DE10235007B4 - Halbleitervorrichtung mit einem Halbleiterchip und einem Leitersubstrat, die miteinander über Kontaktierungsflächen und Leiterbahnen verbunden sind, ohne dass die Kontaktierungsflächen kurzgeschlossen sind - Google Patents
Halbleitervorrichtung mit einem Halbleiterchip und einem Leitersubstrat, die miteinander über Kontaktierungsflächen und Leiterbahnen verbunden sind, ohne dass die Kontaktierungsflächen kurzgeschlossen sind Download PDFInfo
- Publication number
- DE10235007B4 DE10235007B4 DE2002135007 DE10235007A DE10235007B4 DE 10235007 B4 DE10235007 B4 DE 10235007B4 DE 2002135007 DE2002135007 DE 2002135007 DE 10235007 A DE10235007 A DE 10235007A DE 10235007 B4 DE10235007 B4 DE 10235007B4
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- contacting surfaces
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- semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001361194A JP2003163239A (ja) | 2001-11-27 | 2001-11-27 | 半導体装置、半導体チップの支持部材及び電気接続用部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10235007A1 DE10235007A1 (de) | 2003-06-12 |
DE10235007B4 true DE10235007B4 (de) | 2005-03-10 |
Family
ID=19171895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2002135007 Expired - Fee Related DE10235007B4 (de) | 2001-11-27 | 2002-07-31 | Halbleitervorrichtung mit einem Halbleiterchip und einem Leitersubstrat, die miteinander über Kontaktierungsflächen und Leiterbahnen verbunden sind, ohne dass die Kontaktierungsflächen kurzgeschlossen sind |
Country Status (4)
Country | Link |
---|---|
US (1) | US20030098506A1 (de) |
JP (1) | JP2003163239A (de) |
KR (1) | KR20030043599A (de) |
DE (1) | DE10235007B4 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1791180B1 (de) * | 2004-07-26 | 2012-09-05 | Rambus Inc. | Halbleiterbauelement |
US7683480B2 (en) * | 2006-03-29 | 2010-03-23 | Freescale Semiconductor, Inc. | Methods and apparatus for a reduced inductance wirebond array |
KR101185886B1 (ko) * | 2007-07-23 | 2012-09-25 | 삼성전자주식회사 | 유니버설 배선 라인들을 포함하는 반도체 칩, 반도체패키지, 카드 및 시스템 |
US10411954B2 (en) * | 2015-10-13 | 2019-09-10 | International Business Machines Corporation | Pattern based network configuration |
JP7177974B2 (ja) * | 2019-02-26 | 2022-11-25 | Toa株式会社 | 音響滴下除去装置及び音響滴下除去方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734753A (en) * | 1985-04-01 | 1988-03-29 | American Telephone And Telegraph Company | Thermocompression bonding of copper leads to a metallized ceramic substrate |
US6052286A (en) * | 1997-04-11 | 2000-04-18 | Texas Instruments Incorporated | Restrained center core anisotropically conductive adhesive |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995028005A2 (en) * | 1994-04-07 | 1995-10-19 | Vlsi Technology, Inc. | Staggered pad array |
US5444303A (en) * | 1994-08-10 | 1995-08-22 | Motorola, Inc. | Wire bond pad arrangement having improved pad density |
US5734559A (en) * | 1996-03-29 | 1998-03-31 | Intel Corporation | Staggered bond finger design for fine pitch integrated circuit packages |
JPH10255925A (ja) * | 1997-03-11 | 1998-09-25 | Canon Inc | 接続装置 |
JP3493118B2 (ja) * | 1997-07-25 | 2004-02-03 | 沖電気工業株式会社 | 半導体素子及び半導体装置 |
US6034426A (en) * | 1997-10-30 | 2000-03-07 | Hewlett-Packard Co. | Testable low inductance integrated circuit package |
US5971771A (en) * | 1998-04-03 | 1999-10-26 | Faragi; Eric Joseph | Component to substrate connection and display assembly using same |
JPH11297754A (ja) * | 1998-04-07 | 1999-10-29 | Seiko Epson Corp | 基 板 |
JP2000183486A (ja) * | 1998-12-16 | 2000-06-30 | Internatl Business Mach Corp <Ibm> | 接続部材 |
KR100402871B1 (ko) * | 1999-03-31 | 2003-10-22 | 세이코 엡슨 가부시키가이샤 | 전극의 접속 방법 및 협 피치용 커넥터, 피치 변환 장치,마이크로 머신, 압전 엑추에이터, 정전 엑추에이터, 잉크젯 헤드, 잉크 젯 프린터, 액정 장치, 전자 기기 |
-
2001
- 2001-11-27 JP JP2001361194A patent/JP2003163239A/ja active Pending
-
2002
- 2002-05-15 US US10/144,729 patent/US20030098506A1/en not_active Abandoned
- 2002-07-31 DE DE2002135007 patent/DE10235007B4/de not_active Expired - Fee Related
- 2002-07-31 KR KR1020020045176A patent/KR20030043599A/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734753A (en) * | 1985-04-01 | 1988-03-29 | American Telephone And Telegraph Company | Thermocompression bonding of copper leads to a metallized ceramic substrate |
US6052286A (en) * | 1997-04-11 | 2000-04-18 | Texas Instruments Incorporated | Restrained center core anisotropically conductive adhesive |
Also Published As
Publication number | Publication date |
---|---|
US20030098506A1 (en) | 2003-05-29 |
DE10235007A1 (de) | 2003-06-12 |
KR20030043599A (ko) | 2003-06-02 |
JP2003163239A (ja) | 2003-06-06 |
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Legal Events
Date | Code | Title | Description |
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OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |