DE1070252B - - Google Patents

Info

Publication number

DE1070252B

DE1070252B DENDAT1070252D DE1070252DA DE1070252B DE 1070252 B DE1070252 B DE 1070252B DE NDAT1070252 D DENDAT1070252 D DE NDAT1070252D DE 1070252D A DE1070252D A DE 1070252DA DE 1070252 B DE1070252 B DE 1070252B

Authority

DE

Germany

Prior art keywords

circuit according

resonant circuit

inner conductor

dielectric body

ring

Prior art date

1959-12-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• DPMA
• Discuss

• 239000004020 conductor Substances 0.000 claims description 35
• 239000000919 ceramic Substances 0.000 claims description 14
• 239000002184 metal Substances 0.000 claims description 12
• 229910052751 metal Inorganic materials 0.000 claims description 12
• 239000000463 material Substances 0.000 claims description 9
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
• 238000001465 metallisation Methods 0.000 claims description 6
• 229910052742 iron Inorganic materials 0.000 claims description 4
• 239000007787 solid Substances 0.000 claims description 4
• 239000003990 capacitor Substances 0.000 claims description 3
• 238000000576 coating method Methods 0.000 claims description 3
• 239000011521 glass Substances 0.000 claims description 3
• 239000004033 plastic Substances 0.000 claims description 3
• 229910052709 silver Inorganic materials 0.000 claims description 3
• 239000004332 silver Substances 0.000 claims description 3
• 241000530268 Lycaena heteronea Species 0.000 claims description 2
• 239000011810 insulating material Substances 0.000 claims description 2
• 229910000906 Bronze Inorganic materials 0.000 description 6
• 239000010974 bronze Substances 0.000 description 6
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
• 230000035699 permeability Effects 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• FSCNUJMKSQHQSY-UHFFFAOYSA-N Gein Chemical compound COC1=CC(CC=C)=CC=C1OC1C(O)C(O)C(O)C(COC2C(C(O)C(O)CO2)O)O1 FSCNUJMKSQHQSY-UHFFFAOYSA-N 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 2
• 229910001369 Brass Inorganic materials 0.000 description 1
• 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 1
• JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical group [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 1
• 238000004026 adhesive bonding Methods 0.000 description 1
• 230000002411 adverse Effects 0.000 description 1
• 239000010951 brass Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 230000005684 electric field Effects 0.000 description 1
• 230000005672 electromagnetic field Effects 0.000 description 1
• 230000001939 inductive effect Effects 0.000 description 1
• 238000010422 painting Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000005507 spraying Methods 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1
• 229910000859 α-Fe Inorganic materials 0.000 description 1

Cited By (5)