator
US20060267194A1 (en) 2002-10-15 2006-11-30 Sehat Sutardja Integrated circuit package with air gap
DE102006040115A1 (de) * 2006-08-26 2008-03-20 X-Fab Semiconductor Foundries Ag Verfahren und Anordnung zur hermetisch dichten vertikalen elektrischen Durchkontaktierung von Deckscheiben der Mikrosystemtechnik
US8138062B2 (en) * 2009-12-15 2012-03-20 Freescale Semiconductor, Inc. Electrical coupling of wafer structures
EP3101805B1 (de) * 2015-06-01 2019-04-03 Aros Electronics AB Schwankungsreduzierung für gleichstromschiene

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837300A1 (de) * 1988-11-03 1990-05-23 Messerschmitt Boelkow Blohm Verfahren zur herstellung von mikroelektronischen schaltungen und hybriden
US5094969A (en) * 1989-09-14 1992-03-10 Litton Systems, Inc. Method for making a stackable multilayer substrate for mounting integrated circuits
DE4006108A1 (de) * 1990-02-27 1991-08-29 Bosch Gmbh Robert Verfahren zum aufbau von mikromechanischen bauelementen in dickschichttechnik
US5164328A (en) 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5545912A (en) * 1994-10-27 1996-08-13 Motorola, Inc. Electronic device enclosure including a conductive cap and substrate
JP3514349B2 (ja) 1996-02-13 2004-03-31 株式会社日立国際電気 マイクロパッケージ構造
DE19616014B4 (de) 1996-04-23 2006-04-20 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen
EP0877003B1 (de) 1997-05-09 2002-09-18 JSR Corporation Zusammensetzung einer Glaspaste
DE69736630D1 (de) 1997-06-19 2006-10-19 St Microelectronics Srl Hermetisch abgeschlossener Sensor mit beweglicher Mikrostruktur
GB9713831D0 (en) 1997-06-30 1997-09-03 Fry Metals Inc Sealing glass paste for cathode ray tubes
US5955771A (en) 1997-11-12 1999-09-21 Kulite Semiconductor Products, Inc. Sensors for use in high vibrational applications and methods for fabricating same
US6020646A (en) 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
JP3689598B2 (ja) 1998-09-21 2005-08-31 キヤノン株式会社 スペーサの製造方法および前記スペーサを用いた画像形成装置の製造方法
JP2000114409A (ja) 1998-10-07 2000-04-21 Kyocera Corp 電子部品収納用容器
US6016121A (en) * 1998-10-09 2000-01-18 Rockwell Collins, Inc. Multiple frequency GPS receive operation using single frequency sequencing
CN100380559C (zh) * 1999-05-28 2008-04-09 松下电器产业株式会社 发光特性优异的等离子显示面板的制造方法
JP2001298052A (ja) * 2000-02-09 2001-10-26 Interuniv Micro Electronica Centrum Vzw 接着剤を用いた半導体素子のフリップチップアセンブリ方法
WO2002079814A2 (en) 2000-12-19 2002-10-10 Coventor Incorporated Method for fabricating a through-wafer optical mems device having an anti-reflective coating
DE10141753A1 (de) * 2001-08-29 2003-03-20 Orga Kartensysteme Gmbh Verfahren zur Montage eines elektronischen Bauelementes auf einer Trägerstuktur in Face-Down-Technik
US6975016B2 (en) * 2002-02-06 2005-12-13 Intel Corporation Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
US6498057B1 (en) * 2002-03-07 2002-12-24 International Business Machines Corporation Method for implementing SOI transistor source connections using buried dual rail distribution
US20030190936A1 (en) * 2002-03-12 2003-10-09 Chen-Chao Fan Charge socket for hands-free cellular phone in vehicle

Also Published As

Publication number Publication date
US8129255B2 (en) 2012-03-06
EP1678074A1 (de) 2006-07-12
WO2005042401A1 (de) 2005-05-12
US20080029878A1 (en) 2008-02-07
JP2007510295A (ja) 2007-04-19
DE10350460A1 (de) 2005-06-30
CN1874956A (zh) 2006-12-06
CA2543736A1 (en) 2005-05-12
DE10350460B4 (de) 2006-07-13

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Legal Events

Date Code Title Description
8131 Rejection