DE10221214A1 - Integrated circuit module is embedded into a plastic smart card and has interconnected chips on a common carrier set into protective material - Google Patents

Integrated circuit module is embedded into a plastic smart card and has interconnected chips on a common carrier set into protective material

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Publication number
DE10221214A1
DE10221214A1 DE10221214A DE10221214A DE10221214A1 DE 10221214 A1 DE10221214 A1 DE 10221214A1 DE 10221214 A DE10221214 A DE 10221214A DE 10221214 A DE10221214 A DE 10221214A DE 10221214 A1 DE10221214 A1 DE 10221214A1
Authority
DE
Germany
Prior art keywords
chip
carrier element
chip module
module according
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10221214A
Other languages
German (de)
Inventor
Stefan Dohse
Joerg Zander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Priority to DE10221214A priority Critical patent/DE10221214A1/en
Publication of DE10221214A1 publication Critical patent/DE10221214A1/en
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G06K19/0704—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery the battery being rechargeable, e.g. solar batteries
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The embedded electronic unit is set into a card and has a carrier (2) and on this is the integrated circuit processor and memory chip (6). An additional electronic module (5) is set into the carrier . Interconnections are made by bond wires that also connect with the contact pads (7). The electronics are set into a protective resin mass (9).

Description

Die Erfindung betrifft ein Chipmodul zum Einbau in eine Chipkarte mit den im Gattungsbegriff des Anspruches 1 aufgeführten Merkmalen. The invention relates to a chip module for installation in a chip card with the im Generic term of claim 1 features listed.

Chipmodule der genannten Art werden zur Speicherung und Bearbeitung von Informationen in Chipkarten eingesetzt, welche wiederum in vielfältiger Ausgestaltung, beispielsweise als Bankkarten, Zugangsberechtigungskarten, Identifizierungskarten oder dergleichen in zahlreichen Bereichen des täglichen Lebens verwendet werden. Da die Anwendungsbereiche für derartige Chipkarten zunehmend vielfältiger werden, steigen somit auch die Anforderungen sowohl an die Rechen- und Speicherkapazitäten der Chipmodule im Allgemeinen als auch an zusätzliche Bauelemente der Chipkarten, die zur Erfüllung dieser Anforderungen in diese implantiert werden. Genannt seien an dieser Stelle beispielsweise Spannungsquellen, Displays oder zusätzliche elektronische Bauelemente zur eindeutigen Identifizierung des berechtigten Chipkartenbenutzers. Chip modules of the type mentioned are used for the storage and processing of Information used in chip cards, which in turn comes in many different forms Design, for example as bank cards, access authorization cards, Identification cards or the like in numerous areas of the used in everyday life. Because the application areas for such Chip cards are becoming increasingly diverse, so are they increasing Requirements for both the computing and storage capacities of the chip modules in general as well as to additional components of the chip cards that are used for Compliance with these requirements can be implanted in them. Be mentioned At this point, for example, voltage sources, displays or additional ones electronic components for clear identification of the authorized Smart card user.

Aus dem Stand der Technik sind hierzu bereits Chipkarten bekannt, die die genannten Bauteile neben den üblichen Chipmodulen zusätzlich in anderen Sektoren des Chipkartenkörpers aufweisen. Die getrennte Anordnung von Chipmodulen und zusätzlichen Bauelementen erfordert für den Herstellprozess derartiger Chipkarten zusätzliche Arbeitsschritte, beispielsweise für die Implantierung derartiger Bauelemente in den Chipkartenkörper und für die elektronische Verbindung zwischen Chipmodul und den zusätzlich implantierten Bauteilen. In diesem Zusammenhang sind für eine richtige und dauerhafte Verbindung der Bauelemente untereinander besonders hohe Anforderungen an die Maßhaltigkeit des Kartenkörpers zu stellen. Die Lage der zusätzlichen Bauteile zum Chipmodul muss in allen Richtungen reproduzierbar sein, um das Herstellen der elektrischen Verbindung zu gewährleisten. Dabei ist besonders die Höhenlage der elektrischen Anschlüsse entscheidend für die Kontaktierung. Chip cards are already known from the prior art for this purpose mentioned components in addition to the usual chip modules in other Have sectors of the chip card body. The separate arrangement of Chip modules and additional components required for the Manufacturing process of such chip cards additional work steps, for example for the implantation of such components in the chip card body and for the electronic connection between the chip module and the additional implanted components. In this regard, are correct and permanent connection of the components to each other particularly high To make demands on the dimensional accuracy of the card body. The location The additional components to the chip module must be in all directions be reproducible in order to establish the electrical connection guarantee. The height of the electrical connections is particularly important crucial for contacting.

Aufgabe der vorliegenden Erfindung ist es daher, ein Chipmodul zum Einbau in Chipkarten bereitzustellen, welches die Herstellung der mit derartigen Chipmodulen ausgerüsteten Chipkarten einfacher und kostengünstiger macht. Gleichzeitig sollen die herkömmlich verwendeten Chipmodule den gestiegenen Anforderungen hinsichtlich der Vielseitigkeit der Anwendungen gerecht werden. The object of the present invention is therefore to install a chip module to provide in smart cards, which the manufacture of such Chip modules equipped chip cards easier and cheaper makes. At the same time, the conventionally used chip modules should increased requirements regarding the versatility of the applications satisfy.

Die genannten Aufgaben werden für die eingangs geschilderten gattungsgemäßen Chipmodule durch die im kennzeichnenden Teil des Hauptanspruches genannte technische Lehre gelöst. Kern dieser Lehre ist es, das plattenförmige Trägerelement, welches mindestens an einer seiner Flachseiten mit einem elektronischen IC-Rechen- und Speicherbaustein (Chip) versehen ist und ein aus mehreren Kontaktflächen bestehendes, an der dem Rechen- und Speicherbaustein abgewandten Flachseite des Trägerelementes angeordnetes Kontaktfeld besitzt, erfindungsgemäß mit mindestens einem zusätzlichen elektronischen Bauteil zu versehen. The tasks mentioned are for those described at the beginning Generic chip modules by the in the characterizing part of Main teaching called technical teaching solved. The core of this teaching is that plate-shaped carrier element, which at least on one of its Flat pages with an electronic IC computing and memory module (chip) is provided and a consisting of several contact surfaces on which the Flat side of the computing and memory module facing away from the Carrier element arranged contact field, according to the invention with to provide at least one additional electronic component.

Durch die Integration des elektronischen Bauteiles in das Chipmodul wird eine einzige Baugruppe gebildet, welche in einem einzigen auch bislang üblichen Arbeitsschritt als Gesamtchipmodul in die Chipkarte eingesetzt werden kann. Der Chipkartenkörper braucht dabei nicht für das Kontaktieren zweier nacheinander einzusetzender Bauteile vorbereitet zu werden. Elektrische Verbindungen zwischen Chipmodul und dem zusätzlichen elektronischen Bauteil werden in einem gesonderten Arbeitsschritt vor dem eigentlichen Implantiervorgang hergestellt, was in Bezug auf die Händelung wesentlich einfacher ist als die Kontaktierung der Bauteile nach deren Implantierung in den Chipkartenkörper. By integrating the electronic component into the chip module formed a single assembly, which so far in a single usual work step can be used as a total chip module in the chip card can. The chip card body does not need to contact two components to be used one after the other. electrical Connections between the chip module and the additional electronic Components are made in a separate step before the actual one Implantation process made, which is essential in terms of trading is easier than contacting the components after their implantation in the chip card body.

Als elektronische Bauteile sind dabei alphanumerische Displays oder Displays mit einzelnen Leuchtdioden denkbar, welche in einer Aussparung des Trägerelementes angeordnet sind. Darüber hinaus lassen sich Chipmodule mit Solarzellen versehen, welche ebenfalls in einer Aussparung des Trägerelementes angeordnet werden. Alternativ hierzu verwendete Spannungsquellen, wie beispielsweise Batterien oder Akkus können ebenfalls zusätzlich zum Chipmodul auf dem Trägerelement angeordnet werden. Alphanumeric displays or are electronic components Displays with individual light-emitting diodes are conceivable, which are in a recess of the carrier element are arranged. Beyond that Chip modules with solar cells, which also in a recess of the Carrier element are arranged. Alternatively used Voltage sources such as batteries or rechargeable batteries can also be used can be arranged in addition to the chip module on the carrier element.

Eine besonders vorteilhafte Ausgestaltung des erfindungsgemäßen Chipmoduls sieht darüber hinaus vor, als elektronisches Bauteil auf dem Trägerelement einen Fingerprintsensor anzuordnen, welcher in einer Aussparung des Trägerelementes angeordnet wird. Mit Hilfe dieses Fingerprintsensors lässt sich eine Identifikation des Chipkartennutzers herbeiführen, so dass die missbräuchliche Nutzung der Chipkarte unterbunden werden kann. A particularly advantageous embodiment of the invention Chip module also provides for an electronic component on the Arrange a fingerprint sensor carrier element, which in a recess the support element is arranged. With the help of this fingerprint sensor identification of the chip card user can be brought about so that the improper use of the chip card can be prevented.

Der Speicher- und Rechenbaustein bildet hierbei mit dem Fingerprintsensor eine kompakte Baueinheit und kann nach seiner separaten Herstellung problemlos in die bereits bekannte Produktion von Chipmodulen eingebunden werden. Die Herstellung derartiger Chipmodule sieht hierbei vor, dass die einzelnen Trägerelemente in Form eines dünnen Kunststoffbandes zusammengefasst sind, auf welches einseitig beispielsweise durch einen Ätzprozess das aus einzelnen Kontaktflächen bestehende Kontaktfeld aufgebracht wird. Auf der dem Kontaktfeld abgewandten Flachseite des Modulbandes werden die Chips aufgesetzt und durch Bohrungen im Trägerelement beispielsweise mittels Bonddrähten mit den einzelnen Kontaktflächen des Kontaktfeldes verbunden. The memory and computing module forms here with the fingerprint sensor a compact unit and after its separate manufacture easily in the already known production of chip modules be involved. The manufacture of such chip modules here provides that the individual support elements in the form of a thin plastic band are summarized, on which one side, for example, by a Etching process the contact field consisting of individual contact areas is applied. On the flat side of the Module tape, the chips are placed and through holes in the Carrier element, for example by means of bond wires with the individual Contact areas of the contact field connected.

Für die erfindungsgemäße technische Lehre ist hierbei wesentlich, dass das Trägerelement mittig zwischen den Kontaktflächen des Kontaktfeldes oder benachbart des Kontaktfeldes eine Aussparung aufweist, in die entsprechend einer vorteilhaften Ausgestaltung das zusätzliche elektronische Bauteil in Form des Fingerprintsensors eingesetzt wird. Der Fingerprintsensor kann dabei mit einem von außen sichtbaren optischen Signalelement gekoppelt oder versehen sein wie beispielsweise mit einem Leuchtdiodenelement, welches eine Rückmeldung an den Chipkartenbenutzer gibt, ob sein Fingerabdruck erkannt oder als zulässig eingestuft worden ist. It is essential for the technical teaching according to the invention that the Carrier element in the middle between the contact surfaces of the contact field or has a recess adjacent to the contact field, in the corresponding an advantageous embodiment, the additional electronic component in Form of the fingerprint sensor is used. The fingerprint sensor can coupled with an optical signal element visible from the outside or be provided such as with a light emitting diode element, which gives feedback to the smart card user whether or not Fingerprint has been recognized or classified as permissible.

Die Fixierung am Trägerelement kann beispielsweise durch Verkleben erfolgen. Die elektrische Verbindung zwischen Fingerprintsensor und Chip erfolgt dabei analog der Verbindung zwischen Chip und Kontaktflächen mittels Bonddrähten. Da diese Bonddrähte gegen mechanische Beanspruchungen sehr empfindlich sind, wird nach der elektrischen Verbindung zwischen Chip, Kontaktflächen und Fingerprintsensor die mit den elektronischen Bauteilen versehene Rückseite des Trägerelementes mit einer Vergussmasse überdeckt, die in ihrem Inneren sowohl die Bonddrähte als auch die elektronischen Bauelemente aufnimmt und somit gegen mechanische Beanspruchungen im Rahmen des weiteren Herstellungsprozesses der Chipkarten schützt. Nach dem Bestücken der einzelnen Trägerelemente des Modulbandes werden die genannten Trägerelemente vereinzelt und können danach als fertige Chipmodule in vorbereitete Chipkartenkörper implantiert werden. Die Chipkartenkörper können dabei durch einen Laminationsprozess, durch Gießen oder Spritzgießen hergestellt sein. The fixation on the carrier element can for example by gluing respectively. The electrical connection between the fingerprint sensor and the chip is made analogous to the connection between the chip and the contact surfaces Bond wires. Because these bond wires against mechanical stress are very sensitive, after the electrical connection between the chip, Contact areas and fingerprint sensor with the electronic components provided back of the carrier element with a potting compound that covers both the bond wires and the inside records electronic components and thus against mechanical Stresses in the further manufacturing process of the chip cards protects. After equipping the individual carrier elements of the The above-mentioned carrier elements are isolated and can be used as a module belt then implanted as finished chip modules in prepared chip card bodies become. The chip card body can by a Lamination process, be made by casting or injection molding.

Im Folgenden werden zwei Ausführungsbeispiele des Gegenstandes der Erfindung anhand der beigefügten Zeichnungen näher erläutert. In the following two embodiments of the subject of Invention explained with reference to the accompanying drawings.

Es zeigt: It shows:

Fig. 1 eine Draufsicht auf ein erfindungsgemäßes Chipmodul entsprechend einer ersten Ausgestaltungsvariante des Gegenstandes der Erfindung, Fig. 1 is a plan view of an inventive chip module according to a first embodiment variant of the object of the invention,

Fig. 2 eine Querschnittsdarstellung durch das Chipmodul entsprechend der Fig. 1, Fig. 2 is a cross sectional view through the chip module according to the Fig. 1,

Fig. 3 die Draufsicht auf ein erfindungsgemäßes Chipmodul entsprechend einer weiteren Ausgestaltungsvariante und Fig. 3 shows the top view of an inventive chip module according to a further variant embodiment, and

Fig. 4 eine Querschnittsdarstellung durch das Chipmodul entsprechend Fig. 3. Fig. 4 is a cross sectional view through the chip module according to FIG. 3.

Das in der Fig. 1 in der Draufsicht dargestellte in seiner Gesamteinheit mit 1 bezeichnete Chipmodul besitzt ein Trägerelement 2 mit plattenförmiger Gestalt und rechteckigem bzw. annähernd quadratischem Grundriss. Auf einer Flachseite des Trägerelementes 2 ist ein aus acht Kontaktflächen 3 bestehendes Kontaktfeld angeordnet. Die Kontaktflächen 3 bestehen aus einer dünnen Metallschicht, vorzugsweise aus Kupfer, die durch einen geeigneten Auftragsprozess auf das Kunststoffmaterial des Trägerelementes 2 aufgebracht worden ist. The chip module shown in FIG. 1 in the top view, designated 1 in its entire unit, has a carrier element 2 with a plate-like shape and a rectangular or approximately square plan. A contact field consisting of eight contact surfaces 3 is arranged on a flat side of the carrier element 2 . The contact surfaces 3 consist of a thin metal layer, preferably of copper, which has been applied to the plastic material of the carrier element 2 by a suitable application process.

Wie aus der Fig. 1 ersichtlich ist, besitzt das Trägerelement 2 mittig zwischen den Kontaktflächen 3 eine Ausnehmung 4, in die ein zusätzliches elektronisches Bauteil, im vorliegenden Ausführungsbeispiel ein Fingerprintsensor 5 eingesetzt ist. Auf der den Kontaktflächen 3 abgewandten Unterseite des Trägerelementes 2 befindet sich ein elektronischer Speicher- und Rechenbaustein 6, welcher üblicherweise als Chip bezeichnet wird. Der Chip 6 besitzt eine Mehrzahl von elektrischen Anschlüssen, welche mittels so genannter Bonddrähte sowohl mit dem Fingerprintsensor 5 als auch mit den Kontaktflächen 3 verbunden sind. As can be seen from FIG. 1, the carrier element 2 has a recess 4 in the center between the contact surfaces 3 , into which an additional electronic component, in the present exemplary embodiment a fingerprint sensor 5 , is inserted. On the underside of the carrier element 2 facing away from the contact surfaces 3 there is an electronic memory and computing module 6 , which is usually referred to as a chip. The chip 6 has a plurality of electrical connections which are connected to the fingerprint sensor 5 as well as to the contact areas 3 by means of so-called bond wires.

Wie insbesondere aus der Fig. 2 hervorgeht, sind für die Kontaktierung des Chips 6 mit den Kontaktflächen 3 innerhalb des Trägerelementes 2 Bohrungen 7 ausgespart, durch die die Bonddrähte 8 hindurchgeführt sind. Ist der Fingerprintsensor 5 und der Chip 6 am Trägerelement 2 festgelegt und sind anschließend die elektrischen Verbindungen mit Hilfe der Bonddrähte 6 geschaffen, so wird in einem abschließenden Herstellschritt für das Chipmodul 1 die den Kontaktflächen abgewandte Rückseite des Trägerelementes mit einer Vergussmasse 9 überdeckt, die Fingerprintsensor 5, Chip 6 und sämtliche elektrische Verbindungen in ihrem Inneren aufnimmt und gegen mechanische Beschädigungen zuverlässig abschottet. As can be seen in particular from FIG. 2, for the contacting of the chip 6 with the contact surfaces 3 within the carrier element 2, holes 7 are left through which the bonding wires 8 are passed. If the fingerprint sensor 5 and the chip 6 are fixed on the carrier element 2 and then the electrical connections are made with the aid of the bonding wires 6 , then in a final manufacturing step for the chip module 1 the back of the carrier element facing away from the contact surfaces is covered with a sealing compound 9 , the fingerprint sensor 5 , chip 6 and all electrical connections inside and reliably insulates against mechanical damage.

In den Fig. 3 und 4 ist eine alternative Ausführungsvariante des erfindungsgemäßen Chipmoduls 1 dargestellt. Hierbei ist das Trägerelement 2 ebenfalls plattenförmig ausgeführt und weist eine im Wesentlichen rechteckförmige Gestalt auf. An einer Flachseite des Trägerelementes 2 sind neun Kontaktflächen 3 angeordnet, die analog der Ausführung der Fig. 1 und 2 beispielsweise als Kupferbeschichtung hergestellt sein können. Neben dem durch die Kontaktflächen 3 gebildeten Kontaktfeld ist in diesem Ausführungsbeispiel eine Ausnehmung 4 des Trägerelementes 2 vorgesehen, in welche wiederum ein zusätzliches elektronisches Bauteil in Form eines Fingerprintsensors 5 eingesetzt ist. An der den Kontaktflächen 3 abgewandten unteren Flachseite des Trägerelementes 2 befindet sich etwa in der Mitte des durch die Kontaktflächen gebildeten Kontaktfeldes ein elektronischer IC- Rechen- und Speicherbaustein - auch als Chip 6 - bezeichnet. Der Chip 6 ist über so genannte Bonddrähte sowohl mit den einzelnen Kontaktflächen 3 an der Oberseite des Trägerelementes 2 als auch mit dem seitlich angeordneten Fingerprintsensor 5 verbunden. Die Verbindung zwischen Chip 6 und Kontaktflächen 3 erfolgt mit Hilfe der Bonddrähte durch Bohrungen 7 im Trägerelement 2. Um die empfindliche Verdrahtung an der Unterseite des Trägerelementes 6 gegen mechanische Überbeanspruchungen bzw. Beschädigungen zu schützten wird in Analogie der Beschreibung des Beispieles der Fig. 1 und 2 die Rückseite des Trägerelementes 2 ebenfalls mit einer Vergussmasse 9 überdeckt, in welche Bonddrähte 8, Chip 6 sowie Fingerprintsensor 5 aufgenommen sind, so dass sich eine kompakte Baueinheit bildet, welche als Gesamtbauteil in die dafür vorgesehene Ausnehmung 10 eines Chipkartenkörpers 11 eingesetzt werden kann. Die Ausnehmung 10 sowie der Chipkartenkörper 11 sind in der Darstellung der Fig. 4 und 2 schematisch strichpunktiert dargestellt. Bezugszeichenliste 1 Chipmodul
2 Trägerelement
3 Kontaktfläche
4 Ausnehmung
5 Fingerprintsensor
6 Chip
7 Bohrung
8 Bonddraht
9 Vergussmasse
10 Ausnehmung
11 Chipkartenkörper
In FIGS. 3 and 4 an alternative embodiment of the chip module 1 according to the invention. Here, the carrier element 2 is also plate-shaped and has an essentially rectangular shape. On a flat side of the carrier element 2 , nine contact surfaces 3 are arranged, which can be produced analogously to the embodiment of FIGS. 1 and 2, for example as a copper coating. In addition to the contact field formed by the contact surfaces 3 , a recess 4 of the carrier element 2 is provided in this exemplary embodiment, in which an additional electronic component in the form of a fingerprint sensor 5 is in turn inserted. On the lower flat side of the carrier element 2 facing away from the contact surfaces 3 there is an electronic IC computing and memory module - also referred to as a chip 6 - approximately in the middle of the contact field formed by the contact surfaces. The chip 6 is connected via so-called bond wires both to the individual contact areas 3 on the upper side of the carrier element 2 and to the fingerprint sensor 5 arranged on the side. The connection between chip 6 and contact areas 3 takes place with the aid of the bond wires through bores 7 in the carrier element 2 . In order to protect the sensitive wiring on the underside of the carrier element 6 against mechanical overloading or damage, the rear of the carrier element 2 is also covered with a potting compound 9 , in analogy to the description of the example in FIGS. 1 and 2, into which bonding wires 8 , chip 6 and fingerprint sensor 5 are included, so that a compact structural unit is formed, which can be inserted as an overall component in the recess 10 provided for this purpose in a chip card body 11 . The recess 10 and the chip card body 11 are shown schematically in broken lines in the illustration in FIGS. 4 and 2. LIST OF REFERENCES 1 chip module
2 support element
3 contact surface
4 recess
5 fingerprint sensor
6 chip
7 hole
8 bond wire
9 potting compound
10 recess
11 chip card body

Claims (9)

