DE102022124035A1 - Fotoelektrisches Umwandlungsgerät - Google Patents

Fotoelektrisches Umwandlungsgerät Download PDF

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Publication number
DE102022124035A1
DE102022124035A1 DE102022124035.5A DE102022124035A DE102022124035A1 DE 102022124035 A1 DE102022124035 A1 DE 102022124035A1 DE 102022124035 A DE102022124035 A DE 102022124035A DE 102022124035 A1 DE102022124035 A1 DE 102022124035A1
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DE
Germany
Prior art keywords
semiconductor region
photoelectric conversion
conversion device
wiring portion
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102022124035.5A
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German (de)
English (en)
Inventor
Kazuhiro Morimoto
Junji Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE102022124035A1 publication Critical patent/DE102022124035A1/de
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/225Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H04N25/773Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters comprising photon counting circuits, e.g. single photon detection [SPD] or single photon avalanche diodes [SPAD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • H10F77/703Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/95Circuit arrangements
    • H10F77/953Circuit arrangements for devices having potential barriers
    • H10F77/959Circuit arrangements for devices having potential barriers for devices working in avalanche mode

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
DE102022124035.5A 2021-09-22 2022-09-20 Fotoelektrisches Umwandlungsgerät Pending DE102022124035A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021154432A JP7467401B2 (ja) 2021-09-22 2021-09-22 光電変換装置
JP2021-154432 2021-09-22

Publications (1)

Publication Number Publication Date
DE102022124035A1 true DE102022124035A1 (de) 2023-03-23

Family

ID=84817854

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102022124035.5A Pending DE102022124035A1 (de) 2021-09-22 2022-09-20 Fotoelektrisches Umwandlungsgerät

Country Status (7)

Country Link
US (1) US20230097091A1 (https=)
JP (2) JP7467401B2 (https=)
KR (1) KR102857373B1 (https=)
CN (1) CN115911068A (https=)
DE (1) DE102022124035A1 (https=)
GB (1) GB2613061B (https=)
TW (1) TWI901903B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022083067A (ja) * 2020-11-24 2022-06-03 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および撮像装置、並びに電子機器
JP7467401B2 (ja) * 2021-09-22 2024-04-15 キヤノン株式会社 光電変換装置
JP7799488B2 (ja) * 2022-01-01 2026-01-15 キヤノン株式会社 光電変換装置、光電変換システム、および機器
CN117690986B (zh) * 2024-02-01 2024-05-03 云南大学 高温工作单光子探测器、单光子焦平面探测器及制备方法
US12324252B1 (en) * 2024-04-29 2025-06-03 Globalfoundries Singapore Pte. Ltd. Structures including a photodetector and multiple cathode contacts

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190181177A1 (en) 2017-08-04 2019-06-13 Sony Semiconductor Solutions Corporation Solid-state imaging device
US20200286946A1 (en) 2016-09-23 2020-09-10 Apple Inc. Back-Illuminated Single-Photon Avalanche Diode

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10777597B2 (en) * 2017-03-22 2020-09-15 Sony Semiconductor Solutions Corporation Imaging device
US10854658B2 (en) * 2018-07-16 2020-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Image sensor with sidewall protection and method of making same
JP7242234B2 (ja) * 2018-09-28 2023-03-20 キヤノン株式会社 光検出装置、光検出システム
JP2020149987A (ja) * 2019-03-11 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 光検出器
CN113383431B (zh) * 2019-03-19 2025-01-17 索尼半导体解决方案公司 传感器芯片、电子设备和测距装置
JP2020161716A (ja) * 2019-03-27 2020-10-01 キヤノン株式会社 光電変換装置、光電変換システム、および移動体
CN117080233A (zh) * 2019-03-29 2023-11-17 索尼半导体解决方案公司 固态摄像装置和电子设备
JP7445397B2 (ja) * 2019-07-31 2024-03-07 ソニーセミコンダクタソリューションズ株式会社 受光素子および電子機器
TWI867078B (zh) * 2019-11-19 2024-12-21 日商索尼半導體解決方案公司 固態攝像裝置及電子機器
JP2022096830A (ja) * 2020-12-18 2022-06-30 ソニーセミコンダクタソリューションズ株式会社 光検出器および電子機器
JP2022113371A (ja) * 2021-01-25 2022-08-04 ソニーセミコンダクタソリューションズ株式会社 光検出装置
JP2023002152A (ja) * 2021-06-22 2023-01-10 キヤノン株式会社 光電変換装置、光電変換装置の製造方法
JP7467401B2 (ja) * 2021-09-22 2024-04-15 キヤノン株式会社 光電変換装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200286946A1 (en) 2016-09-23 2020-09-10 Apple Inc. Back-Illuminated Single-Photon Avalanche Diode
US20190181177A1 (en) 2017-08-04 2019-06-13 Sony Semiconductor Solutions Corporation Solid-state imaging device

Also Published As

Publication number Publication date
JP7467401B2 (ja) 2024-04-15
JP2023045838A (ja) 2023-04-03
US20230097091A1 (en) 2023-03-30
TWI901903B (zh) 2025-10-21
KR102857373B1 (ko) 2025-09-11
GB2613061A (en) 2023-05-24
CN115911068A (zh) 2023-04-04
GB202213740D0 (en) 2022-11-02
GB2613061B (en) 2026-04-29
TW202315105A (zh) 2023-04-01
KR20230042641A (ko) 2023-03-29
JP2024083450A (ja) 2024-06-21

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