DE10221214A1 - Chipmodul - Google Patents

Chipmodul

Info

Publication number
DE10221214A1
DE10221214A1 DE10221214A DE10221214A DE10221214A1 DE 10221214 A1 DE10221214 A1 DE 10221214A1 DE 10221214 A DE10221214 A DE 10221214A DE 10221214 A DE10221214 A DE 10221214A DE 10221214 A1 DE10221214 A1 DE 10221214A1
Authority
DE
Germany
Prior art keywords
chip
carrier element
chip module
module according
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10221214A
Other languages
German (de)
English (en)
Inventor
Stefan Dohse
Joerg Zander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Priority to DE10221214A priority Critical patent/DE10221214A1/de
Publication of DE10221214A1 publication Critical patent/DE10221214A1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G06K19/0704—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery the battery being rechargeable, e.g. solar batteries
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Credit Cards Or The Like (AREA)
DE10221214A 2002-05-13 2002-05-13 Chipmodul Ceased DE10221214A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10221214A DE10221214A1 (de) 2002-05-13 2002-05-13 Chipmodul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10221214A DE10221214A1 (de) 2002-05-13 2002-05-13 Chipmodul

Publications (1)

Publication Number Publication Date
DE10221214A1 true DE10221214A1 (de) 2003-11-27

Family

ID=29285335

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10221214A Ceased DE10221214A1 (de) 2002-05-13 2002-05-13 Chipmodul

Country Status (1)

Country Link
DE (1) DE10221214A1 (ms)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2073154A1 (en) * 2007-12-20 2009-06-24 Gemalto SA Biometric micro-module
EP2842079B1 (en) 2012-04-24 2016-06-01 Zwipe AS Method of manufacturing an electronic card
WO2017093514A1 (en) * 2015-12-04 2017-06-08 Zwipe As Fingerprint card
WO2018111174A1 (en) * 2016-12-15 2018-06-21 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US10762322B2 (en) 2009-12-29 2020-09-01 Idex Biometrics Asa Fingerprint sensor including a substrate defining a ledge with contact points for incorporation into a smartcard
US11023702B2 (en) 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
EP3939084A4 (en) * 2019-03-11 2023-01-11 Ellipse World, Inc. PACKAGED ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS
US11610429B2 (en) 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
EP4232949A4 (en) * 2020-10-23 2024-03-27 Visa Int Service Ass INTEGRATED BIOMETRIC SENSOR AND MEMORY FOR BIOMETRIC CARD

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
DE19645067A1 (de) * 1996-10-09 1998-05-07 Pav Card Gmbh Verfahren und Verbindungsanordnung zum Herstellen einer Chipkarte
DE19735170A1 (de) * 1997-08-13 1998-09-10 Siemens Ag Chipmodul, insbesondere für kontaktbehaftete Chipkarten, mit nebeneinander angeordneten Chips
DE19737565A1 (de) * 1997-08-28 1999-03-04 Etr Elektronik Und Technologie Chipkarte, bestehend aus einem Kartenkörper, mit wenigstens einem elektronischen Chip, Kontaktfeld mit Kontakten und/oder Spulen
WO2000014677A1 (en) * 1998-09-03 2000-03-16 Qdos Media Limited Smart card
EP1102316A1 (de) * 1999-11-16 2001-05-23 Infineon Technologies AG Multi-Chip IC-Karte mit Bus-Struktur
DE19958333A1 (de) * 1999-12-03 2001-06-07 Bartels Mikrotechnik Gmbh Speicherkarte mit nichtflüchtiger Anzeige
EP1152368A1 (de) * 2000-05-05 2001-11-07 Infineon Technologies AG Chipkarte
DE10107179A1 (de) * 2001-02-15 2002-09-12 Infineon Technologies Ag Chipkartenmodul

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
DE19645067A1 (de) * 1996-10-09 1998-05-07 Pav Card Gmbh Verfahren und Verbindungsanordnung zum Herstellen einer Chipkarte
DE19735170A1 (de) * 1997-08-13 1998-09-10 Siemens Ag Chipmodul, insbesondere für kontaktbehaftete Chipkarten, mit nebeneinander angeordneten Chips
DE19737565A1 (de) * 1997-08-28 1999-03-04 Etr Elektronik Und Technologie Chipkarte, bestehend aus einem Kartenkörper, mit wenigstens einem elektronischen Chip, Kontaktfeld mit Kontakten und/oder Spulen
WO2000014677A1 (en) * 1998-09-03 2000-03-16 Qdos Media Limited Smart card
EP1102316A1 (de) * 1999-11-16 2001-05-23 Infineon Technologies AG Multi-Chip IC-Karte mit Bus-Struktur
DE19958333A1 (de) * 1999-12-03 2001-06-07 Bartels Mikrotechnik Gmbh Speicherkarte mit nichtflüchtiger Anzeige
EP1152368A1 (de) * 2000-05-05 2001-11-07 Infineon Technologies AG Chipkarte
DE10107179A1 (de) * 2001-02-15 2002-09-12 Infineon Technologies Ag Chipkartenmodul

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2073154A1 (en) * 2007-12-20 2009-06-24 Gemalto SA Biometric micro-module
US10762322B2 (en) 2009-12-29 2020-09-01 Idex Biometrics Asa Fingerprint sensor including a substrate defining a ledge with contact points for incorporation into a smartcard
EP2842079B1 (en) 2012-04-24 2016-06-01 Zwipe AS Method of manufacturing an electronic card
WO2017093514A1 (en) * 2015-12-04 2017-06-08 Zwipe As Fingerprint card
WO2018111174A1 (en) * 2016-12-15 2018-06-21 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US20180174018A1 (en) * 2016-12-15 2018-06-21 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
CN108229340A (zh) * 2016-12-15 2018-06-29 指纹卡有限公司 指纹感测模块及其制造方法、智能卡及其制造方法
US10395164B2 (en) 2016-12-15 2019-08-27 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11023702B2 (en) 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11610429B2 (en) 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
EP3939084A4 (en) * 2019-03-11 2023-01-11 Ellipse World, Inc. PACKAGED ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS
EP4232949A4 (en) * 2020-10-23 2024-03-27 Visa Int Service Ass INTEGRATED BIOMETRIC SENSOR AND MEMORY FOR BIOMETRIC CARD

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: SAGEM ORGA GMBH, 33104 PADERBORN, DE

8110 Request for examination paragraph 44
R082 Change of representative

Representative=s name: RICHARDT PATENTANWAELTE, DE

Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE

R081 Change of applicant/patentee

Owner name: MORPHO CARDS GMBH, DE

Free format text: FORMER OWNER: SAGEM ORGA GMBH, 33106 PADERBORN, DE

Effective date: 20111220

R082 Change of representative

Representative=s name: RICHARDT PATENTANWAELTE PART GMBB, DE

Effective date: 20111220

Representative=s name: RICHARDT PATENTANWAELTE PARTG MBB, DE

Effective date: 20111220

Representative=s name: RICHARDT PATENTANWAELTE GBR, DE

Effective date: 20111220

Representative=s name: RICHARDT PATENTANWAELTE, DE

Effective date: 20111220

Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE

R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final

Effective date: 20140304