1. Chipmodul zum Einbau in eine Chipkarte mit einem plattenförmigen Trägerelement (2), mindestens einem an einer der Flachseiten des Trägerelementes (2) festgelegten, elektronischen IC-Rechen- und Speicherbaustein (Chip) (6) und einem aus mehreren Kontaktflächen (3) bestehenden, an der dem Rechen- und Speicherbaustein (6) abgewandten Flachseite des Trägerelementes (2) angeordneten Kontaktfeld dadurch gekennzeichnet, dass das Trägerelement (2) mindestens ein zusätzliches elektronisches Bauteil (5) aufweist. 1. Chip module for installation in a chip card with a plate-shaped carrier element ( 2 ), at least one electronic IC computing and memory module (chip) ( 6 ) fixed on one of the flat sides of the carrier element ( 2 ) and one of several contact surfaces ( 3 ) Existing contact field arranged on the flat side of the carrier element ( 2 ) facing away from the computing and memory module ( 6 ), characterized in that the carrier element ( 2 ) has at least one additional electronic component ( 5 ). 2. Chipmodul nach Anspruch 1, dadurch gekennzeichnet, dass das zusätzliche elektronische Bauteil (5) ein Display ist, welches in einer Ausnehmung (4) des Trägerelementes (5) angeordnet ist. 2. Chip module according to claim 1, characterized in that the additional electronic component ( 5 ) is a display which is arranged in a recess ( 4 ) of the carrier element ( 5 ). 3. Chipmodul nach Anspruch 1, dadurch gekennzeichnet, dass das zusätzliche elektronische Bauteil (5) eine Solarzelle ist, welche in einer Aussparung (5) des Trägerelementes (2) angeordnet ist. 3. Chip module according to claim 1, characterized in that the additional electronic component ( 5 ) is a solar cell, which is arranged in a recess ( 5 ) of the carrier element ( 2 ). 4. Chipmodul nach Anspruch 1, dadurch gekennzeichnet, dass das Chipmodul mindestens ein von außen sichtbares optisches Signalelement enthält und dass das zusätzliche elektronische Bauteil (5) eine Spannungsquelle ist. 4. Chip module according to claim 1, characterized in that the chip module contains at least one externally visible optical signal element and that the additional electronic component ( 5 ) is a voltage source. 5. Chipmodul nach Anspruch 1, dadurch gekennzeichnet, dass das zusätzliche elektronische Bauteil (5) ein Fingerprintsensor ist, welcher in einer Ausnehmung (4) des Trägerelementes (2) angeordnet ist. 5. Chip module according to claim 1, characterized in that the additional electronic component ( 5 ) is a fingerprint sensor which is arranged in a recess ( 4 ) of the carrier element ( 2 ). 6. Chipmodul nach Anspruch 5, dadurch gekennzeichnet, dass der Fingerprintsensor mit einem von außen sichtbaren optischen Signalelement zur Funktionsanzeige gekoppelt ist 6. Chip module according to claim 5, characterized in that the fingerprint sensor with an optical that is visible from the outside Signal element is coupled to the function display 7. Chipmodul nach einem der Ansprüche 1, 2, 3, 5 oder 6, dadurch gekennzeichnet, dass die Ausnehmung (4) mittig zwischen den Kontaktflächen (3) des Kontaktfeldes angeordnet ist. 7. Chip module according to one of claims 1, 2, 3, 5 or 6, characterized in that the recess ( 4 ) is arranged centrally between the contact surfaces ( 3 ) of the contact field. 8. Chipmodul nach einem der Ansprüche 1, 2, 3, 5 oder 6, dadurch gekennzeichnet, dass die Ausnehmung (4) seitlich des Kontaktfeldes angeordnet ist. 8. Chip module according to one of claims 1, 2, 3, 5 or 6, characterized in that the recess ( 4 ) is arranged on the side of the contact field. 9. Chipmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass der elektronische Speicher- und Rechenbaustein (6) sowie das zusätzliche elektronische Bauelement (5) von einer Vergussmasse (9) umschlossen ist. 9. Chip module according to one of claims 1 to 8, characterized in that the electronic memory and computing module ( 6 ) and the additional electronic component ( 5 ) is enclosed by a sealing compound ( 9 ).
DE10221214A 2002-05-13 2002-05-13 Integrated circuit module is embedded into a plastic smart card and has interconnected chips on a common carrier set into protective material Ceased DE10221214A1 (en)

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