AU2003266547A8 - Conductive composition for electrical connection of electronic device and electronic device - Google Patents

Conductive composition for electrical connection of electronic device and electronic device

Info

Publication number
AU2003266547A8
AU2003266547A8 AU2003266547A AU2003266547A AU2003266547A8 AU 2003266547 A8 AU2003266547 A8 AU 2003266547A8 AU 2003266547 A AU2003266547 A AU 2003266547A AU 2003266547 A AU2003266547 A AU 2003266547A AU 2003266547 A8 AU2003266547 A8 AU 2003266547A8
Authority
AU
Australia
Prior art keywords
electronic device
electrical connection
conductive composition
conductive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003266547A
Other versions
AU2003266547A1 (en
Inventor
Hirotaka Ogawa
Isao Suzuki
Keisuke Abe
Kentarou Tsunozaki
Yasuhiro Sanada
Hisao Inokuma
Masako Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noda Screen Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Noda Screen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Noda Screen Co Ltd filed Critical Asahi Glass Co Ltd
Publication of AU2003266547A8 publication Critical patent/AU2003266547A8/en
Publication of AU2003266547A1 publication Critical patent/AU2003266547A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2003266547A 2002-09-19 2003-09-19 Conductive composition for electrical connection of electronic device and electronic device Abandoned AU2003266547A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002/273232 2002-09-19
JP2002273232A JP2004111253A (en) 2002-09-19 2002-09-19 Conductive composition for electrical connection of electronic device, and electron device
PCT/JP2003/012011 WO2004027787A1 (en) 2002-09-19 2003-09-19 Conductive composition for electrical connection of electronic device and electronic device

Publications (2)

Publication Number Publication Date
AU2003266547A8 true AU2003266547A8 (en) 2004-04-08
AU2003266547A1 AU2003266547A1 (en) 2004-04-08

Family

ID=32024950

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003266547A Abandoned AU2003266547A1 (en) 2002-09-19 2003-09-19 Conductive composition for electrical connection of electronic device and electronic device

Country Status (3)

Country Link
JP (1) JP2004111253A (en)
AU (1) AU2003266547A1 (en)
WO (1) WO2004027787A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111254A (en) * 2002-09-19 2004-04-08 Asahi Glass Co Ltd Metal contained composition for electrical connection of electronic device
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2006076612A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
GB0708702D0 (en) * 2007-05-04 2007-06-13 Peratech Ltd Polymer composition
JP5580562B2 (en) * 2009-09-09 2014-08-27 地方独立行政法人 大阪市立工業研究所 Silver-copper mixed powder and bonding method using the same
WO2011114747A1 (en) * 2010-03-18 2011-09-22 古河電気工業株式会社 Electrically conductive paste, and electrically conductive connection member produced using the paste
KR20130031414A (en) * 2011-09-21 2013-03-29 삼성전기주식회사 Conductive paste composition for low temperature firing
JP5648619B2 (en) * 2011-10-26 2015-01-07 信越化学工業株式会社 Thermally conductive silicone composition
JP5956833B2 (en) * 2012-05-29 2016-07-27 日立建機株式会社 Construction machinery
JP5880300B2 (en) 2012-06-14 2016-03-08 日立化成株式会社 Adhesive composition and semiconductor device using the same
KR20210154865A (en) 2016-03-15 2021-12-21 세키스이가가쿠 고교가부시키가이샤 Metal-containing particle, connecting material, connected structure, and method for producing connected structure
CN106298073A (en) * 2016-08-31 2017-01-04 安徽斯迈尔电子科技有限公司 A kind of preparation method of high-power resistance conductive phase powder
JP7076400B2 (en) 2019-05-27 2022-05-27 信越化学工業株式会社 Thermally conductive silicone composition, semiconductor device and its manufacturing method
CN114433868B (en) * 2022-02-10 2023-08-15 哈尔滨理工大学 Branched CuAu alloy nanocrystalline and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167320A (en) * 1994-12-13 1996-06-25 Pentel Kk Conductive composition
JP3630813B2 (en) * 1996-01-16 2005-03-23 福田金属箔粉工業株式会社 Solderable conductive composition for surface heating element electrode
JPH1021744A (en) * 1996-06-28 1998-01-23 Mitsuboshi Belting Ltd Copper conductor paste and substrate printed therewith
JP2001015872A (en) * 1999-06-30 2001-01-19 Kyocera Corp Wiring board insulating sheet and manufacture of wiring board using the same
JP2001101925A (en) * 1999-09-30 2001-04-13 Fukuda Metal Foil & Powder Co Ltd Conductive composition
CA2426861C (en) * 2000-10-25 2008-10-28 Yorishige Matsuba Conductive metal paste
JP2003123535A (en) * 2001-10-19 2003-04-25 Murata Mfg Co Ltd Conductive paste and laminated ceramic electronic parts
JP2004111254A (en) * 2002-09-19 2004-04-08 Asahi Glass Co Ltd Metal contained composition for electrical connection of electronic device

Also Published As

Publication number Publication date
AU2003266547A1 (en) 2004-04-08
JP2004111253A (en) 2004-04-08
WO2004027787A1 (en) 2004-04-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase